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    Electronic apparatus
    1.
    发明授权
    Electronic apparatus 有权
    电子仪器

    公开(公告)号：US07978470B2

    公开(公告)日：2011-07-12

    申请号：US12251172

    申请日：2008-10-14

    申请人： Hiroki Uchida ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

    发明人： Hiroki Uchida ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

    IPC分类号： H05K7/20

    CPC分类号： G06F1/203 ,  G06F2200/201

    摘要： A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

    摘要翻译： 具有MPU元件的第一壳体中的主体流动路径分别与形成在内部散热板和外部散热板中的内部流路和外部流路连通，并且泵驱动冷却液体在 这些流路。 在设置在第二壳体中的枢轴和设置在内部散热板中的枢轴之间布置有梁，在内部散热板的枢轴与设置在外部散热板中的枢轴之间布置有梁， 并且内部散热板和外部散热板可移动到第二壳体。 根据打开第二壳体的操作，第二壳体和内部散热板之间的距离以及内部流路和外部流路之间的距离增加。

    Electronic apparatus
    3.
    发明授权
    Electronic apparatus 失效
    电子仪器

    公开(公告)号：US07502227B2

    公开(公告)日：2009-03-10

    申请号：US11085483

    申请日：2005-03-22

    申请人： Hiroki Uchida ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

    发明人： Hiroki Uchida ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

    IPC分类号： H05K7/20

    CPC分类号： G06F1/203 ,  G06F2200/201

    摘要： A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

    摘要翻译： 具有MPU元件的第一壳体中的主体流动路径分别与形成在内部散热板和外部散热板中的内部流路和外部流路连通，并且泵驱动冷却液体在 这些流路。 在设置在第二壳体中的枢轴和设置在内部散热板中的枢轴之间布置有梁，在内部散热板的枢轴与设置在外部散热板中的枢轴之间布置有梁， 并且内部散热板和外部散热板可移动到第二壳体。 根据打开第二壳体的操作，第二壳体和内部散热板之间的距离以及内部流路和外部流路之间的距离增加。

    ELECTRONIC APPARATUS
    4.
    发明申请
    ELECTRONIC APPARATUS 有权
    电子设备

    公开(公告)号：US20090052135A1

    公开(公告)日：2009-02-26

    申请号：US12251172

    申请日：2008-10-14

    申请人： Hiroki UCHIDA ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

    发明人： Hiroki UCHIDA ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

    IPC分类号： H05K7/20

    CPC分类号： G06F1/203 ,  G06F2200/201

    摘要： A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

    摘要翻译： 具有MPU元件的第一壳体中的主体流动路径分别与形成在内部散热板和外部散热板中的内部流路和外部流路连通，并且泵驱动冷却液体在 这些流路。 在设置在第二壳体中的枢轴和设置在内部散热板中的枢轴之间布置有梁，在内部散热板的枢轴与设置在外部散热板中的枢轴之间布置有梁， 并且内部散热板和外部散热板可移动到第二壳体。 根据打开第二壳体的操作，第二壳体和内部散热板之间的距离以及内部流路和外部流路之间的距离增加。

    Electronic apparatus
    6.
    发明申请
    Electronic apparatus 失效

    公开(公告)号：US20060133032A1

    公开(公告)日：2006-06-22

    申请号：US11085483

    申请日：2005-03-22

    申请人： Hiroki Uchida ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

    发明人： Hiroki Uchida ,  Jun Taniguchi ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Masanobu Ishiduka ,  Hiroaki Date

    IPC分类号： G06F1/20

    CPC分类号： G06F1/203 ,  G06F2200/201

    摘要： A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

    Radiating fin and method for manufacturing the same
    7.
    发明申请
    Radiating fin and method for manufacturing the same 审中-公开
    辐射翅片及其制造方法

    公开(公告)号：US20060065970A1

    公开(公告)日：2006-03-30

    申请号：US11020245

    申请日：2004-12-27

    申请人： Hiroki Uchida ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Hiroaki Date ,  Jun Taniguchi

    发明人： Hiroki Uchida ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Hiroaki Date ,  Jun Taniguchi

    IPC分类号： H01L23/053

    CPC分类号： H01L23/373 ,  H01L21/4882 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A plurality of carbon fibers having a surface having a metal-plated layer (Cu-plated layer) are stood vertically on a flat plate-like provisional substrate by electrostatic flocking, and one end of the carbon fibers is provisionally adhered to the provisional substrate with an adhesive. The other end of the carbon fibers which is not provisionally adhered is contacted with a substrate (Cu plate) having a surface coated with a solder paste and, in this state, a brazing material (solder) is melted and cooled, and carbon fibers and a substrate are brazed (soldered). After completion of mechanical and thermal connection between the substrate and the carbon fibers, this is immersed in an organic solvent, and the provisionally adhered provisional substrate is peeled from the carbon fibers to manufacture a radiating fin.

    摘要翻译： 将具有金属镀层（Cu镀层）的表面的多个碳纤维通过静电植绒垂直放置在平板状临时基板上，并且将碳纤维的一端临时粘附到临时基板上， 粘合剂。 未临时粘附的碳纤维的另一端与表面被焊膏涂布的基板（Cu板）接触，在该状态下，钎焊材料（焊料）熔融冷却，碳纤维和 衬底钎焊（焊接）。 在基板和碳纤维之间的机械和热连接完成之后，将其浸入有机溶剂中，并将临时粘附的临时基板从碳纤维上剥离以制造散热片。

    Heat exchanger for liquid cooling
    8.
    发明申请
    Heat exchanger for liquid cooling 审中-公开
    液体冷却换热器

    公开(公告)号：US20070000655A1

    公开(公告)日：2007-01-04

    申请号：US11255952

    申请日：2005-10-24

    申请人： Hiroki Uchida ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Hiroaki Date ,  Jun Taniguchi

    发明人： Hiroki Uchida ,  Hideshi Tokuhira ,  Minoru Ishinabe ,  Hiroaki Date ,  Jun Taniguchi

    IPC分类号： H05K7/20

    CPC分类号： G06F1/203 ,  G06F2200/201 ,  G06F2200/203

    摘要： To realize a flat heat exchanger with superior stability of the flow path, a heat exchanger for liquid cooling in which a cooling liquid flows inside the heat exchanger includes a pouch made of a water-resistant sheet having an inflow port and an outflow port for the cooling liquid; a heat exchange plate overlapping with the pouch; a presser plate pressing the pouch against the heat exchange plate; wherein protrusions and depressions delimiting a flow path linking the inflow port and the outflow port are formed on the inner side of at least one of the heat exchange plate and the presser plate.

    摘要翻译： 为了实现具有优异的流路稳定性的扁平式热交换器，冷却液体在热交换器内部流动的液体冷却用热交换器包括：由具有流入口和流出口的防水片制成的袋， 冷却液 与所述袋重叠的热交换板; 压板压住热交换板; 其特征在于，在所述热交换板和所述压板的至少一个的内侧形成有限定连通所述流入口和所述流出口的流路的突起和凹部。

    Cooling structure for electronic equipment
    9.
    发明申请
    Cooling structure for electronic equipment 有权
    电子设备冷却结构

    公开(公告)号：US20060005549A1

    公开(公告)日：2006-01-12

    申请号：US11222793

    申请日：2005-09-12

    申请人： Minoru Ishinabe ,  Hiroki Uchida ,  Hideshi Tokuhira ,  Hiroaki Date ,  Wataru Tanaka

    发明人： Minoru Ishinabe ,  Hiroki Uchida ,  Hideshi Tokuhira ,  Hiroaki Date ,  Wataru Tanaka

    IPC分类号： F28D15/00 ,  F25B21/02

    CPC分类号： F25B21/02 ,  F25B2321/0212 ,  F28D15/00 ,  F28D15/0266 ,  F28F3/12 ,  F28F2210/02 ,  G06F1/1607 ,  G06F1/20 ,  G06F1/203 ,  G06F2200/1612 ,  G06F2200/1631 ,  G06F2200/201 ,  G06F2200/203 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A cooling structure for electronic equipment is designed for cooling a heat-generating body (2a) disposed inside a case (20) by recovering heat generated by the heat-generating body (2a) and dissipating the heat to the outside of the case (20). The cooling structure includes a heat-receiving section (4) for recovering heat generated in the heat-generating body (2a), a thermally insulated space (6) provided with an air inflow orifice (42a) and an air outflow orifice (42b) and thermally insulated from the heat-generating body (2a) and heat-receiving section (4) by a thermally insulating member (40), a heat-dissipating section (7) provided inside the thermally insulated space (6), a heat transfer member (5) for transferring the heat recovered in the heat-receiving section (4) to the heat-dissipating section (7), and a fan (22) for generating forcibly an air flow in the thermally insulated space (6). The heat generated by the heat-generating body (2a) is transferred to the heat-dissipating section (7) via the heat-receiving section (4) and heat transfer member (5) and dissipated in a concentrated fashion by using the fan (22) inside the thermally insulated space (6).

    摘要翻译： 电子设备的冷却结构被设计用于通过回收由发热体（2a）产生的热并将热量散发到壳体的外部来冷却设置在壳体（20）内部的发热体（2a） （20）。 冷却结构包括用于回收在发热体（2a）中产生的热的热接收部分（4），设置有空气流入孔（42a）和空气流出孔 42b），并且通过隔热构件（40）与设置在隔热空间（6）内部的散热部（7）与发热体（2a）和受热部（4）热绝缘， 用于将在受热部分（4）中回收的热量传递到散热部分（7）的传热部件（5）和用于在绝热空间（6）中强制产生空气流的风扇（22） ）。 由发热体（2a）产生的热量经由受热部（4）和传热部件（5）传递到散热部（7），并且通过使用风扇（ 22）在隔热空间（6）内。

    Cooling structure for electronic equipment
    10.
    发明授权
    Cooling structure for electronic equipment 有权
    电子设备冷却结构

    公开(公告)号：US07155914B2

    公开(公告)日：2007-01-02

    申请号：US11222793

    申请日：2005-09-12

    申请人： Minoru Ishinabe ,  Hiroki Uchida ,  Hideshi Tokuhira ,  Hiroaki Date ,  Wataru Tanaka

    发明人： Minoru Ishinabe ,  Hiroki Uchida ,  Hideshi Tokuhira ,  Hiroaki Date ,  Wataru Tanaka

    IPC分类号： F25D23/12

    CPC分类号： F25B21/02 ,  F25B2321/0212 ,  F28D15/00 ,  F28D15/0266 ,  F28F3/12 ,  F28F2210/02 ,  G06F1/1607 ,  G06F1/20 ,  G06F1/203 ,  G06F2200/1612 ,  G06F2200/1631 ,  G06F2200/201 ,  G06F2200/203 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A cooling structure for electronic equipment is designed for cooling a heat-generating body (2a) disposed inside a case (20) by recovering heat generated by the heat-generating body (2a) and dissipating the heat to the outside of the case (20). The cooling structure includes a heat-receiving section (4) for recovering heat generated in the heat-generating body (2a), a thermally insulated space (6) provided with an air inflow orifice (42a) and an air outflow orifice (42b) and thermally insulated from the heat-generating body (2a) and heat-receiving section (4) by a thermally insulating member (40), a heat-dissipating section (7) provided inside the thermally insulated space (6), a heat transfer member (5) for transferring the heat recovered in the heat-receiving section (4) to the heat-dissipating section (7), and a fan (22) for generating forcibly an air flow in the thermally insulated space (6). The heat generated by the heat-generating body (2a) is transferred to the heat-dissipating section (7) via the heat-receiving section (4) and heat transfer member (5) and dissipated in a concentrated fashion by using the fan (22) inside the thermally insulated space (6).

    摘要翻译： 电子设备的冷却结构被设计用于通过回收由发热体（2a）产生的热并将热量散发到壳体的外部来冷却设置在壳体（20）内部的发热体（2a） （20）。 冷却结构包括用于回收在发热体（2a）中产生的热的热接收部分（4），设置有空气流入孔（42a）和空气流出孔 42b），并且通过隔热构件（40）与发热体（2a）和热接收部分（4）热绝缘，设置在隔热空间（6）内部的散热部分（7） ，用于将在所述受热部（4）中回收的热量传递到所述散热部（7）的传热部件（5），以及用于在所述绝热空间（12）中强制产生空气流的风扇（22） 6）。 由发热体（2a）产生的热量经由受热部（4）和传热部件（5）传递到散热部（7），并且通过使用风扇 （22）在隔热空间（6）内。