公开(公告)号：US20060250781A1

公开(公告)日：2006-11-09

申请号：US10562252

申请日：2004-06-04

申请人： Michael Bauer ,  Wolfram Eurskens ,  Rudolf Kerter ,  Heinz Pape ,  Peter Strobe ,  Stephan Stoeckl

发明人： Michael Bauer ,  Wolfram Eurskens ,  Rudolf Kerter ,  Heinz Pape ,  Peter Strobe ,  Stephan Stoeckl

IPC分类号： H05K1/09

CPC分类号： H05K1/184 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0284 ,  H05K3/105 ,  H05K3/46 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/0919 ,  H05K2201/10446 ,  H05K2203/102 ,  H05K2203/108 ,  H05K2203/1131 ,  H05K2203/1136

摘要： An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.