MASK DESIGN AND OPC FOR DEVICE MANUFACTURE
    1.
    发明申请
    MASK DESIGN AND OPC FOR DEVICE MANUFACTURE 失效
    掩模设计和OPC设备制造

    公开(公告)号:US20110318672A1

    公开(公告)日:2011-12-29

    申请号:US12824037

    申请日:2010-06-25

    IPC分类号: G03F1/00 G06F17/50

    CPC分类号: G03F1/36 G03F1/68 G06F17/50

    摘要: Described herein is mask design and modeling for a set of masks to be successively imaged to print a composite pattern on a substrate, such as a semiconductor wafer. Further described herein is a method of double patterning a substrate with the set of masks. Also described herein is a method of correcting a drawn pattern of one of the mask levels based on a predicted pattern contour of the other of the mask levels. Also described herein is a method of modeling a resist profile contour for a mask level in which photoresist is applied onto a inhomogeneous substrate, as well as method of predicting a resist profile of a Boolean operation of two masks.

    摘要翻译: 这里描述的是要连续成像以在诸如半导体晶片的衬底上打印复合图案的一组掩模的掩模设计和建模。 本文进一步描述的是使用该组掩模对衬底进行双重图案化的方法。 这里还描述了一种基于掩模级别中的另一个的预测图案轮廓来校正掩模级中的一个的绘制图案的方法。 本文还描述了一种对光致抗蚀剂施加到非均匀衬底上的掩模级的抗蚀剂轮廓轮廓建模方法,以及预测两个掩模的布尔运算的抗蚀剂轮廓的方法。

    Mask design and OPC for device manufacture
    2.
    发明授权
    Mask design and OPC for device manufacture 失效
    面罩设计和OPC设备制造

    公开(公告)号:US08404403B2

    公开(公告)日:2013-03-26

    申请号:US12824037

    申请日:2010-06-25

    IPC分类号: G03F1/68

    CPC分类号: G03F1/36 G03F1/68 G06F17/50

    摘要: Described herein is mask design and modeling for a set of masks to be successively imaged to print a composite pattern on a substrate, such as a semiconductor wafer. Further described herein is a method of double patterning a substrate with the set of masks. Also described herein is a method of correcting a drawn pattern of one of the mask levels based on a predicted pattern contour of the other of the mask levels. Also described herein is a method of modeling a resist profile contour for a mask level in which photoresist is applied onto a inhomogeneous substrate, as well as method of predicting a resist profile of a Boolean operation of two masks.

    摘要翻译: 这里描述的是要连续成像以在诸如半导体晶片的衬底上打印复合图案的一组掩模的掩模设计和建模。 本文进一步描述的是使用该组掩模对衬底进行双重图案化的方法。 这里还描述了一种基于掩模级别中的另一个的预测图案轮廓来校正掩模级中的一个的绘制图案的方法。 本文还描述了一种对光致抗蚀剂施加到非均匀衬底上的掩模级的抗蚀剂轮廓轮廓建模方法,以及预测两个掩模的布尔运算的抗蚀剂轮廓的方法。

    Mask design and OPC for device manufacture
    3.
    发明授权
    Mask design and OPC for device manufacture 失效
    面罩设计和OPC设备制造

    公开(公告)号:US08778605B2

    公开(公告)日:2014-07-15

    申请号:US13762083

    申请日:2013-02-07

    IPC分类号: G03F1/68 G03F1/36

    CPC分类号: G03F1/36 G03F1/68 G06F17/50

    摘要: Described herein is mask design and modeling for a set of masks to be successively imaged to print a composite pattern on a substrate, such as a semiconductor wafer. Further described herein is a method of double patterning a substrate with the set of masks. Also described herein is a method of correcting a drawn pattern of one of the mask levels based on a predicted pattern contour of the other of the mask levels. Also described herein is a method of modeling a resist profile contour for a mask level in which photoresist is applied onto a inhomogeneous substrate, as well as method of predicting a resist profile of a Boolean operation of two masks.

    摘要翻译: 这里描述的是要连续成像以在诸如半导体晶片的衬底上打印复合图案的一组掩模的掩模设计和建模。 本文进一步描述的是使用该组掩模对衬底进行双重图案化的方法。 这里还描述了一种基于掩模级别中的另一个的预测图案轮廓来校正掩模级中的一个的绘制图案的方法。 本文还描述了一种对光致抗蚀剂施加到非均匀衬底上的掩模级的抗蚀剂轮廓轮廓建模方法,以及预测两个掩模的布尔运算的抗蚀剂轮廓的方法。