Handheld electronic devices with antenna power monitoring
    2.
    发明申请
    Handheld electronic devices with antenna power monitoring 有权
    带天线功率监控的手持式电子设备

    公开(公告)号:US20090096683A1

    公开(公告)日:2009-04-16

    申请号:US11974115

    申请日:2007-10-10

    IPC分类号: H01Q1/24 G01R29/08

    CPC分类号: H01Q1/242

    摘要: Handheld electronic devices are provided that contain wireless communications circuitry. The wireless communications circuitry may include an antenna. A radio-frequency coupler may be coupled to the antenna. Transceiver circuitry may be used to transmit and receive radio-frequency signals through the coupler and the antenna. A reflected power detection circuit may be connected to the coupler. When the transceiver circuitry transmits radio-frequency signals, some of the signals are reflected back from the antenna into the coupler. The coupler directs the reflected antenna signals into the reflected power detection circuit. Processing circuitry may analyze a reflected power signal from the reflected power detection circuit to determine whether operation of the antenna is being disrupted by the placement of a user's hand over the antenna or other proximity effects. If antenna operation is being disrupted, the user may be alerted or other suitable actions may be taken.

    摘要翻译: 提供了包含无线通信电路的手持电子设备。 无线通信电路可以包括天线。 射频耦合器可以耦合到天线。 收发器电路可以用于通过耦合器和天线发射和接收射频信号。 反射功率检测电路可以连接到耦合器。 当收发器电路传输射频信号时,一些信号从天线反射回耦合器。 耦合器将反射的天线信号引导到反射功率检测电路中。 处理电路可以分析来自反射功率检测电路的反射功率信号,以确定天线的操作是否被用户的手放置在天线上或其他邻近效应上而中断。 如果天线操作被中断,则可能会警告用户或者可以采取其他适当的动作。

    Technique for reducing wasted material on a printed circuit board panel
    3.
    发明授权
    Technique for reducing wasted material on a printed circuit board panel 失效
    减少印刷电路板面板上浪费的材料的技术

    公开(公告)号:US08650744B2

    公开(公告)日:2014-02-18

    申请号:US12707412

    申请日:2010-02-17

    IPC分类号: B23P19/00 H05K13/04

    摘要: A process for assembling a rigid-flex printed circuit board (PCB) is presented. During operation, the process receives rigid-flex PCBs that are to be coupled together, wherein a rigid-flex PCB includes flexible PCBs coupled to rigid PCBs. The process then places the PCBs onto a carrier which is configured to: align the PCBs so that bond regions located on the flexible PCBs overlap with bond regions located on corresponding flexible PCBs, and apply pressure to the overlapped bond regions. The process then sends the carrier through a reflow oven which reflows solder on the PCBs so that the components become mechanically and electrically coupled to the PCBs. The temperature profile generated by the reflow oven and the pressure applied by the carrier cures and sets an anisotropic conductive film located in the bond regions so that the overlapped flexible PCBs become mechanically and electrically coupled together.

    摘要翻译: 提出了一种用于组装刚性柔性印刷电路板(PCB)的工艺。 在操作过程中,该过程接收要耦合在一起的刚性柔性PCB,其中刚性柔性PCB包括耦合到刚性PCB的柔性PCB。 然后,该过程将PCB放置在载体上,该载体被配置为:对准PCB,使得位于柔性PCB上的结合区域与位于相应的柔性PCB上的结合区域重叠,并且向重叠的结合区域施加压力。 然后,该过程通过回流炉发送载体,该回流炉在PCB上重新焊接焊料,使得部件变得机械地和电耦合到PCB。 由回流炉产生的温度曲线和由载体施加的压力固化并设置位于接合区域中的各向异性导电膜,使得重叠的柔性PCB变得机械和电耦合在一起。

    TECHNIQUE FOR REDUCING WASTED MATERIAL ON A PRINTED CIRCUIT BOARD PANEL
    5.
    发明申请
    TECHNIQUE FOR REDUCING WASTED MATERIAL ON A PRINTED CIRCUIT BOARD PANEL 失效
    打印电路板面板上减少材料的技术

    公开(公告)号:US20100139085A1

    公开(公告)日:2010-06-10

    申请号:US12707412

    申请日:2010-02-17

    IPC分类号: H05K3/30 H05K3/36

    摘要: A process for assembling a rigid-flex printed circuit board (PCB) is presented. During operation, the process receives rigid-flex PCBs that are to be coupled together, wherein a rigid-flex PCB includes flexible PCBs coupled to rigid PCBs. The process then places the PCBs onto a carrier which is configured to: align the PCBs so that bond regions located on the flexible PCBs overlap with bond regions located on corresponding flexible PCBs, and apply pressure to the overlapped bond regions. The process then sends the carrier through a reflow oven which reflows solder on the PCBs so that the components become mechanically and electrically coupled to the PCBs. The temperature profile generated by the reflow oven and the pressure applied by the carrier cures and sets an anisotropic conductive film located in the bond regions so that the overlapped flexible PCBs become mechanically and electrically coupled together.

    摘要翻译: 提出了一种用于组装刚性柔性印刷电路板(PCB)的工艺。 在操作过程中,该过程接收要耦合在一起的刚性柔性PCB,其中刚性柔性PCB包括耦合到刚性PCB的柔性PCB。 然后,该过程将PCB放置在载体上,该载体被配置为:对准PCB,使得位于柔性PCB上的结合区域与位于相应的柔性PCB上的结合区域重叠,并且向重叠的结合区域施加压力。 然后,该过程通过回流炉发送载体,该回流炉在PCB上重新焊接焊料,使得部件变得机械地和电耦合到PCB。 由回流炉产生的温度曲线和由载体施加的压力固化并设置位于接合区域中的各向异性导电膜,使得重叠的柔性PCB变得机械和电耦合在一起。

    TECHNIQUE FOR REDUCING WASTED MATERIAL ON A PRINTED CIRCUIT BOARD PANEL
    6.
    发明申请
    TECHNIQUE FOR REDUCING WASTED MATERIAL ON A PRINTED CIRCUIT BOARD PANEL 失效
    打印电路板面板上减少材料的技术

    公开(公告)号:US20090205200A1

    公开(公告)日:2009-08-20

    申请号:US12062855

    申请日:2008-04-04

    IPC分类号: H01R43/00

    摘要: A process for assembling a rigid-flex printed circuit board (PCB) is presented. During operation, the process receives rigid-flex PCBs that are to be coupled together, wherein a rigid-flex PCB includes flexible PCBs coupled to rigid PCBs. The process then places the PCBs onto a carrier which is configured to: align the PCBs so that bond regions located on the flexible PCBs overlap with bond regions located on corresponding flexible PCBs, and apply pressure to the overlapped bond regions. The process then sends the carrier through a reflow oven which reflows solder on the PCBs so that the components become mechanically and electrically coupled to the PCBs. The temperature profile generated by the reflow oven and the pressure applied by the carrier cures and sets an anisotropic conductive film located in the bond regions so that the overlapped flexible PCBs become mechanically and electrically coupled together.

    摘要翻译: 提出了一种用于组装刚性柔性印刷电路板(PCB)的工艺。 在操作过程中,该过程接收要耦合在一起的刚性柔性PCB,其中刚性柔性PCB包括耦合到刚性PCB的柔性PCB。 然后,该过程将PCB放置在载体上,该载体被配置为:对准PCB,使得位于柔性PCB上的结合区域与位于相应的柔性PCB上的结合区域重叠,并且向重叠的结合区域施加压力。 然后,该过程通过回流炉发送载体,该回流炉在PCB上重新焊接焊料,使得部件变得机械地和电耦合到PCB。 由回流炉产生的温度曲线和由载体施加的压力固化并设置位于接合区域中的各向异性导电膜,使得重叠的柔性PCB变得机械和电耦合在一起。

    Handheld electronic devices with antenna power monitoring
    10.
    发明授权
    Handheld electronic devices with antenna power monitoring 有权
    带天线功率监控的手持式电子设备

    公开(公告)号:US08892049B2

    公开(公告)日:2014-11-18

    申请号:US11974115

    申请日:2007-10-10

    IPC分类号: H04B17/00 H01Q1/24

    CPC分类号: H01Q1/242

    摘要: Handheld electronic devices are provided that contain wireless communications circuitry. The wireless communications circuitry may include an antenna. A radio-frequency coupler may be coupled to the antenna. Transceiver circuitry may be used to transmit and receive radio-frequency signals through the coupler and the antenna. A reflected power detection circuit may be connected to the coupler. When the transceiver circuitry transmits radio-frequency signals, some of the signals are reflected back from the antenna into the coupler. The coupler directs the reflected antenna signals into the reflected power detection circuit. Processing circuitry may analyze a reflected power signal from the reflected power detection circuit to determine whether operation of the antenna is being disrupted by the placement of a user's hand over the antenna or other proximity effects. If antenna operation is being disrupted, the user may be alerted or other suitable actions may be taken.

    摘要翻译: 提供了包含无线通信电路的手持电子设备。 无线通信电路可以包括天线。 射频耦合器可以耦合到天线。 收发器电路可以用于通过耦合器和天线发射和接收射频信号。 反射功率检测电路可以连接到耦合器。 当收发器电路传输射频信号时,一些信号从天线反射回耦合器。 耦合器将反射的天线信号引导到反射功率检测电路中。 处理电路可以分析来自反射功率检测电路的反射功率信号,以确定天线的操作是否被用户的手放置在天线上或其他邻近效应上而中断。 如果天线操作被中断,则可能会警告用户或者可以采取其他适当的动作。