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公开(公告)号:US08425710B2
公开(公告)日:2013-04-23
申请号:US12404270
申请日:2009-03-13
CPC分类号: B32B38/18 , B29C70/386 , Y02T50/43 , Y10T156/10 , Y10T156/12 , Y10T156/1348 , Y10T156/17 , Y10T156/1788 , Y10T156/1795 , Y10T428/31504
摘要: Damping material is installed on a structure by moving a material placement head over the structure, and using the head to place the material on the structure.
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公开(公告)号:US08241448B2
公开(公告)日:2012-08-14
申请号:US11558210
申请日:2006-11-09
IPC分类号: B29C65/50
CPC分类号: C09J5/06 , B29C35/02 , B29C65/4815 , B29C65/4835 , B29C65/5021 , B29C65/5057 , B29C66/721 , B29C66/73122 , B29C66/8227 , B29C66/8242 , B29C66/8322 , B29C66/9141 , B29C66/919 , B29C66/929 , B29C66/949 , B29L2031/3076 , C09J2463/00 , Y10T428/2495 , Y10T428/26 , Y10T428/2817 , Y10T428/31511 , Y10T428/31678
摘要: The invention relates to a method of bonding two members together utilizing a stack of solid film adhesive and a layer of solid film adhesive, both disposed between the members. A pressure-applying device may be utilized to apply low pressure to force the members together. The pressure may force the stack to compress and expand in varying directions in order to substantially remove air-bubbles between the layer and one of the members. A heating device may be utilized to change the layer and the stack into liquid states in order to bond the members together with a void-free bond-line.
摘要翻译: 本发明涉及一种利用固体膜粘合剂和一层固体膜粘合剂将两个构件结合在一起的方法,两者均设置在构件之间。 压力施加装置可以用于施加低压力以迫使构件在一起。 压力可以迫使堆叠件在不同的方向上压缩和膨胀,以便基本上去除层和其中一个构件之间的气泡。 可以使用加热装置来将层和堆叠改变成液态,以便将这些构件与无空隙的粘合线结合在一起。
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公开(公告)号:US20080113191A1
公开(公告)日:2008-05-15
申请号:US11558210
申请日:2006-11-09
CPC分类号: C09J5/06 , B29C35/02 , B29C65/4815 , B29C65/4835 , B29C65/5021 , B29C65/5057 , B29C66/721 , B29C66/73122 , B29C66/8227 , B29C66/8242 , B29C66/8322 , B29C66/9141 , B29C66/919 , B29C66/929 , B29C66/949 , B29L2031/3076 , C09J2463/00 , Y10T428/2495 , Y10T428/26 , Y10T428/2817 , Y10T428/31511 , Y10T428/31678
摘要: The invention relates to a method of bonding two members together utilizing a stack of solid film adhesive and a layer of solid film adhesive, both disposed between the members. A pressure-applying device may be utilized to apply low pressure to force the members together. The pressure may force the stack to compress and expand in varying directions in order to substantially remove air-bubbles between the layer and one of the members. A heating device may be utilized to change the layer and the stack into liquid states in order to bond the members together with a void-free bond-line.
摘要翻译: 本发明涉及一种利用固体膜粘合剂和一层固体膜粘合剂将两个构件结合在一起的方法,两者均设置在构件之间。 压力施加装置可以用于施加低压力以迫使构件在一起。 压力可以迫使堆叠件在不同的方向上压缩和膨胀,以便基本上去除层和其中一个构件之间的气泡。 可以使用加热装置来将层和堆叠改变成液态,以便将这些构件与无空隙的粘合线结合在一起。
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公开(公告)号:US20120276351A1
公开(公告)日:2012-11-01
申请号:US13543656
申请日:2012-07-06
CPC分类号: C09J5/06 , B29C35/02 , B29C65/4815 , B29C65/4835 , B29C65/5021 , B29C65/5057 , B29C66/721 , B29C66/73122 , B29C66/8227 , B29C66/8242 , B29C66/8322 , B29C66/9141 , B29C66/919 , B29C66/929 , B29C66/949 , B29L2031/3076 , C09J2463/00 , Y10T428/2495 , Y10T428/26 , Y10T428/2817 , Y10T428/31511 , Y10T428/31678
摘要: The invention relates to a method of bonding two members together utilizing a stack of solid film adhesive and a layer of solid film adhesive, both disposed between the members. A pressure-applying device may be utilized to apply low pressure to force the members together. The pressure may force the stack to compress and expand in varying directions in order to substantially remove air-bubbles between the layer and one of the members. A heating device may be utilized to change the layer and the stack into liquid states in order to bond the members together with a void-free bond-line.
摘要翻译: 本发明涉及一种利用固体膜粘合剂和一层固体膜粘合剂将两个构件结合在一起的方法,两者均设置在构件之间。 压力施加装置可以用于施加低压力以迫使构件在一起。 压力可以迫使堆叠件在不同的方向上压缩和膨胀,以便基本上去除层和其中一个构件之间的气泡。 可以使用加热装置来将层和堆叠改变成液态,以便将这些构件与无空隙的粘合线结合在一起。
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公开(公告)号:US20100230202A1
公开(公告)日:2010-09-16
申请号:US12404270
申请日:2009-03-13
CPC分类号: B32B38/18 , B29C70/386 , Y02T50/43 , Y10T156/10 , Y10T156/12 , Y10T156/1348 , Y10T156/17 , Y10T156/1788 , Y10T156/1795 , Y10T428/31504
摘要: Damping material is installed on a structure by moving a material placement head over the structure, and using the head to place the material on the structure.
摘要翻译: 通过将材料放置头移动到结构上,并使用头将材料放置在结构上,将阻尼材料安装在结构上。
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