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公开(公告)号：US08448868B2
公开(公告)日：2013-05-28
申请号：US12940062
申请日：2010-11-05
IPC分类号： G06K19/06
CPC分类号： H01L23/3121 , G06K19/07747 , H01L23/49855 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2924/00014 , H01L2924/1461 , H01L2924/00 , H01L2224/0401
摘要： A smart card module and a method for producing a smart card module are provided. The smart card module comprises a semiconductor chip having a contact side with a plurality of contacts, and a base material with at least one metal layer. The contact side of the semiconductor chip faces the base material and the plurality of contacts of the semiconductor chip are electrically connected to the metal layer. The semiconductor chip and at least a portion of the base material are covered with an encapsulation layer.
摘要翻译： 提供了智能卡模块和用于制造智能卡模块的方法。 智能卡模块包括具有多个触点的接触侧的半导体芯片和具有至少一个金属层的基底材料。 半导体芯片的接触侧面向基材，并且半导体芯片的多个触点电连接到金属层。 半导体芯片和基材的至少一部分被封装层覆盖。
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公开(公告)号：US07694888B2
公开(公告)日：2010-04-13
申请号：US11560058
申请日：2006-11-15
IPC分类号： G06K19/06
CPC分类号： G06K19/077
摘要： A method for producing a contact zone for a chip card has the following steps. A sheet having a first surface and a second surface opposite the first surface. Forming at least one insulating trench, which extends from the first surface to the second surface. A cluster layer is applied to the first surface. The second surface is connected to a carrier element after the cluster layer has been applied to the first surface.
摘要翻译： 用于制造芯片卡的接触区域的方法具有以下步骤。 一种具有与第一表面相对的第一表面和第二表面的片材。 形成从第一表面延伸到第二表面的至少一个绝缘沟槽。 将簇层应用于第一表面。 在将簇层施加到第一表面之后，第二表面连接到载体元件。
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3.发明申请DOCUMENT FOR PERSONAL IDENTIFICATION AND A METHOD FOR PRODUCING A DOCUMENT FOR PERSONAL IDENTIFICATION 有权用于个人身份识别的文档和用于生成用于个人身份识别的文档的方法公开(公告)号：US20100084474A1
公开(公告)日：2010-04-08
申请号：US12570993
申请日：2009-09-30
CPC分类号： G06K19/07749 , B32B38/10 , B32B2305/347 , B32B2425/00 , B32B2519/02 , Y10T156/10
摘要： A document for personal identification, having a chip module including the following components: a chip and a leadframe, wherein the chip is connected to the leadframe, an outer cover, wherein the outer cover is connected to a transponder substrate. A first component of the chip module is connected to the outer cover and a second component of the chip module is connected to the transponder substrate in such a way that, in the case of separation of outer cover and transponder substrate, the first component of the chip module is separated from the second component of the chip module.
摘要翻译： 一种用于个人识别的文档，具有包括以下部件的芯片模块：芯片和引线框架，其中芯片连接到引线框架，外盖，其中外盖连接到应答器基板。 芯片模块的第一部件连接到外盖，并且芯片模块的第二部件以这样的方式连接到应答器基板，使得在分离外盖和应答器基板的情况下，第一部件 芯片模块与芯片模块的第二组件分离。
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公开(公告)号：US20080211087A1
公开(公告)日：2008-09-04
申请号：US11959973
申请日：2007-12-19
IPC分类号： H01L23/053 , H01L21/56
CPC分类号： G06K19/07743 , G06K19/07724 , H01L23/49855 , H01L2224/48091 , H01L2924/00014
摘要： A chip module comprises a substrate, a chip arranged on one side of the substrate and conductor structures arranged on at least one side of the substrate and conductively connected to the chip. At least one stiffening element is arranged on one side of the substrate and a moulding cap encapsulates at least the chip. For producing the chip module, provision is made for providing a substrate and applying conductor structures to at least one side of the substrate. At least one stiffening element is mounted onto one side of the substrate. Furthermore, a chip is mounted onto one side of the substrate and connected to the conductor structures. A moulding compound is applied on the substrate, such that the chip is covered.
摘要翻译： 芯片模块包括衬底，布置在衬底的一侧上的芯片和布置在衬底的至少一侧上并导电连接到芯片的导体结构。 至少一个加强元件布置在基底的一侧上，并且模制帽至少封装了芯片。 为了制造芯片模块，提供用于提供衬底并将导体结构施加到衬底的至少一侧。 至少一个加强元件安装在基板的一侧上。 此外，芯片安装在基板的一侧并连接到导体结构。 将模塑料施加在基材上，使芯片被覆盖。
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公开(公告)号：US20070170564A1
公开(公告)日：2007-07-26
申请号：US11614847
申请日：2006-12-21
IPC分类号： H01L23/02
CPC分类号： H01L23/49855 , G06K19/07745 , G06K19/07747 , H01L23/3121 , H01L23/49827 , H01L24/16 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/48471 , H01L2224/4848 , H01L2224/48599 , H01L2224/48644 , H01L2224/48647 , H01L2224/49171 , H01L2224/73204 , H01L2224/73265 , H01L2224/85181 , H01L2224/85186 , H01L2224/85385 , H01L2224/85444 , H01L2224/85447 , H01L2924/00014 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2924/351 , H01L2224/78 , H01L2924/00 , H01L2224/48247 , H01L2924/00012 , H01L2224/13099 , H01L2224/05599
摘要： A smart card module including a substrate having an upper face and a lower face, contact arrays arranged on the substrate lower face, conductor structures, which have vias arranged in cutouts in the substrate, arranged on the substrate upper face and connected to the contact arrays, a chip having connecting contacts which are electrically conductively connected to the conductor structures, wherein the chip is mounted by a mount on the substrate upper face or on the conductor structures, and an encapsulation, which covers the chip and at least a part of the conductor structures and of the substrate upper face.
摘要翻译： 一种智能卡模块，包括具有上表面和下表面的基板，布置在基板下表面上的接触阵列，布置在基板中的切口中的通孔的导体结构，布置在基板上表面上并连接到接触阵列 ，具有导电连接到导体结构的连接触点的芯片，其中芯片由基板上表面或导体结构上的安装件安装，以及封装，其覆盖芯片和至少一部分 导体结构和基板上表面。
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公开(公告)号：US20140021264A1
公开(公告)日：2014-01-23
申请号：US13552660
申请日：2012-07-19
IPC分类号： G06K19/077 , H01L21/58
CPC分类号： H01L21/4853 , H01L21/4857 , H01L23/3121 , H01L23/49811 , H01L23/49838 , H01L23/4985 , H01L23/49855 , H01L23/49866 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/16238 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48229 , H01L2224/48465 , H01L2224/48472 , H01L2224/49171 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2924/00 , H01L2924/00014 , H01L2924/181 , H01L2924/00012
摘要： In various aspects of the disclosure, a chip card module is provided. The chip card module may include a flexible substrate having a metallization on a first and second major surface, or side, thereof. An integrated circuit affixed to the second side is oriented with chip pads facing away from the substrate. Wire bonds may connect the chip pads to the metallizations.
摘要翻译： 在本公开的各个方面中，提供了芯片卡模块。 芯片卡模块可以包括在其第一和第二主表面或侧面上具有金属化的柔性基板。 固定到第二侧的集成电路被定向成具有面向离开衬底的芯片焊盘。 引线键可以将芯片焊盘连接到金属化。
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公开(公告)号：US20130278378A1
公开(公告)日：2013-10-24
申请号：US13450510
申请日：2012-04-19
申请人： Juergen Hoegerl , Frank Pueschner , Peter Stampka , Michael Huber
发明人： Juergen Hoegerl , Frank Pueschner , Peter Stampka , Michael Huber
IPC分类号： G06F7/04 , G06K19/077
CPC分类号： G06K7/10158 , G06K19/07372 , G06K19/07773 , G06K19/07794
摘要： A tamper-evident credential has a radio frequency identification (RFID) package with a first antenna and a subordinate antenna, RFID package defining a first part of the credential. The credential also has a subordinate RFID package defining a second part of the credential. The subordinate RFID package selectively coupled to said subordinate antenna so that an interrogation signal applied to said first antenna package is transmitted to the subordinate RFID package across said subordinate antenna.
摘要翻译： 防盗证书具有具有第一天线和下级天线的射频识别（RFID）封装，RFID封装限定凭证的第一部分。 凭证还具有定义凭证的第二部分的从属RFID包。 所述下级RFID封装选择性地耦合到所述从属天线，使得施加到所述第一天线封装的询问信号通过所述从属天线传输到所述下级RFID封装。
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8.发明授权公开(公告)号：US08272574B2
公开(公告)日：2012-09-25
申请号：US12570993
申请日：2009-09-30
CPC分类号： G06K19/07749 , B32B38/10 , B32B2305/347 , B32B2425/00 , B32B2519/02 , Y10T156/10
摘要： A document for personal identification, having a chip module including the following components: a chip and a leadframe, wherein the chip is connected to the leadframe, an outer cover, wherein the outer cover is connected to a transponder substrate. A first component of the chip module is connected to the outer cover and a second component of the chip module is connected to the transponder substrate in such a way that, in the case of separation of outer cover and transponder substrate, the first component of the chip module is separated from the second component of the chip module.
摘要翻译： 一种用于个人识别的文档，具有包括以下部件的芯片模块：芯片和引线框架，其中芯片连接到引线框架，外盖，其中外盖连接到应答器基板。 芯片模块的第一部件连接到外盖，并且芯片模块的第二部件以这样的方式连接到应答器基板，使得在分离外盖和应答器基板的情况下，第一部件 芯片模块与芯片模块的第二组件分离。
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公开(公告)号：US20090218667A1
公开(公告)日：2009-09-03
申请号：US12392112
申请日：2009-02-25
CPC分类号： B32B27/36 , B32B3/02 , B32B3/08 , B32B7/12 , B32B27/08 , B32B27/304 , B32B27/365 , B32B37/04 , B32B2250/24 , B32B2250/42 , B32B2305/342 , B32B2305/347 , B32B2307/30 , B32B2307/412 , B32B2307/50 , B32B2307/714 , B32B2309/02 , B32B2309/105 , B32B2327/06 , B32B2367/00 , B32B2369/00 , B32B2425/00 , G06K19/07722 , G06K19/07749 , H01L2924/0002 , Y10T156/10 , Y10T428/269 , Y10T428/31507 , H01L2924/00
摘要： The invention relates to smart cards. In one embodiment a smart card has a card body having at least a first, a second and a third layer. The first and the second layer are at least partly composed of polycarbonate. The third layer is arranged between the first and the second layer and is composed of a material having a melting point of Ts
摘要翻译： 本发明涉及智能卡。 在一个实施例中，智能卡具有至少具有第一，第二和第三层的卡体。 第一层和第二层至少部分地由聚碳酸酯构成。 第三层布置在第一层和第二层之间，由熔点为Ts <150℃的材料构成。
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公开(公告)号：US09177181B2
公开(公告)日：2015-11-03
申请号：US13450510
申请日：2012-04-19
申请人： Juergen Hoegerl , Frank Pueschner , Peter Stampka , Michael Huber
发明人： Juergen Hoegerl , Frank Pueschner , Peter Stampka , Michael Huber
CPC分类号： G06K7/10158 , G06K19/07372 , G06K19/07773 , G06K19/07794
摘要： A tamper-evident credential has a radio frequency identification (RFID) package with a first antenna and a subordinate antenna, RFID package defining a first part of the credential. The credential also has a subordinate RFID package defining a second part of the credential. The subordinate RFID package selectively coupled to said subordinate antenna so that an interrogation signal applied to said first antenna package is transmitted to the subordinate RFID package across said subordinate antenna.
摘要翻译： 防盗证书具有具有第一天线和下级天线的射频识别（RFID）封装，RFID封装限定凭证的第一部分。 凭证还具有定义凭证的第二部分的从属RFID包。 所述下级RFID封装选择性地耦合到所述从属天线，使得施加到所述第一天线封装的询问信号通过所述从属天线传输到所述下级RFID封装。
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