公开(公告)号：US07616080B2

公开(公告)日：2009-11-10

申请号：US11515305

申请日：2006-09-01

申请人： Chan-sei Yoo ,  Woo-sung Lee ,  Dongsu Kim ,  Nam-kee Kang ,  Jong-chul Park

发明人： Chan-sei Yoo ,  Woo-sung Lee ,  Dongsu Kim ,  Nam-kee Kang ,  Jong-chul Park

IPC分类号： H01P1/203

CPC分类号： H01P1/20381 ,  H01P1/2039

摘要： A bandpass filter (BPF) configured in 3-D structures for filtering signals of ultra wide bands is disclosed, the BPF comprising sequentially stacked first to fourth dielectric substrates, wherein the first dielectric substrate is formed at a bottom surface thereof with a first ground pattern, the second dielectric substrate is formed at an upper surface thereof with a second ground pattern, and a stripline pattern is formed between the first and second dielectric substrates. The fourth dielectric substrate is formed thereon with a filter pattern and input/output coupled line patterns.

摘要翻译： 公开了一种用于滤波超宽带信号的3-D结构的带通滤波器（BPF），BPF包括顺序堆叠的第一至第四电介质基板，其中第一电介质基板在其底表面处形成有第一接地图案 第二电介质基板在其上表面形成有第二接地图案，并且在第一和第二电介质基板之间形成带状线图形。 第四电介质基板在其上形成有滤波器图案和输入/输出耦合线图案。

公开(公告)号：US20080290507A1

公开(公告)日：2008-11-27

申请号：US11947574

申请日：2007-11-29

申请人： Se Hoon Park ,  Jun Chul Kim ,  Jong Chul Park ,  Nam Kee Kang ,  Woo Sung Lee ,  Chan Sei Yoo

发明人： Se Hoon Park ,  Jun Chul Kim ,  Jong Chul Park ,  Nam Kee Kang ,  Woo Sung Lee ,  Chan Sei Yoo

IPC分类号： H01L23/36 ,  H01L21/58

CPC分类号： H05K1/187 ,  H01L2224/16 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/162 ,  H05K1/186 ,  H05K3/0061 ,  H05K3/1291 ,  H05K3/205 ,  H05K3/207 ,  H05K3/3436 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2201/10674 ,  H05K2203/0315 ,  H05K2203/0376 ,  H05K2203/0733 ,  H05K2203/1126 ,  H01L2224/0401

摘要： The chip embedded printed circuit board and a fabricating method thereof are disclosed, wherein a circuit pattern is formed by depositing a metal layer on a support layer, a semiconductor chip is packaged on a support layer to wrap the semiconductor chip and the circuit pattern on the support layer and to form an isolation layer, a via hole filled with conductive material is formed through the isolation layer for interlayer electrical connection, part of the support layer is selectively removed to form a plated heat sink, such that a packaging process can be performed in a very planar state and the plated heat sink can be integrated with a printed circuit board.

摘要翻译： 公开了芯片嵌入式印刷电路板及其制造方法，其中通过在支撑层上沉积金属层形成电路图案，将半导体芯片封装在支撑层上以将半导体芯片和电路图案包裹在 支撑层并形成隔离层，通过用于层间电连接的隔离层形成填充有导电材料的通孔，部分支撑层被选择性地去除以形成电镀散热器，从而可以执行封装处理 在非常平坦的状态下，电镀散热器可与印刷电路板集成。

公开(公告)号：US20070285193A1

公开(公告)日：2007-12-13

申请号：US11515305

申请日：2006-09-01

申请人： Chan-sei Yoo ,  Woo-sung Lee ,  Dongsu Kim ,  Nam-kee Kang ,  Jong-chul Park

发明人： Chan-sei Yoo ,  Woo-sung Lee ,  Dongsu Kim ,  Nam-kee Kang ,  Jong-chul Park

IPC分类号： H01P1/203

CPC分类号： H01P1/20381 ,  H01P1/2039

摘要： A bandpass filter (BPF) configured in 3-D structures for filtering signals of ultra wide bands is disclosed, the BPF comprising sequentially stacked first to fourth dielectric substrates, wherein the first dielectric substrate is formed at a bottom surface thereof with a first ground pattern, the second dielectric substrate is formed at an upper surface thereof with a second ground pattern, and a stripline pattern is formed between the first and second dielectric substrates. The fourth dielectric substrate is formed thereon with a filter pattern and input/output coupled line patterns.

摘要翻译： 公开了一种用于滤波超宽带信号的3-D结构的带通滤波器（BPF），BPF包括顺序堆叠的第一至第四电介质基板，其中第一电介质基板在其底表面处形成有第一接地图案 第二电介质基板在其上表面形成有第二接地图案，并且在第一和第二电介质基板之间形成带状线图形。 第四电介质基板在其上形成有滤波器图案和输入/输出耦合线图案。