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公开(公告)号：US20070298587A1
公开(公告)日：2007-12-27
申请号：US11762336
申请日：2007-06-13
Applicant: Jongkook Park , Jeffrey Sercel , Patrick Sercel
Inventor： Jongkook Park , Jeffrey Sercel , Patrick Sercel
CPC classification number: H01L21/268 , B23K26/0732 , B23K26/0838 , B23K26/40 , B23K26/53 , B23K26/57 , B23K2101/40 , B23K2103/172 , H01L21/78 , H01L21/7806 , H01L33/0079 , H01L2221/68363 , H01L2924/0002 , H01L2924/00
Abstract: A lift off process is used to separate a layer of material from a substrate by irradiating an interface between the layer of material and the substrate. According to one exemplary process, the layer is separated into a plurality of sections corresponding to dies on the substrate and a homogeneous beam spot is shaped to cover an integer number of the sections.
Abstract translation: 剥离过程用于通过照射材料层和基底之间的界面来分离材料层与基底。 根据一个示例性工艺，该层被分离成与衬底上的管芯对应的多个部分，并且均匀的束斑被成形为覆盖整数个部分。
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公开(公告)号：US20060003553A1
公开(公告)日：2006-01-05
申请号：US11215248
申请日：2005-08-30
Applicant: Jongkook Park , Jeffrey Sercel , Patrick Sercel
Inventor： Jongkook Park , Jeffrey Sercel , Patrick Sercel
IPC: H01L21/301 , H01L21/46 , H01L21/78
CPC classification number: H01L21/268 , B23K26/0732 , B23K26/0838 , B23K26/40 , B23K26/53 , B23K26/57 , B23K2101/40 , B23K2103/172 , H01L21/78 , H01L21/7806 , H01L33/0079 , H01L2221/68363 , H01L2924/0002 , H01L2924/00
Abstract: A lift off process is used to separate a layer of material from a substrate by irradiating an interface between the layer of material and the substrate. According to one exemplary process, the layer is separated into a plurality of sections corresponding to dies on the substrate and a homogeneous beam spot is shaped to cover an integer number of the sections.
Abstract translation: 剥离过程用于通过照射材料层和基底之间的界面来分离材料层与基底。 根据一个示例性工艺，该层被分离成与衬底上的管芯对应的多个部分，并且均匀的束斑被成形为覆盖整数个部分。
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公开(公告)号：US20070017908A1
公开(公告)日：2007-01-25
申请号：US11195348
申请日：2005-08-02
Applicant: Patrick Sercel , Jeffrey Sercel
Inventor： Patrick Sercel , Jeffrey Sercel
IPC: B23K26/06
CPC classification number: B23K26/0732 , B23K26/0622 , B23K26/066 , B23K26/0738 , B23K26/0823 , B23K26/38 , B23K2101/04 , B23K2103/42 , B23K2103/50
Abstract: A laser machining system and method uses a shaped laser beam, such as a long, narrow beam, and effectively scans the beam in the narrow direction across a mask having an aperture pattern. The pattern on the mask is imaged onto a moving workpiece and the patterned laser beam selectively removes material from the workpiece. The workpiece may be moved using a coordinated synchronized rotational motion. The laser may use a longer wavelength (e.g., 248 nm) and the beam may be scanned at a high rate of speed to reduce the dissipation of the residual thermal energy in the material being machined. In one embodiment, this system and method may be used to machine a complex pattern into a curved surface with relatively high resolution and high speeds.
Abstract translation: 激光加工系统和方法使用诸如长的窄光束的成形激光束，并且有效地沿着窄方向扫描具有孔径图案的掩模的光束。 掩模上的图案被成像到移动的工件上，并且图案化的激光束选择性地从工件中去除材料。 可以使用协调的同步旋转运动来移动工件。 激光器可以使用更长的波长（例如，248nm），并且可以以高速率扫描光束，以减少被加工材料中剩余热能的耗散。 在一个实施例中，该系统和方法可用于将复杂图案加工成具有相对高分辨率和高速度的曲面。
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公开(公告)号：US20050227455A1
公开(公告)日：2005-10-13
申请号：US11008589
申请日：2004-12-09
Applicant: Jongkook Park , Jeffrey Sercel , Patrick Sercel
Inventor： Jongkook Park , Jeffrey Sercel , Patrick Sercel
CPC classification number: H01L21/268 , B23K26/0732 , B23K26/0838 , B23K26/40 , B23K26/53 , B23K26/57 , B23K2101/40 , B23K2103/172 , H01L21/78 , H01L21/7806 , H01L33/0079 , H01L2221/68363 , H01L2924/0002 , H01L2924/00
Abstract: A lift off process is used to separate a layer of material from a substrate by irradiating an interface between the layer of material and the substrate. According to one exemplary process, the layer is separated into a plurality of sections corresponding to dies on the substrate and a homogeneous beam spot is shaped to cover an integer number of the sections.
Abstract translation: 剥离过程用于通过照射材料层和基底之间的界面来分离材料层与基底。 根据一个示例性工艺，该层被分离成与衬底上的管芯对应的多个部分，并且均匀的束斑被成形为覆盖整数个部分。
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