Nondestructive fluid transfer device
    1.
    发明授权
    Nondestructive fluid transfer device 失效
    非破坏性流体输送装置

    公开(公告)号:US07691046B2

    公开(公告)日:2010-04-06

    申请号:US11482791

    申请日:2006-07-10

    申请人: Paul J. Sullivan

    发明人: Paul J. Sullivan

    IPC分类号: A61M1/12

    摘要: Fluid transfer device configured as a vacuum pump particularly suited for nondestructive transfer of fluids, including blood and blood constituents. Fluid transfer device used for assisting in the pumping of blood through a patient's heart for reducing the load on the heart, reducing forces and blood pressure on the inner walls of the heart is reduced. Examples are aortic assist device, a ventricular assist device, or artificial heart. Industrial applications include the pumping of fluids, including destructible fluids such as foodstuff with or without food constituents of various sizes within the foodstuff. Food and other fluids may be stored until they are dispensed. By use of a vacuum, the device is operated at no more than atmospheric pressure. A pre-charged pressure tank may be used, such as where fluid pressure of the pumped fluid, including backpressure of body fluids, where pressure greater than atmospheric is required to expel pumped fluid.

    摘要翻译: 流体输送装置被配置为真空泵,特别适用于非破坏性地传输流体,包括血液和血液成分。 用于帮助通过患者心脏泵送血液以减少心脏负荷的流体输送装置减少心脏内壁上的力和血压。 实例是主动脉辅助装置,心室辅助装置或人造心脏。 工业应用包括泵送流体,包括可破坏流体,例如具有或不具有食品中各种尺寸的食物成分的食品。 食物和其他液体可能被储存,直到它们被分配。 通过使用真空,该装置在不超过大气压下运行。 可以使用预充电的压力罐,例如在需要压力大于大气压的情况下泵送流体的流体压力,包括体液的背压,以排出泵送的流体。

    CLEAVE INITIATION USING VARYING ION IMPLANT DOSE
    2.
    发明申请
    CLEAVE INITIATION USING VARYING ION IMPLANT DOSE 有权
    使用变化的离子植入剂进行清洁启动

    公开(公告)号:US20090209084A1

    公开(公告)日:2009-08-20

    申请号:US12119170

    申请日:2008-05-12

    IPC分类号: H01L21/30

    CPC分类号: H01L21/76254

    摘要: An approach for providing a cleave initiation using a varying ion implant dose is described. In one embodiment, there is a method of forming a substrate. In this embodiment, a semiconductor material is provided and implanted with a spatially varying dose of one or more ion species. A handler substrate is attached to the implanted semiconductor material. A cleave of the implanted semiconductor material is initiated from the handler substrate at a preferential location that is a function of a dose gradient that develops from the spatially varying dose of one or more ion species implanted into the semiconductor material

    摘要翻译: 描述了使用变化的离子注入剂量提供切割引发的方法。 在一个实施例中,存在形成衬底的方法。 在该实施例中,提供半导体材料并且注入空间变化的一种或多种离子种类的剂量。 处理衬底附着到植入的半导体材料上。 植入的半导体材料的切割在优先位置从处理器基底开始,该优先位置是从注入到半导体材料中的一种或多种离子种类的空间变化剂量形成的剂量梯度的函数

    Darkfield inspection system having a programmable light selection array
    8.
    发明授权
    Darkfield inspection system having a programmable light selection array 有权
    具有可编程光选择阵列的暗场检查系统

    公开(公告)号:US07199874B2

    公开(公告)日:2007-04-03

    申请号:US11297028

    申请日:2005-12-07

    IPC分类号: G01N21/88

    摘要: An inspection tool embodiment includes an illumination source for directing a light beam onto a workpiece to generate scattered light that includes the ordinary scattering pattern of the workpiece as well as light scattered from defects of the workpiece. The embodiment includes a programmable light selection array that receives light scattered from the workpiece and selectively directs the light scattered from defects onto a photosensor which detects the defect signal. Processing circuitry receives the defect signal and conducts surface analysis of the workpiece that can include the characterizing of defects of the workpiece. The programmable light selection arrays can include, but are not limited to, reflector arrays and filter arrays. The invention also includes associated surface inspection methods.

    摘要翻译: 检查工具实施例包括用于将光束引导到工件上以产生散射光的照明源,其包括工件的普通散射图案以及从工件的缺陷散射的光。 该实施例包括可编程光选择阵列,其接收从工件散射的光并选择性地将从缺陷散射的光引导到检测缺陷信号的光电传感器上。 处理电路接收缺陷信号并进行可能包括工件缺陷表征的工件的表面分析。 可编程光选择阵列可以包括但不限于反射器阵列和滤波器阵列。 本发明还包括相关的表面检查方法。

    Darkfield inspection system having a programmable light selection array
    9.
    发明授权
    Darkfield inspection system having a programmable light selection array 有权
    具有可编程光选择阵列的暗场检查系统

    公开(公告)号:US07002677B2

    公开(公告)日:2006-02-21

    申请号:US10714257

    申请日:2003-11-14

    IPC分类号: G01N21/88

    摘要: An inspection tool embodiment includes an illumination source for directing a light beam onto a workpiece to generate scattered light that includes the ordinary scattering pattern of the workpiece as well as light scattered from defects of the workpiece. The embodiment includes a programmable light selection array that receives light scattered from the workpiece and selectively directs the light scattered from defects onto a photosensor which detects the defect signal. Processing circuitry receives the defect signal and conducts surface analysis of the workpiece that can include the characterizing of defects of the workpiece. The programmable light selection arrays can include, but are not limited to, reflector arrays and filter arrays. The invention also includes associated surface inspection methods.

    摘要翻译: 检查工具实施例包括用于将光束引导到工件上以产生散射光的照明源,其包括工件的普通散射图案以及从工件的缺陷散射的光。 该实施例包括可编程光选择阵列,其接收从工件散射的光并选择性地将从缺陷散射的光引导到检测缺陷信号的光电传感器上。 处理电路接收缺陷信号并进行可能包括工件缺陷表征的工件的表面分析。 可编程光选择阵列可以包括但不限于反射器阵列和滤波器阵列。 本发明还包括相关的表面检查方法。