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    Cooling structure for electronic equipment
    1.
    发明申请
    Cooling structure for electronic equipment 有权
    电子设备冷却结构

    公开(公告)号：US20060005549A1

    公开(公告)日：2006-01-12

    申请号：US11222793

    申请日：2005-09-12

    申请人： Minoru Ishinabe ,  Hiroki Uchida ,  Hideshi Tokuhira ,  Hiroaki Date ,  Wataru Tanaka

    发明人： Minoru Ishinabe ,  Hiroki Uchida ,  Hideshi Tokuhira ,  Hiroaki Date ,  Wataru Tanaka

    IPC分类号： F28D15/00 ,  F25B21/02

    CPC分类号： F25B21/02 ,  F25B2321/0212 ,  F28D15/00 ,  F28D15/0266 ,  F28F3/12 ,  F28F2210/02 ,  G06F1/1607 ,  G06F1/20 ,  G06F1/203 ,  G06F2200/1612 ,  G06F2200/1631 ,  G06F2200/201 ,  G06F2200/203 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A cooling structure for electronic equipment is designed for cooling a heat-generating body (2a) disposed inside a case (20) by recovering heat generated by the heat-generating body (2a) and dissipating the heat to the outside of the case (20). The cooling structure includes a heat-receiving section (4) for recovering heat generated in the heat-generating body (2a), a thermally insulated space (6) provided with an air inflow orifice (42a) and an air outflow orifice (42b) and thermally insulated from the heat-generating body (2a) and heat-receiving section (4) by a thermally insulating member (40), a heat-dissipating section (7) provided inside the thermally insulated space (6), a heat transfer member (5) for transferring the heat recovered in the heat-receiving section (4) to the heat-dissipating section (7), and a fan (22) for generating forcibly an air flow in the thermally insulated space (6). The heat generated by the heat-generating body (2a) is transferred to the heat-dissipating section (7) via the heat-receiving section (4) and heat transfer member (5) and dissipated in a concentrated fashion by using the fan (22) inside the thermally insulated space (6).

    摘要翻译： 电子设备的冷却结构被设计用于通过回收由发热体（2a）产生的热并将热量散发到壳体的外部来冷却设置在壳体（20）内部的发热体（2a） （20）。 冷却结构包括用于回收在发热体（2a）中产生的热的热接收部分（4），设置有空气流入孔（42a）和空气流出孔 42b），并且通过隔热构件（40）与设置在隔热空间（6）内部的散热部（7）与发热体（2a）和受热部（4）热绝缘， 用于将在受热部分（4）中回收的热量传递到散热部分（7）的传热部件（5）和用于在绝热空间（6）中强制产生空气流的风扇（22） ）。 由发热体（2a）产生的热量经由受热部（4）和传热部件（5）传递到散热部（7），并且通过使用风扇（ 22）在隔热空间（6）内。

    Electronic apparatus
    3.
    发明授权
    Electronic apparatus 失效
    电子仪器

    公开(公告)号：US07502227B2

    公开(公告)日：2009-03-10

    申请号：US11085483

    申请日：2005-03-22

    申请人： Hiroki Uchida ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

    发明人： Hiroki Uchida ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

    IPC分类号： H05K7/20

    CPC分类号： G06F1/203 ,  G06F2200/201

    摘要： A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

    摘要翻译： 具有MPU元件的第一壳体中的主体流动路径分别与形成在内部散热板和外部散热板中的内部流路和外部流路连通，并且泵驱动冷却液体在 这些流路。 在设置在第二壳体中的枢轴和设置在内部散热板中的枢轴之间布置有梁，在内部散热板的枢轴与设置在外部散热板中的枢轴之间布置有梁， 并且内部散热板和外部散热板可移动到第二壳体。 根据打开第二壳体的操作，第二壳体和内部散热板之间的距离以及内部流路和外部流路之间的距离增加。

    ELECTRONIC APPARATUS
    4.
    发明申请
    ELECTRONIC APPARATUS 有权
    电子设备

    公开(公告)号：US20090052135A1

    公开(公告)日：2009-02-26

    申请号：US12251172

    申请日：2008-10-14

    申请人： Hiroki UCHIDA ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

    发明人： Hiroki UCHIDA ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

    IPC分类号： H05K7/20

    CPC分类号： G06F1/203 ,  G06F2200/201

    摘要： A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

    摘要翻译： 具有MPU元件的第一壳体中的主体流动路径分别与形成在内部散热板和外部散热板中的内部流路和外部流路连通，并且泵驱动冷却液体在 这些流路。 在设置在第二壳体中的枢轴和设置在内部散热板中的枢轴之间布置有梁，在内部散热板的枢轴与设置在外部散热板中的枢轴之间布置有梁， 并且内部散热板和外部散热板可移动到第二壳体。 根据打开第二壳体的操作，第二壳体和内部散热板之间的距离以及内部流路和外部流路之间的距离增加。

    Electronic apparatus
    5.
    发明申请
    Electronic apparatus 审中-公开
    电子仪器

    公开(公告)号：US20060038285A1

    公开(公告)日：2006-02-23

    申请号：US10991395

    申请日：2004-11-19

    申请人： Hideshi Tokuhira ,  Hiroaki Date ,  Hiroki Uchida ,  Minoru Ishinabe

    发明人： Hideshi Tokuhira ,  Hiroaki Date ,  Hiroki Uchida ,  Minoru Ishinabe

    IPC分类号： H01L23/34

    CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A small-size and light-weight electronic apparatus with a cooling structure capable of exhibiting good cooling performance is provided. A cover member with a plurality of grooves for forming a channel is joined by brazing to a housing on a lid body side to which an LCD panel is attached, and these grooves are covered with the housing to form a channel for circulating a coolant. The housing constitutes a part of the channel, and the channel for the coolant is integrated into the housing. Heat generated by a main body is transferred to the lid body side by the coolant and dissipated outside through the housing that performs the function of a heat-radiation plate.

    摘要翻译： 提供了具有能够表现出良好冷却性能的冷却结构的小型和轻量级的电子设备。 具有用于形成通道的多个槽的盖构件通过钎焊连接到安装有LCD面板的盖体侧的壳体，并且这些槽被壳体覆盖以形成用于使冷却剂循环的通道。 壳体构成通道的一部分，并且用于冷却剂的通道被集成到壳体中。 由主体产生的热量通过冷却剂被转移到盖主体侧，并通过外壳散发，从而发挥散热板的功能。

    THERMAL CONDUCTIVITY SHEET AND ELECTRONIC DEVICE
    6.
    发明申请
    THERMAL CONDUCTIVITY SHEET AND ELECTRONIC DEVICE 审中-公开
    热导率片和电子器件

    公开(公告)号：US20090226754A1

    公开(公告)日：2009-09-10

    申请号：US12469109

    申请日：2009-05-20

    申请人： Jun Taniguchi ,  Minoru Ishinabe

    发明人： Jun Taniguchi ,  Minoru Ishinabe

    IPC分类号： B32B15/00 ,  B32B7/02

    CPC分类号： H01L23/3735 ,  H01L23/433 ,  H01L2924/0002 ,  Y10T428/12493 ,  Y10T428/24983 ,  H01L2924/00

    摘要： There is provided a thermal conductivity sheet capable of lowering the thermal resistance value of the joint surface more than before in addition to easiness to use, and an electronic device to which the thermal conductivity sheet is applied. Load is applied to the thermal conductivity sheet having a prescribed thickness placed between CPU 10 that is the heat generation parts and the heat sink 11 that is the heat radiation parts. The thermal conductivity sheet has hardness wherein intervals between CPU 10 that is the heat generation parts and the heat sink 11 that is the heat radiation parts narrow more than the prescribed thickness by either of load within the range from 0.01 kgf/cm2 to 5.0 kgf/cm2 with tightening of screw.

    摘要翻译： 另外，除了易于使用之外，还提供了能够比以前更多地降低接合面的热阻值的热传导性片和应用导热性片的电子器件。 在作为发热部的CPU10和作为散热部的散热器11之间，将具有规定厚度的导热性片施加负荷。 热导率片具有硬度，其中作为发热部的CPU 10与作为散热部的散热片11之间的间隔通过0.01kgf / cm 2至5.0kgf / cm 2的范围内的任一负载而比规定厚度窄， cm2，拧紧螺丝。

    Heat exchanger for liquid cooling
    8.
    发明申请
    Heat exchanger for liquid cooling 审中-公开
    液体冷却换热器

    公开(公告)号：US20070000655A1

    公开(公告)日：2007-01-04

    申请号：US11255952

    申请日：2005-10-24

    申请人： Hiroki Uchida ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Hiroaki Date ,  Jun Taniguchi

    发明人： Hiroki Uchida ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Hiroaki Date ,  Jun Taniguchi

    IPC分类号： H05K7/20

    CPC分类号： G06F1/203 ,  G06F2200/201 ,  G06F2200/203

    摘要： To realize a flat heat exchanger with superior stability of the flow path, a heat exchanger for liquid cooling in which a cooling liquid flows inside the heat exchanger includes a pouch made of a water-resistant sheet having an inflow port and an outflow port for the cooling liquid; a heat exchange plate overlapping with the pouch; a presser plate pressing the pouch against the heat exchange plate; wherein protrusions and depressions delimiting a flow path linking the inflow port and the outflow port are formed on the inner side of at least one of the heat exchange plate and the presser plate.

    摘要翻译： 为了实现具有优异的流路稳定性的扁平式热交换器，冷却液体在热交换器内部流动的液体冷却用热交换器包括：由具有流入口和流出口的防水片制成的袋， 冷却液 与所述袋重叠的热交换板; 压板压住热交换板; 其特征在于，在所述热交换板和所述压板的至少一个的内侧形成有限定连通所述流入口和所述流出口的流路的突起和凹部。

    Electronic apparatus
    9.
    发明申请
    Electronic apparatus 失效

    公开(公告)号：US20060133032A1

    公开(公告)日：2006-06-22

    申请号：US11085483

    申请日：2005-03-22

    申请人： Hiroki Uchida ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

    发明人： Hiroki Uchida ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

    IPC分类号： G06F1/20

    CPC分类号： G06F1/203 ,  G06F2200/201

    摘要： A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

    Electronic apparatus
    10.
    发明授权
    Electronic apparatus 有权
    电子仪器

    公开(公告)号：US07978470B2

    公开(公告)日：2011-07-12

    申请号：US12251172

    申请日：2008-10-14

    申请人： Hiroki Uchida ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

    发明人： Hiroki Uchida ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

    IPC分类号： H05K7/20

    CPC分类号： G06F1/203 ,  G06F2200/201

    摘要： A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

    摘要翻译： 具有MPU元件的第一壳体中的主体流动路径分别与形成在内部散热板和外部散热板中的内部流路和外部流路连通，并且泵驱动冷却液体在 这些流路。 在设置在第二壳体中的枢轴和设置在内部散热板中的枢轴之间布置有梁，在内部散热板的枢轴与设置在外部散热板中的枢轴之间布置有梁， 并且内部散热板和外部散热板可移动到第二壳体。 根据打开第二壳体的操作，第二壳体和内部散热板之间的距离以及内部流路和外部流路之间的距离增加。