公开(公告)号：US5796209A

公开(公告)日：1998-08-18

申请号：US484256

申请日：1994-10-27

Applicant: Babar Ali Khan ,  David Alan Cammack ,  Ronald D. Pinker ,  Nikhil Ramesh Taskar

Inventor： Babar Ali Khan ,  David Alan Cammack ,  Ronald D. Pinker ,  Nikhil Ramesh Taskar

IPC: H01J9/24 ,  G02F1/13357 ,  H01J9/00 ,  H01J9/26 ,  H01J9/28 ,  H01J17/49 ,  H01J61/00 ,  H01J61/30 ,  H01J61/36 ,  H01J61/82 ,  H01J65/00 ,  H01J65/04 ,  H01S3/03 ,  H01S3/097 ,  H01S3/0973 ,  H01J1/62 ,  H01J9/12 ,  H01J17/16

CPC classification number: G02F1/133617 ,  H01J17/492 ,  H01J61/00 ,  H01J61/30 ,  H01J61/82 ,  H01J65/00 ,  H01J9/00 ,  H01J9/261 ,  H01S3/03 ,  H01S3/097 ,  H01S3/0973

Abstract: A high pressure gas discharge lamp and the method of making same utilizing integrated circuit fabrication techniques. The lamp is manufactured from heat and pressure resistant planar substrates in which cavities are etched, by integrated circuit manufacturing techniques, so as to provide a cavity forming the gas discharge tube. Electrodes are deposited in the cavity. The cavity is filled with gas discharge materials such as mercury vapor, sodium vapor or metal halide. The substrates are bonded together and channels may be etched in the substrate so as to provide a means for connection to the electrodes. Electrodeless RF activated lamps may also be fabricated by this technique. Micro-lasers may also be fabricated by this technique as well.

Abstract translation: 一种高压气体放电灯及其利用集成电路制造技术的方法。 该灯由通过集成电路制造技术蚀刻空腔的耐热和耐压平面基板制造，以提供形成气体放电管的空腔。 电极沉积在腔中。 空腔填充有气体放电材料，例如汞蒸气，钠蒸气或金属卤化物。 将基板粘合在一起，并且可以在基板中蚀刻通道，以便提供连接到电极的装置。 也可以通过这种技术制造无电极RF激活灯。 也可以通过该技术来制造微型激光器。

公开(公告)号：US06998281B2

公开(公告)日：2006-02-14

申请号：US10401686

申请日：2003-03-31

Applicant: Nikhil Ramesh Taskar ,  Vikram Bidare Krishnamurthy

Inventor： Nikhil Ramesh Taskar ,  Vikram Bidare Krishnamurthy

IPC: H01L21/56

CPC classification number: H01L33/46 ,  H01L25/0753 ,  H01L33/105 ,  H01L33/405 ,  H01L33/54 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2933/0091 ,  H01L2924/00014

Abstract: A light emitting device containing an array of directional emission LEDs is provided. The directional emission LEDs of the array may be substrate emitting, lateral current injection, resonant cavity LEDs mounted in a flip-chip configuration. Each LED may emit a different color of light, such that the output of the array appears white to an observer. The LED array package may contain microoptical elements, such as a diffraction grating or microprisms, integrated into the light emitting surface of the package. The microoptical elements are used to mix the light beams emitted by individual LEDs in the array.

Abstract translation: 提供了包含定向发射LED阵列的发光装置。 阵列的方向发射LED可以是以倒装芯片配置安装的衬底发射，横向电流注入，谐振腔LED。 每个LED可以发射不同颜色的光，使得阵列的输出对于观察者看起来是白色的。 LED阵列封装可以包含集成到封装的发光表面中的微光学元件，例如衍射光栅或微棱镜。 微光学元件用于将阵列中各个LED发射的光束混合。