公开(公告)号：US20240357839A1

公开(公告)日：2024-10-24

申请号：US18759039

申请日：2024-06-28

Applicant: Nitin Ashok Deshpande ,  Omkar Gopalkrishna Karhade ,  Debendra Mallik

Inventor： Nitin Ashok Deshpande ,  Omkar Gopalkrishna Karhade ,  Debendra Mallik

IPC: H10B80/00 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065

CPC classification number: H10B80/00 ,  H01L24/08 ,  H01L24/80 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/08145 ,  H01L2224/80006 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/80908

Abstract: Memory stacks including replacement blocks and related methods are disclosed. An example integrated circuit disclosed herein includes a first layer including a memory die, and a second layer including a replacement block communicatively coupled to the memory die, the second layer including and a dielectric shell surrounding the replacement block.

公开(公告)号：US09368455B2

公开(公告)日：2016-06-14

申请号：US14229771

申请日：2014-03-28

Applicant: Ravindranath V. Mahajan ,  John S. Guzek ,  Adel A. Elsherbini ,  Nitin Ashok Deshpande

Inventor： Ravindranath V. Mahajan ,  John S. Guzek ,  Adel A. Elsherbini ,  Nitin Ashok Deshpande

IPC: H01L23/00 ,  H01L23/552 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L21/568 ,  H01L24/16 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/81

Abstract: An electromagnetic interference shield is described for semiconductor chip packages. In some embodiments, a package has a semiconductor die. a redistribution layer, a mold compound over the die, a plurality of vias through the mold compound and outside the die to form a shield, and a metal film over the vias. and over the mold compound.

Abstract translation: 半导体芯片封装描述了电磁干扰屏蔽。 在一些实施例中，封装具有半导体管芯。 再分布层，模具上的模具化合物，通过模具化合物的多个通孔和模具外部以形成屏蔽，以及在通孔上方的金属膜。 并在模具化合物上。

公开(公告)号：US20150279789A1

公开(公告)日：2015-10-01

申请号：US14229771

申请日：2014-03-28

Applicant: Ravindranath V. Mahajan ,  John S. Guzek ,  Adel A. Elshebini ,  Nitin Ashok Deshpande

Inventor： Ravindranath V. Mahajan ,  John S. Guzek ,  Adel A. Elshebini ,  Nitin Ashok Deshpande

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L21/568 ,  H01L24/16 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/81

Abstract: An electromagnetic interference shield is described for semiconductor chip packages. In some embodiments, a package has a semiconductor die. a redistribution layer, a mold compound over the die, a plurality of vias through the mold compound and outside the die to form a shield, and a metal film over the vias. and over the mold compound.

Abstract translation: 半导体芯片封装描述了电磁干扰屏蔽。 在一些实施例中，封装具有半导体管芯。 再分布层，模具上的模具化合物，通过模具化合物的多个通孔和模具外部以形成屏蔽，以及在通孔上方的金属膜。 并在模具化合物上。