Abstract:
A large scale composite structure is fabricated by forming a plurality of composite laminate modules and joining the modules together along their edges using scarf joints.
Abstract:
A rigid coupler for use in electrically isolating an electrically conductive fluid conveyance system is described. The rigid coupler includes a nonconductive liner having a first end configured to couple to a first adjoining section of the fluid conveyance system, and a second end, opposite said first end, configured to couple to a second adjoining section of the fluid conveyance system. A reinforcing structure circumscribes the nonconductive liner and is coupled to a portion of the nonconductive liner extending between the first and second ends of the nonconductive liner. The reinforcing structure includes a multi-axial braided fiber material impregnated with a matrix material. A fiber overwrap is hoop wound about at a least a portion of the reinforcing structure between the first and second ends of the nonconductive liner.
Abstract:
A system for fabricating a composite item from a layup may comprise a debulking device, a vacuum generator and a curing device. The debulking device may include a vacuum chamber, an envelope and a heater. The vacuum chamber may have a chamber pressure. The envelope may be contained within the vacuum chamber and may have an envelope pressure. The layup may be received within the envelope. The heater may heat the layup. The vacuum generator may be in fluid connection with the debulking device. The curing device may cure the layup.
Abstract:
A rigid coupler for use in electrically isolating an electrically conductive fluid conveyance system is described. The rigid coupler includes a nonconductive liner having a first end configured to couple to a first adjoining section of the fluid conveyance system, and a second end, opposite said first end, configured to couple to a second adjoining section of the fluid conveyance system. A reinforcing structure circumscribes the nonconductive liner and is coupled to a portion of the nonconductive liner extending between the first and second ends of the nonconductive liner. The reinforcing structure includes a multi-axial braided fiber material impregnated with a matrix material. A fiber overwrap is hoop wound about at a least a portion of the reinforcing structure between the first and second ends of the nonconductive liner.
Abstract:
A system for fabricating a composite item from a layup may comprise a debulking device, a vacuum generator and a curing device. The debulking device may include a vacuum chamber, an envelope and a heater. The vacuum chamber may have a chamber pressure. The envelope may be contained within the vacuum chamber and may have an envelope pressure. The layup may be received within the envelope. The heater may heat the layup. The vacuum generator may be in fluid connection with the debulking device. The curing device may cure the layup.
Abstract:
A large scale composite structure is fabricated by forming a plurality of composite laminate modules and joining the modules together along their edges using scarf joints.
Abstract:
To fabricate a composite item from a layup of composite material, the layup is degassed, debulked, and cured. To degas the layup, an envelope pressure within an envelope that includes the layup is reduced, a chamber pressure within a chamber that includes the envelope is reduced, and the layup is heated. To debulk the layup, the chamber pressure is increased relative to the envelope pressure so that the envelope exerts a compressive force upon the layup in response to the relatively higher chamber pressure as compared to the envelope pressure. To cure the layup, the layup is exposed to radiation.
Abstract:
The invention relates to a method of bonding two members together utilizing a stack of solid film adhesive and a layer of solid film adhesive, both disposed between the members. A pressure-applying device may be utilized to apply low pressure to force the members together. The pressure may force the stack to compress and expand in varying directions in order to substantially remove air-bubbles between the layer and one of the members. A heating device may be utilized to change the layer and the stack into liquid states in order to bond the members together with a void-free bond-line.