公开(公告)号：US20050263503A1

公开(公告)日：2005-12-01

申请号：US10524982

申请日：2003-07-18

Applicant: Rudolf Brzesowsky ,  Abraham Balkenende ,  Raymond Gijsbertus Van Agthoven ,  Petrus Timmermans ,  Nicolaas Willard

Inventor： Rudolf Brzesowsky ,  Abraham Balkenende ,  Raymond Gijsbertus Van Agthoven ,  Petrus Timmermans ,  Nicolaas Willard

IPC: B23K26/38 ,  B23K26/073 ,  B23K26/14 ,  B23K26/40 ,  B28D5/00 ,  C03B33/09 ,  C03B33/095 ,  B26F3/16

CPC classification number: B23K26/073 ,  B23K26/146 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/52 ,  B28D5/0011 ,  C03B33/091 ,  Y10T225/12 ,  Y10T225/304

Abstract: The invention relates to a method of breaking a substrate of a brittle material, the method comprising the steps of providing a substrate (1) of a brittle material, heating the substrate with a laser beam (3) to create a heated spot on the substrate, moving the laser beam and the substrate with respect to each other to create a line of heated spots on the substrate (2), cooling the heated spots on the substrate by locally applying a cooling medium (4) behind the heated spots such that a micro-crack is propagated in the line of heated spots, and breaking the substrate along the line of the propagated micro-cracks by applying a mechanical force on the substrate wherein, the cooling medium comprises an aqueous surfactant solution. The surfactants will connect to the broken siloxane bonds inside the surface cracks. Then recombination and healing of the broken siloxane bonds will not occur and the required breaking load will remain constant over time.

Abstract translation: 本发明涉及一种破碎脆性材料的基材的方法，所述方法包括以下步骤：提供脆性材料的基材（1），用激光束（3）加热基材以在基材上产生加热点 相对于彼此移动激光束和衬底以在衬底（2）上产生一线加热点，通过在加热点之后局部施加冷却介质（4）来冷却衬底上的加热点，使得 微裂纹在加热点的线中传播，并且通过在基底上施加机械力来破坏基底，沿着传播的微裂纹的线，其中冷却介质包含表面活性剂水溶液。 表面活性剂将连接到表面裂纹内的破裂的硅氧烷键。 然后，破裂的硅氧烷键的复合和愈合将不会发生，并且所需的断裂载荷随时间保持恒定。