公开(公告)号：US20060249304A1

公开(公告)日：2006-11-09

申请号：US10554660

申请日：2004-06-30

申请人： Hideaki Tanaka ,  Nobuyuki Sensui

发明人： Hideaki Tanaka ,  Nobuyuki Sensui

IPC分类号： H05K1/03

CPC分类号： H05K3/0023 ,  H05K3/26 ,  H05K3/28 ,  H05K3/4644 ,  H05K2201/0761 ,  H05K2201/0769 ,  H05K2203/0786 ,  H05K2203/0793 ,  Y10T29/49126 ,  Y10T29/49155

摘要： In the case of using a photosensitive insulating resin for a surface protective layer of a circuit wiring pattern, or for an insulating layer between circuit wiring conductor layers in a circuit board, Na ions adsorbed on the photosensitive insulating resin are replaced with a polyvalent metal through a treatment step containing Na ions which is executed after a heat curing step of the photosensitive insulating resin. For the polyvalent metal, a II group including Mg or Ca can be selected.

摘要翻译： 在电路布线图案的表面保护层用感光绝缘树脂或电路基板的电路布线导体层之间的绝缘层的情况下，吸附在感光绝缘树脂上的Na离子被多价金属代替 包含在感光绝缘树脂的热固化步骤之后执行的Na离子的处理步骤。 对于多价金属，可以选择包括Mg或Ca的II族。

公开(公告)号：US06365324B1

公开(公告)日：2002-04-02

申请号：US09277267

申请日：1999-03-26

申请人： Lin-chiu Chiang ,  Jenq-Tain Lin ,  Nobuyuki Sensui

发明人： Lin-chiu Chiang ,  Jenq-Tain Lin ,  Nobuyuki Sensui

IPC分类号： G03C173

CPC分类号： C08G73/1025 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/106 ,  G03F7/0387 ,  G03F7/0757 ,  Y10S430/106 ,  Y10S430/128

摘要： Polyimide is produced by reacting two kinds of diamine compounds consisting of diaminopolysiloxane and a carboxyl group-containing diamine or three kinds of diamine compounds consisting of diaminopolysiloxane, a carboxyl group-containing diamine and an aromatic or alicyclic diamine with a 4,4′-(hexafluoroisopropylidene)diphthalic acid dianhydride, thereby once forming a polyamic acid, and subjecting the polyamic acid to polyimidization reaction. The resulting polyimide itself is soluble in low boiling organic solvents for general purpose use, typically methyl ethyl ketone. A photosensitive composition comprising the polyimide, a photo crosslinking agent and a photo acid-generating agent forms a negative type polyimide pattern upon development with an aqueous alkali solution.

摘要翻译： 聚酰亚胺通过将由二氨基聚硅氧烷和含羧基二胺组成的二种二胺化合物或由二氨基聚硅氧烷，含羧基的二胺和芳族或脂环族二胺组成的三种二胺化合物与4,4' - （ 六氟异亚丙基）二邻苯二甲酸二酐，从而一次形成聚酰胺酸，并使聚酰胺酸进行聚酰亚胺化反应。 所得聚酰亚胺本身可溶于用于通用目的的低沸点有机溶剂，通常为甲基乙基酮。 包含聚酰亚胺，光交联剂和光酸发生剂的光敏组合物在用碱水溶液显影时形成负型聚酰亚胺图案。

公开(公告)号：US06232039B1

公开(公告)日：2001-05-15

申请号：US09493713

申请日：2000-01-28

申请人： Lin-chiu Chiang ,  Jenq-Tain Lin ,  Nobuyuki Sensui

发明人： Lin-chiu Chiang ,  Jenq-Tain Lin ,  Nobuyuki Sensui

IPC分类号： G03C173

CPC分类号： C08G73/1025 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/106 ,  G03F7/0387 ,  G03F7/0757 ,  Y10S430/106 ,  Y10S430/128

摘要： Polyimide is produced by reacting two kinds of diamine compounds consisting of diaminopolysiloxane and a carboxyl group-containing diamine or three kinds of diamine compounds consisting of diaminopolysiloxane, a carboxyl group-containing diamine and an aromatic or alicyclic diamine with a 4,4′-(hexafluoroisopropylidene)diphthalic acid dianhydride, thereby once forming a polyamic acid, and subjecting the polyamic acid to polyimidization reaction. The resulting polyimide itself is soluble in low boiling organic solvents for general purpose use, typically methyl ethyl ketone. A photosensitive composition comprising the polyimide, a photo crosslinking agent and a photo acid-generating agent forms a negative type polyimide pattern upon development with an aqueous alkali solution.

摘要翻译： 聚酰亚胺通过将由二氨基聚硅氧烷和含羧基二胺组成的二种二胺化合物或由二氨基聚硅氧烷，含羧基的二胺和芳族或脂环族二胺组成的三种二胺化合物与4,4' - （ 六氟异亚丙基）二邻苯二甲酸二酐，从而一次形成聚酰胺酸，并使聚酰胺酸进行聚酰亚胺化反应。 所得聚酰亚胺本身可溶于用于通用目的的低沸点有机溶剂，通常为甲基乙基酮。 包含聚酰亚胺，光交联剂和光酸发生剂的光敏组合物在用碱水溶液显影时形成负型聚酰亚胺图案。

公开(公告)号：US6096850A

公开(公告)日：2000-08-01

申请号：US259668

申请日：1999-02-26

申请人： Lin-chiu Chiang ,  Jenq-Tain Lin ,  Nobuyuki Sensui

发明人： Lin-chiu Chiang ,  Jenq-Tain Lin ,  Nobuyuki Sensui

IPC分类号： G03F7/038 ,  C08G73/10 ,  C08G77/455 ,  C08G77/445

CPC分类号： C08G77/455 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/106

摘要： Polyimide is produced by reacting two kinds of diamine compounds consisting of diaminopolysiloxane and a hydroxyl group-containing diamine or three kinds of diamine compounds consisting of diaminopolysiloxane, a hydroxyl group-containing diamine and an aromatic or alicyclic diamine with a 4,4'-(hexafluoroisopropylidene)diphthalic acid dianhydride, thereby once forming a polyamic acid, and subjecting the polyamic acid to polyimidization reaction. The resulting polyimide itself is soluble in low boiling organic solvents for general purpose use, typically methyl ethyl ketone. A photosensitive composition comprising the polyimide, a photo crosslinking agent and a photo acid-generating agent forms a negative type polyimide pattern upon development with an aqueous alkali solution.

摘要翻译： 聚酰亚胺通过使由二氨基聚硅氧烷和含羟基的二胺组成的二种二胺化合物或由二氨基聚硅氧烷，含羟基的二胺和芳族或脂环族二胺组成的三种二胺化合物与4,4' - （ 六氟异亚丙基）二邻苯二甲酸二酐，由此一次形成聚酰胺酸，并使聚酰胺酸进行聚酰亚胺化反应。 所得聚酰亚胺本身可溶于用于通用目的的低沸点有机溶剂，通常为甲基乙基酮。 包含聚酰亚胺，光交联剂和光酸发生剂的光敏组合物在用碱水溶液显影时形成负型聚酰亚胺图案。

公开(公告)号：US06582885B2

公开(公告)日：2003-06-24

申请号：US09982634

申请日：2001-10-18

申请人： Lin-chiu Chiang ,  Jenq-Tain Lin ,  Nobuyuki Sensui

发明人： Lin-chiu Chiang ,  Jenq-Tain Lin ,  Nobuyuki Sensui

IPC分类号： G03F7037

CPC分类号： C08G73/1042 ,  C08G73/106 ,  C08G77/455 ,  Y10S430/106 ,  Y10S430/128

摘要： Polyimide is produced by reacting two kinds of diamine compounds consisting of diaminopolysiloxane and a carboxyl group-containing diamine or three kinds of diamine compounds consisting of diaminopolysiloxane, a carboxyl group-containing diamine and an aromatic or alicyclic diamine with a dicarboxylic acid anhydride having a 2,5-dioxotetrahydrofuryl group as one acid anhydride group, thereby once forming a polyamic acid, and subjecting the polyamic acid to polyimidization reaction. The resulting polyimide itself is soluble in low boiling organic solvents for general purpose use, typically methyl ethyl ketone. A photosensitive composition comprising the polyimide, a photo crosslinking agent and a photo acid-generating agent forms a negative type polyimide pattern upon development with an aqueous alkali solution.

公开(公告)号：US06486290B1

公开(公告)日：2002-11-26

申请号：US09259069

申请日：1999-02-26

申请人： Lin-chiu Chiang ,  Jenq-Tain Lin ,  Nobuyuki Sensui

发明人： Lin-chiu Chiang ,  Jenq-Tain Lin ,  Nobuyuki Sensui

IPC分类号： G03F7037

CPC分类号： C08G73/1042 ,  C08G73/106 ,  C08G77/455 ,  Y10S430/106 ,  Y10S430/128

摘要： Polyimide is produced by reacting two kinds of diamine compounds consisting of diaminopolysiloxane and a carboxyl group-containing diamine or three kinds of diamine compounds consisting of diaminopolysiloxane, a carboxyl group-containing diamine and an aromatic or alicyclic diamine with a dicarboxylic acid anhydride having a 2,5-dioxotetrahydrofuryl group as one acid anhydride group, thereby once forming a polyamic acid, and subjecting the polyamic acid to polyimidization reaction. The resulting polyimide itself is soluble in low boiling organic solvents for, general purpose use, typically methyl ethyl ketone. A photosensitive composition comprising the polyimide, a photo crosslinking agent and a photo acid-generating agent forms a negative type polyimide pattern upon development with an aqueous alkali solution.

摘要翻译： 聚酰亚胺通过将由二氨基聚硅氧烷和含羧基二胺组成的二种二胺化合物或由二氨基聚硅氧烷，含羧基的二胺和芳族或脂环族二胺组成的三种二胺化合物与二羧酸酐组成的二种二胺化合物 ，5-二氧代四氢呋喃基作为一个酸酐基，从而一次形成聚酰胺酸，并使聚酰胺酸进行聚酰亚胺化反应。 所得聚酰亚胺本身可溶于低沸点有机溶剂，通常用途，通常为甲基乙基酮。 包含聚酰亚胺，光交联剂和光酸发生剂的光敏组合物在用碱水溶液显影时形成负型聚酰亚胺图案。

公开(公告)号：US06245484B1

公开(公告)日：2001-06-12

申请号：US09496098

申请日：2000-02-01

申请人： Lin-chiu Chiang ,  Jenq-Tain Lin ,  Nobuyuki Sensui

发明人： Lin-chiu Chiang ,  Jenq-Tain Lin ,  Nobuyuki Sensui

IPC分类号： G03C173

CPC分类号： C08G73/1042 ,  C08G73/106 ,  C08G77/455 ,  Y10S430/106 ,  Y10S430/128

摘要： Polyimide is produced by reacting two kinds of diamine compounds consisting of diaminopolysiloxane and a carboxyl group-containing diamine or three kinds of diamine compounds consisting of diaminopolysiloxane, a carboxyl group-containing diamine and an aromatic or alicyclic diamine with a dicarboxylic acid anhydride having a 2,5-dioxotetrahydrofuryl group as one acid anhydride group, thereby once forming a polyamic acid, and subjecting the polyamic acid to polyimidization reaction. The resulting polyimide itself is soluble in low boiling organic solvents for general purpose use, typically methyl ethyl ketone. A photosensitive composition comprising the polyimide, a photo crosslinking agent and a photo acid-generating agent forms a negative type polyimide pattern upon development with an aqueous alkali solution.

摘要翻译： 聚酰亚胺通过将由二氨基聚硅氧烷和含羧基二胺组成的二种二胺化合物或由二氨基聚硅氧烷，含羧基的二胺和芳族或脂环族二胺组成的三种二胺化合物与二羧酸酐组成的二种二胺化合物 ，5-二氧代四氢呋喃基作为一个酸酐基，从而一次形成聚酰胺酸，并使聚酰胺酸进行聚酰亚胺化反应。 所得聚酰亚胺本身可溶于用于通用目的的低沸点有机溶剂，通常为甲基乙基酮。 包含聚酰亚胺，光交联剂和光酸发生剂的光敏组合物在用碱水溶液显影时形成负型聚酰亚胺图案。

公开(公告)号：US6077924A

公开(公告)日：2000-06-20

申请号：US259479

申请日：1999-02-26

申请人： Lin-chiu Chiang ,  Jenq-Tain Lin ,  Nobuyuki Sensui

发明人： Lin-chiu Chiang ,  Jenq-Tain Lin ,  Nobuyuki Sensui

IPC分类号： G03F7/037 ,  C08G73/10 ,  C08G77/455 ,  G03F7/038 ,  C08G69/26 ,  C08G77/04

CPC分类号： C08G77/455 ,  C08G73/1042 ,  C08G73/106

摘要： Polyimide is produced by reacting two kinds of diamine compounds consisting of diaminopolysiloxane and a hydroxyl group-containing diamine or three kinds of diamine compounds consisting of diaminopolysiloxane, a hydroxyl group-containing diamine and an aromatic or alicyclic diamine with a dicarboxylic acid anhydride having a 2,5-dioxotetrahydrofuryl group as one acid anhydride group, thereby once forming a polyamic acid, and subjecting the polyamic acid to polyimidization reaction. The resulting polyimide itself is soluble in low boiling organic solvents for general purpose use, typically methyl ethyl ketone. A photosensitive composition comprising the polyimide, a photo crosslinking agent and a photo acid-generating agent forms a negative type polyimide pattern upon development with an aqueous alkali solution.

摘要翻译： 聚酰亚胺通过将由二氨基聚硅氧烷和含羟基的二胺组成的二种二胺化合物或由二氨基聚硅氧烷，含羟基的二胺和芳香族或脂环族二胺组成的三种二胺化合物与二羧酸酐 ，5-二氧代四氢呋喃基作为一个酸酐基，从而一次形成聚酰胺酸，并使聚酰胺酸进行聚酰亚胺化反应。 所得聚酰亚胺本身可溶于用于通用目的的低沸点有机溶剂，通常为甲基乙基酮。 包含聚酰亚胺，光交联剂和光酸发生剂的光敏组合物在用碱水溶液显影时形成负型聚酰亚胺图案。

公开(公告)号：US20080182025A1

公开(公告)日：2008-07-31

申请号：US11986577

申请日：2007-11-21

申请人： Hideaki Tanaka ,  Nobuyuki Sensui

发明人： Hideaki Tanaka ,  Nobuyuki Sensui

IPC分类号： B05D3/10 ,  B05D3/02

CPC分类号： H05K3/0023 ,  H05K3/26 ,  H05K3/28 ,  H05K3/4644 ,  H05K2201/0761 ,  H05K2201/0769 ,  H05K2203/0786 ,  H05K2203/0793 ,  Y10T29/49126 ,  Y10T29/49155

摘要： In the case of using a photosensitive insulating resin for a surface protective layer of a circuit wiring pattern, or for an insulating layer between circuit wiring conductor layers in a circuit board, Na ions adsorbed on the photosensitive insulating resin are replaced with a polyvalent metal through a treatment step containing Na ions which is executed after a heat curing step of the photosensitive insulating resin. For the polyvalent metal, a II group including Mg or Ca can be selected.

摘要翻译： 在电路布线图案的表面保护层用感光绝缘树脂或电路基板的电路布线导体层之间的绝缘层的情况下，吸附在感光绝缘树脂上的Na离子被多价金属代替 包含在感光绝缘树脂的热固化步骤之后执行的Na离子的处理步骤。 对于多价金属，可以选择包括Mg或Ca的II族。