公开(公告)号：US06802946B2

公开(公告)日：2004-10-12

申请号：US09855059

申请日：2001-05-15

申请人： Bulent M. Basol ,  Paul Lindquist

发明人： Bulent M. Basol ,  Paul Lindquist

IPC分类号： C25D1700

CPC分类号： C25D17/001 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/76877 ,  Y10S204/07

摘要： An apparatus which can control thickness uniformity during deposition of conductive material from an electrolyte onto a surface of a semiconductor substrate is provided. The apparatus has an anode which can be contacted by the electrolyte during deposition of the conductive material, a cathode assembly including a carrier adapted to carry the substrate for movement during deposition, and a conductive element permitting electrolyte flow therethrough. A mask lies over the conductive element and has openings permitting electrolyte flow. The openings define active regions of the conductive element by which a rate of conductive material deposition onto the surface can be varied. A power source can provide a potential between the anode and the cathode assembly so as to produce the deposition. A deposition process is also disclosed, and uniform electroetching of conductive material on the semiconductor substrate surface can additionally be performed.

摘要翻译： 提供了一种可以控制将导电材料从电解质沉积到半导体衬底的表面上的厚度均匀性的装置。 该装置具有在导电材料沉积期间可被电解质接触的阳极，包括适于在沉积期间运送基底的载体的阴极组件和允许电解质流过其中的导电元件。 掩模位于导电元件上方并具有允许电解质流动的开口。 这些开口限定导电元件的有源区，通过该有源区可以改变表面上的导电材料沉积速率。 电源可以在阳极和阴极组件之间提供电位，以便产生沉积。 还公开了沉积工艺，并且可以额外地执行导电材料在半导体衬底表面上的均匀电蚀刻。

公开(公告)号：US07435323B2

公开(公告)日：2008-10-14

申请号：US10869850

申请日：2004-06-18

申请人： Bulent M. Basol ,  Paul Lindquist

发明人： Bulent M. Basol ,  Paul Lindquist

IPC分类号： C25D5/04 ,  C25D5/22 ,  C25D7/12 ,  C25F3/16

CPC分类号： C25D17/001 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/76877 ,  Y10S204/07

摘要： An apparatus which can control thickness uniformity during deposition of conductive material from an electrolyte onto a surface of a semiconductor substrate is provided. The apparatus has an anode which can be contacted by the electrolyte during deposition of the conductive material, a cathode assembly including a carrier adapted to carry the substrate for movement during deposition, and a conductive element permitting electrolyte flow therethrough. A mask lies over the conductive element and has openings permitting electrolyte flow. The openings define active regions of the conductive element by which a rate of conductive material deposition onto the surface can be varied. A power source can provide a potential between the anode and the cathode assembly so as to produce the deposition. A deposition process is also disclosed, and uniform electroetching of conductive material on the semiconductor substrate surface can additionally be performed.

摘要翻译： 提供了一种可以控制将导电材料从电解质沉积到半导体衬底的表面上的厚度均匀性的装置。 该装置具有在导电材料沉积期间可被电解质接触的阳极，包括适于在沉积期间运送基底的载体的阴极组件和允许电解质流过其中的导电元件。 掩模位于导电元件上方并具有允许电解质流动的开口。 这些开口限定导电元件的有源区域，通过该有源区域可以改变表面上的导电材料沉积速率。 电源可以在阳极和阴极组件之间提供电位，以便产生沉积。 还公开了沉积工艺，并且可以额外地执行导电材料在半导体衬底表面上的均匀电蚀刻。

公开(公告)号：US20070176493A1

公开(公告)日：2007-08-02

申请号：US11232502

申请日：2005-09-22

申请人： Roy Koski ,  David Schieble ,  James Gray ,  Alan Clapp ,  Paul Lindquist

发明人： Roy Koski ,  David Schieble ,  James Gray ,  Alan Clapp ,  Paul Lindquist

IPC分类号： H02J3/00 ,  H02J1/10

CPC分类号： H02J1/10 ,  H02J7/0024 ,  H02J7/0026 ,  H02J13/0003 ,  Y10T307/25 ,  Y10T307/50 ,  Y10T307/505

摘要： The present invention is a method and system for powering a patient monitoring system. The present invention is a modular patient monitoring system utilizing a bi-directional power bus to efficiently couple a multi-parameter acquisition device, a display and any number of expansion modules. Each coupled device includes a battery, enabling each device to send or receive power through the bi-directional bus. The method and system of the present invention utilizes power from any single battery or from any number of the batteries in the system, as charge is not transferred from one battery to another. The present invention allows for the batteries to charge when it is operated from AC mains derived power.

摘要翻译： 本发明是一种为病人监护系统供电的方法和系统。 本发明是利用双向电力总线来有效耦合多参数采集装置，显示器和任意数量的扩展模块的模块化患者监视系统。 每个耦合设备包括一个电池，使每个设备能够通过双向总线发送或接收电力。 本发明的方法和系统利用来自任何单个电池或系统中任何数量的电池的电力，因为电荷不从一个电池转移到另一个电池。 本发明允许电池在从AC电源获得的电力下操作时进行充电。

公开(公告)号：US06821409B2

公开(公告)日：2004-11-23

申请号：US10117991

申请日：2002-04-05

申请人： Bulent M. Basol ,  Cyprian E. Uzoh ,  Paul Lindquist ,  Homayoun Talieh

发明人： Bulent M. Basol ,  Cyprian E. Uzoh ,  Paul Lindquist ,  Homayoun Talieh

IPC分类号： B23H308

CPC分类号： C25D17/001 ,  B23H5/08 ,  C25D5/22 ,  C25F3/14 ,  C25F7/00 ,  H01L21/32134

摘要： The present invention applies an electrochemical etching solution to a material layer, preferably a metal layer, disposed on a workpiece, in the presence of a current. This electrochemical etching solution supplies to the material on the substrate surface the species to form an intermediate compound on the surface that can be more easily mechanically removed as intermediate compound fragments than the material. By removing the intermediate compound fragments, the process allows more efficient use of the supplied current to form another layer of intermediate compound that can also be mechanically removed, rather than using the current to result in another compound on the surface of the material that eventually dissolves into the solution. In another aspect of the invention, such intermediate compound particulates are externally generated and used to mechanically remove the surface layer of the material. Such intermediate particulates do not contaminate, and thus allow for more efficient material removal, as well as plating to occur within the same chamber, if desired.

摘要翻译： 本发明在存在电流的情况下将电化学蚀刻溶液应用于设置在工件上的材料层，优选金属层。 该电化学蚀刻溶液向基材表面上的材料提供物质，以在表面上形成中间体化合物，其可以比材料作为中间体化合物片段更容易地机械去除。 通过去除中间体化合物片段，该方法允许更有效地使用所提供的电流以形成也可机械去除的另一层中间体化合物，而不是使用电流导致最终溶解的材料表面上的另一种化合物 进入解决方案。 在本发明的另一方面，这种中间体化合物颗粒是外部生成的并用于机械地去除材料的表面层。 如果需要，这样的中间颗粒不会污染，因此允许更有效的材料去除以及电镀发生在相同的室内。

公开(公告)号：US06413403B1

公开(公告)日：2002-07-02

申请号：US09621969

申请日：2000-07-21

申请人： Paul Lindquist ,  Bulent Basol ,  Cyprian Uzoh ,  Homayoun Talieh

发明人： Paul Lindquist ,  Bulent Basol ,  Cyprian Uzoh ,  Homayoun Talieh

IPC分类号： C25D500

CPC分类号： B24B37/26 ,  B23H5/08 ,  C25D17/001 ,  C25D17/14

摘要： An apparatus capable of assisting in controlling an electrolyte flow and distribution of an electric field, a magnetic field, or an electromagnetic field in order to process a substrate is provided with improved fluid distribution. A support member having a top surface and a bottom surface contains at least one support member electrolyte channel. Each support member electrolyte channel forms a passage between the top surface and the bottom surface and allows the electrolyte to flow therethrough. A pad is attachable to the support member and contains at least one set of pad electrolyte channels also allowing for electrolyte flow therethrough to the substrate. Each support member electrolyte channel is connected to one set of pad electrolyte channels by fluid distribution structure. A method of assisting in control of the electrolyte flow and distribution of the electric field, the magnetic field, or the electromagnetic field, utilizing the apparatus, is also provided.

摘要翻译： 能够有助于控制电解质流动和电场分布，磁场或电磁场以便处理衬底的装置提供改进的流体分布。 具有顶表面和底表面的支撑构件包含至少一个支撑构件电解质通道。 每个支撑构件电解质通道在顶表面和底表面之间形成通道，并允许电解质流过其中。 衬垫可附接到支撑构件并且包含至少一组衬垫电解质通道，还允许电解质流过衬底。 每个支撑构件电解质通道通过流体分配结构连接到一组垫片电解质通道。 还提供了一种利用该装置协助控制电解质流动和分布电场，磁场或电磁场的方法。

公开(公告)号：US20050133380A1

公开(公告)日：2005-06-23

申请号：US10996165

申请日：2004-11-22

申请人： Bulent Basol ,  Cyprian Uzoh ,  Paul Lindquist ,  Homayoun Talieh

发明人： Bulent Basol ,  Cyprian Uzoh ,  Paul Lindquist ,  Homayoun Talieh

IPC分类号： B23H5/08 ,  C25D5/22 ,  C25D7/12 ,  C25F3/14 ,  C25F7/00 ,  H01L21/3213 ,  B23H3/00

CPC分类号： C25D17/001 ,  B23H5/08 ,  C25D5/22 ,  C25F3/14 ,  C25F7/00 ,  H01L21/32134

摘要： The present invention applies an electrochemical etching solution to a material layer, preferably a metal layer, disposed on a workpiece, in the presence of a current. This electrochemical etching solution supplies to the material on the substrate surface the species to form an intermediate compound on the surface that can be more easily mechanically removed as intermediate compound fragments than the material. By removing the intermediate compound fragments, the process allows more efficient use of the supplied current to form another layer of intermediate compound that can also be mechanically removed, rather than using the current to result in another compound on the surface of the material that eventually dissolves into the solution. In another aspect of the invention, such intermediate compound particulates are externally generated and used to mechanically remove the surface layer of the material. Such intermediate particulates do not contaminate, and thus allow for more efficient material removal, as well as plating to occur within the same chamber, if desired.

摘要翻译： 本发明在存在电流的情况下将电化学蚀刻溶液应用于设置在工件上的材料层，优选金属层。 该电化学蚀刻溶液向基材表面上的材料提供物质，以在表面上形成中间体化合物，其可以比材料作为中间体化合物片段更容易地机械去除。 通过去除中间体化合物片段，该方法允许更有效地使用所提供的电流以形成也可机械去除的另一层中间体化合物，而不是使用电流在材料表面上产生最终溶解的另一种化合物 进入解决方案。 在本发明的另一方面，这种中间体化合物颗粒是外部生成的并用于机械地去除材料的表面层。 如果需要，这样的中间颗粒不会污染，因此允许更有效的材料去除以及电镀发生在相同的室内。