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1.发明申请TRANSPONDER INLAY FOR A DOCUMENT FOR PERSONAL IDENTIFICATION, AND A METHOD FOR PRODUCING A TRANSPONDER INLAY 有权用于个人身份识别的文档的传输器接口和用于生成传送器内嵌的方法公开(公告)号：US20120074228A1
公开(公告)日：2012-03-29
申请号：US13248052
申请日：2011-09-29
IPC分类号： G06K19/02 , B32B37/14 , B32B38/04 , G06K19/077 , B32B37/12
CPC分类号： B42D25/22 , B42D25/00 , B42D25/47 , B42D2033/46 , G06K19/02 , G06K19/07758 , Y10T156/10 , Y10T156/1057
摘要： In various embodiments, a transponder inlay for a document for personal identification may include a cover; an adhesive layer arranged on the cover; a chip arranged on the adhesive layer; an antenna connected to the chip; and a top layer on the adhesive layer, wherein the top layer has a top and a bottom and wherein the bottom of the top layer is connected to the cover by means of the adhesive layer and wherein the antenna is arranged on the top of the top layer such that the antenna is at least to some extent physically separated from the adhesive layer by the top layer.
摘要翻译： 在各种实施例中，用于个人识别的文档的应答器嵌体可以包括盖子; 布置在所述盖上的粘合剂层; 布置在粘合剂层上的芯片; 连接到芯片的天线; 以及所述粘合剂层上的顶层，其中所述顶层具有顶部和底部，并且其中所述顶层的底部通过所述粘合剂层连接到所述盖，并且其中所述天线布置在所述顶部的顶部 使得天线至少在某种程度上由顶层与粘合剂层物理分离。
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2.发明授权公开(公告)号：US08272574B2
公开(公告)日：2012-09-25
申请号：US12570993
申请日：2009-09-30
CPC分类号： G06K19/07749 , B32B38/10 , B32B2305/347 , B32B2425/00 , B32B2519/02 , Y10T156/10
摘要： A document for personal identification, having a chip module including the following components: a chip and a leadframe, wherein the chip is connected to the leadframe, an outer cover, wherein the outer cover is connected to a transponder substrate. A first component of the chip module is connected to the outer cover and a second component of the chip module is connected to the transponder substrate in such a way that, in the case of separation of outer cover and transponder substrate, the first component of the chip module is separated from the second component of the chip module.
摘要翻译： 一种用于个人识别的文档，具有包括以下部件的芯片模块：芯片和引线框架，其中芯片连接到引线框架，外盖，其中外盖连接到应答器基板。 芯片模块的第一部件连接到外盖，并且芯片模块的第二部件以这样的方式连接到应答器基板，使得在分离外盖和应答器基板的情况下，第一部件 芯片模块与芯片模块的第二组件分离。
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3.发明授权Transponder inlay with antenna breaking layer for a document for personal identification, and a method for producing a transponder inlay 有权用于个人识别的文档的天线断层的发送应答器，以及用于产生应答器嵌入的方法公开(公告)号：US08640961B2
公开(公告)日：2014-02-04
申请号：US13248052
申请日：2011-09-29
CPC分类号： B42D25/22 , B42D25/00 , B42D25/47 , B42D2033/46 , G06K19/02 , G06K19/07758 , Y10T156/10 , Y10T156/1057
摘要： In various embodiments, a transponder inlay for a document for personal identification may include a cover; an adhesive layer arranged on the cover; a chip arranged on the adhesive layer; an antenna connected to the chip; and a top layer on the adhesive layer, wherein the top layer has a top and a bottom and wherein the bottom of the top layer is connected to the cover by means of the adhesive layer and wherein the antenna is arranged on the top of the top layer such that the antenna is at least to some extent physically separated from the adhesive layer by the top layer.
摘要翻译： 在各种实施例中，用于个人识别的文档的应答器嵌体可以包括盖子; 布置在所述盖上的粘合剂层; 布置在粘合剂层上的芯片; 连接到芯片的天线; 以及所述粘合剂层上的顶层，其中所述顶层具有顶部和底部，并且其中所述顶层的底部通过所述粘合剂层连接到所述盖，并且其中所述天线布置在所述顶部的顶部 使得天线至少在某种程度上由顶层与粘合剂层物理分离。
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4.发明申请DOCUMENT FOR PERSONAL IDENTIFICATION AND A METHOD FOR PRODUCING A DOCUMENT FOR PERSONAL IDENTIFICATION 有权用于个人身份识别的文档和用于生成用于个人身份识别的文档的方法公开(公告)号：US20100084474A1
公开(公告)日：2010-04-08
申请号：US12570993
申请日：2009-09-30
CPC分类号： G06K19/07749 , B32B38/10 , B32B2305/347 , B32B2425/00 , B32B2519/02 , Y10T156/10
摘要： A document for personal identification, having a chip module including the following components: a chip and a leadframe, wherein the chip is connected to the leadframe, an outer cover, wherein the outer cover is connected to a transponder substrate. A first component of the chip module is connected to the outer cover and a second component of the chip module is connected to the transponder substrate in such a way that, in the case of separation of outer cover and transponder substrate, the first component of the chip module is separated from the second component of the chip module.
摘要翻译： 一种用于个人识别的文档，具有包括以下部件的芯片模块：芯片和引线框架，其中芯片连接到引线框架，外盖，其中外盖连接到应答器基板。 芯片模块的第一部件连接到外盖，并且芯片模块的第二部件以这样的方式连接到应答器基板，使得在分离外盖和应答器基板的情况下，第一部件 芯片模块与芯片模块的第二组件分离。
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公开(公告)号：US08448868B2
公开(公告)日：2013-05-28
申请号：US12940062
申请日：2010-11-05
IPC分类号： G06K19/06
CPC分类号： H01L23/3121 , G06K19/07747 , H01L23/49855 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2924/00014 , H01L2924/1461 , H01L2924/00 , H01L2224/0401
摘要： A smart card module and a method for producing a smart card module are provided. The smart card module comprises a semiconductor chip having a contact side with a plurality of contacts, and a base material with at least one metal layer. The contact side of the semiconductor chip faces the base material and the plurality of contacts of the semiconductor chip are electrically connected to the metal layer. The semiconductor chip and at least a portion of the base material are covered with an encapsulation layer.
摘要翻译： 提供了智能卡模块和用于制造智能卡模块的方法。 智能卡模块包括具有多个触点的接触侧的半导体芯片和具有至少一个金属层的基底材料。 半导体芯片的接触侧面向基材，并且半导体芯片的多个触点电连接到金属层。 半导体芯片和基材的至少一部分被封装层覆盖。
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公开(公告)号：US20080205012A1
公开(公告)日：2008-08-28
申请号：US11963468
申请日：2007-12-21
CPC分类号： G06K19/07743 , H01L21/563 , H01L23/3121 , H01L23/49855 , H01L24/48 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/0102 , H01L2924/01079 , H01L2924/12041 , H01L2924/181 , H05K3/388 , Y10T29/49146 , H01L2924/00 , H01L2224/05599 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/0555 , H01L2224/0556
摘要： A chip card module including a substrate and also conductor patterns, which are applied on at least one side of the substrate without any adhesive. A chip is arranged on one side of the substrate and connected in an electrically conducting manner to the conductor patterns. A mold cap encapsulates at least part of the chip and of the conductor patterns. The method of producing such a chip card module includes providing a substrate, applying conductor patterns to at least one side of the substrate without any adhesive, mounting a chip on one side of the substrate, connecting the chip to the conductor patterns, and applying a molding compound on the substrate, so that at least part of the chip and of the conductor patterns is covered.
摘要翻译： 一种芯片卡模块，其包括基板和导体图案，其被施加在基板的至少一侧而没有任何粘合剂。 芯片布置在基板的一侧并以导电方式连接到导体图案。 模具帽封装芯片和导体图案的至少一部分。 制造这样的芯片卡模块的方法包括提供基板，将导体图案施加到基板的至少一侧而没有任何粘合剂，将芯片安装在基板的一侧，将芯片连接到导体图案上， 在基板上形成模塑料，使得芯片和导体图案的至少一部分被覆盖。
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公开(公告)号：US07714454B2
公开(公告)日：2010-05-11
申请号：US11959973
申请日：2007-12-19
IPC分类号： H01L23/28
CPC分类号： G06K19/07743 , G06K19/07724 , H01L23/49855 , H01L2224/48091 , H01L2924/00014
摘要： A chip module comprises a substrate, a chip arranged on one side of the substrate and conductor structures arranged on at least one side of the substrate and conductively connected to the chip. At least one stiffening element is arranged on one side of the substrate and a moulding cap encapsulates at least the chip. For producing the chip module, provision is made for providing a substrate and applying conductor structures to at least one side of the substrate. At least one stiffening element is mounted onto one side of the substrate. Furthermore, a chip is mounted onto one side of the substrate and connected to the conductor structures. A moulding compound is applied on the substrate, such that the chip is covered.
摘要翻译： 芯片模块包括衬底，布置在衬底的一侧上的芯片和布置在衬底的至少一侧上并导电连接到芯片的导体结构。 至少一个加强元件布置在基底的一侧上，并且模制帽至少封装了芯片。 为了制造芯片模块，提供用于提供衬底并将导体结构施加到衬底的至少一侧。 至少一个加强元件安装在基板的一侧上。 此外，芯片安装在基板的一侧并连接到导体结构。 将模塑料施加在基材上，使芯片被覆盖。
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公开(公告)号：US07694888B2
公开(公告)日：2010-04-13
申请号：US11560058
申请日：2006-11-15
IPC分类号： G06K19/06
CPC分类号： G06K19/077
摘要： A method for producing a contact zone for a chip card has the following steps. A sheet having a first surface and a second surface opposite the first surface. Forming at least one insulating trench, which extends from the first surface to the second surface. A cluster layer is applied to the first surface. The second surface is connected to a carrier element after the cluster layer has been applied to the first surface.
摘要翻译： 用于制造芯片卡的接触区域的方法具有以下步骤。 一种具有与第一表面相对的第一表面和第二表面的片材。 形成从第一表面延伸到第二表面的至少一个绝缘沟槽。 将簇层应用于第一表面。 在将簇层施加到第一表面之后，第二表面连接到载体元件。
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公开(公告)号：US09177181B2
公开(公告)日：2015-11-03
申请号：US13450510
申请日：2012-04-19
申请人： Juergen Hoegerl , Frank Pueschner , Peter Stampka , Michael Huber
发明人： Juergen Hoegerl , Frank Pueschner , Peter Stampka , Michael Huber
CPC分类号： G06K7/10158 , G06K19/07372 , G06K19/07773 , G06K19/07794
摘要： A tamper-evident credential has a radio frequency identification (RFID) package with a first antenna and a subordinate antenna, RFID package defining a first part of the credential. The credential also has a subordinate RFID package defining a second part of the credential. The subordinate RFID package selectively coupled to said subordinate antenna so that an interrogation signal applied to said first antenna package is transmitted to the subordinate RFID package across said subordinate antenna.
摘要翻译： 防盗证书具有具有第一天线和下级天线的射频识别（RFID）封装，RFID封装限定凭证的第一部分。 凭证还具有定义凭证的第二部分的从属RFID包。 所述下级RFID封装选择性地耦合到所述从属天线，使得施加到所述第一天线封装的询问信号通过所述从属天线传输到所述下级RFID封装。
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公开(公告)号：US20100248475A1
公开(公告)日：2010-09-30
申请号：US12415757
申请日：2009-03-31
申请人： Manfred Mengel , Thomas Spoettl , Frank Pueschner
发明人： Manfred Mengel , Thomas Spoettl , Frank Pueschner
IPC分类号： H01L21/768
CPC分类号： H01L24/82 , C25D7/12 , H01L21/565 , H01L23/3107 , H01L23/492 , H01L23/49517 , H01L24/03 , H01L24/24 , H01L24/76 , H01L2224/03462 , H01L2224/24011 , H01L2224/2405 , H01L2224/24051 , H01L2224/24101 , H01L2224/24105 , H01L2224/24226 , H01L2224/24246 , H01L2224/24247 , H01L2224/244 , H01L2224/245 , H01L2224/24998 , H01L2224/25171 , H01L2224/2929 , H01L2224/293 , H01L2224/32245 , H01L2224/73267 , H01L2224/76155 , H01L2224/76189 , H01L2224/766 , H01L2224/821 , H01L2224/82102 , H01L2224/82108 , H01L2224/83801 , H01L2224/83851 , H01L2224/92244 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10329 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2224/29075 , H01L2924/00
摘要： A method of fabricating a semiconductor device is disclosed. In one embodiment, the method includes providing at least one semiconductor chip including an electrically conductive layer. A voltage is applied to an electrode. The electrode is moved over the electrically conductive layer for growing a metal layer onto the electrically conductive layer.
摘要翻译： 公开了制造半导体器件的方法。 在一个实施例中，该方法包括提供包括导电层的至少一个半导体芯片。 向电极施加电压。 电极在导电层上移动，用于在导电层上生长金属层。
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