公开(公告)号：US06376055B1

公开(公告)日：2002-04-23

申请号：US09550826

申请日：2000-04-18

申请人： Kazuo Kishida ,  Akira Shiratori ,  Osamu Yokokura ,  Hiroshi Takagi

发明人： Kazuo Kishida ,  Akira Shiratori ,  Osamu Yokokura ,  Hiroshi Takagi

IPC分类号： B32B300

CPC分类号： C04B35/111 ,  C03C8/14 ,  C03C14/004 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00

摘要： There is disclosed a composition for a ceramic substrate comprising a mixture of: powdered borosilicate-based glass comprising about 5% to 17.5% by weight of B2O3, about 28% to 44% by weight of SiO2, 0% to about 20% by weight of Al2O3, and about 36% to 50% by weight of MO (where MO is at least one selected from the group consisting of CaO, MgO, and BaO), and a powdered ceramic; in which the amount of the powdered borosilicate-based glass is about 40% to 49% by weight based on the total amount of the composition for a ceramic substrate, and the amount of the powdered ceramic is about 60% to 51% by weight based on the total amount of the composition for a ceramic substrate.

公开(公告)号：US20090058555A1

公开(公告)日：2009-03-05

申请号：US12274411

申请日：2008-11-20

申请人： Toshiaki TAKATA ,  Osamu YOKOKURA

发明人： Toshiaki TAKATA ,  Osamu YOKOKURA

IPC分类号： H03H9/72

CPC分类号： H03H9/0576 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/30111 ,  H03H9/725 ,  H01L2924/00

摘要： An elastic wave duplexer includes a transmission filter chip and a reception filter chip each defined by an elastic wave filter chip and flip-chip bonded to a laminated board. A coil-shaped line including coil-shaped line patterns is provided inside the laminated board. The coil-shaped line defines an impedance matching circuit. In plan view, the transmission filter chip is disposed on one side of a center line passing through the approximate center of the laminated board and extending between a first edge and a second edge, and the reception filter chip is disposed on the other side of the center line. The coil-shaped line is disposed on the side on which the reception filter chip is disposed.

摘要翻译： 弹性波双工器包括传输滤波器芯片和接收滤波器芯片，每个接收滤波器芯片由弹性波滤波器芯片和倒装芯片结合到层压板上而定义。 在层叠板内设置有包括线圈状线状的线圈状线。 线圈形线路限定了阻抗匹配电路。 在平面图中，透射滤光片芯片配置在穿过层叠板的大致中心的中心线的一侧，并且在第一边缘和第二边缘之间延伸，并且接收滤波器芯片设置在 中心线。 线圈状线设置在配置有接收滤波器芯片的一侧。

公开(公告)号：US06448195B2

公开(公告)日：2002-09-10

申请号：US09930010

申请日：2001-08-15

申请人： Kazuo Kishida ,  Akira Shiratori ,  Osamu Yokokura ,  Hiroshi Takagi

发明人： Kazuo Kishida ,  Akira Shiratori ,  Osamu Yokokura ,  Hiroshi Takagi

IPC分类号： C03C100

CPC分类号： C04B35/111 ,  C03C8/14 ,  C03C14/004 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00

摘要： There is disclosed a composition for a ceramic substrate comprising a mixture of: powdered borosilicate-based glass comprising about 5% to 17.5% by weight of B2O3, about 28% to 44% by weight of SiO2, 0% to about 20% by weight of Al2O3, and about 36% to 50% by weight of MO (where MO is at least one selected from the group consisting of CaO, MgO, and BaO), and a powdered ceramic; in which the amount of the powdered borosilicate-based glass is about 40% to 49% by weight based on the total amount of the composition for a ceramic substrate, and the amount of the powdered ceramic is about 60% to 51% by weight based on the total amount of the composition for a ceramic substrate.

摘要翻译： 公开了一种用于陶瓷基材的组合物，其包含以下混合物：粉末状硼硅酸盐玻璃，其包含约5％至17.5％重量的B 2 O 3，约28％至44％重量的SiO 2，0重量％至约20重量％ 的Al 2 O 3和约36〜50重量％的MO（其中MO是选自CaO，MgO和BaO中的至少一种）和陶瓷粉末; 其中基于陶瓷基材的组合物的总量，硼硅酸玻璃粉末的量为约40重量％至49重量％，并且粉末状陶瓷的量为约60重量％至51重量％ 关于陶瓷基材的组合物的总量。

公开(公告)号：US07619491B2

公开(公告)日：2009-11-17

申请号：US12274411

申请日：2008-11-20

申请人： Toshiaki Takata ,  Osamu Yokokura

发明人： Toshiaki Takata ,  Osamu Yokokura

IPC分类号： H03H9/72 ,  H03H9/64

CPC分类号： H03H9/0576 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/30111 ,  H03H9/725 ,  H01L2924/00

摘要： An elastic wave duplexer includes a transmission filter chip and a reception filter chip each defined by an elastic wave filter chip and flip-chip bonded to a laminated board. A coil-shaped line including coil-shaped line patterns is provided inside the laminated board. The coil-shaped line defines an impedance matching circuit. In plan view, the transmission filter chip is disposed on one side of a center line passing through the approximate center of the laminated board and extending between a first edge and a second edge, and the reception filter chip is disposed on the other side of the center line. The coil-shaped line is disposed on the side on which the reception filter chip is disposed.

摘要翻译： 弹性波双工器包括传输滤波器芯片和接收滤波器芯片，每个接收滤波器芯片由弹性波滤波器芯片和倒装芯片结合到层压板上而定义。 在层叠板内设置有包括线圈状线状的线圈状线。 线圈形线路限定了阻抗匹配电路。 在平面图中，透射滤光片芯片配置在穿过层叠板的大致中心的中心线的一侧，并且在第一边缘和第二边缘之间延伸，并且接收滤波器芯片设置在 中心线。 线圈状线设置在配置有接收滤波器芯片的一侧。