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1.
公开(公告)号:US20140030847A1
公开(公告)日:2014-01-30
申请号:US13559626
申请日:2012-07-27
申请人: Rama Krishna KOTLANKA , Rakesh KUMAR , Premachandran CHIRAYARIKATHUVEEDU SANKARAPILLAI , Huamao LIN , Pradeep YELEHANKA
发明人: Rama Krishna KOTLANKA , Rakesh KUMAR , Premachandran CHIRAYARIKATHUVEEDU SANKARAPILLAI , Huamao LIN , Pradeep YELEHANKA
IPC分类号: H01L21/762
CPC分类号: B81B7/0006 , B81C1/00269 , B81C3/001 , B81C2201/0115 , H01L21/50 , H01L23/481 , H01L23/5226 , H01L2924/0002 , H01L2924/00
摘要: A bonded device having at least one porosified surface is disclosed. The porosification process introduces nanoporous holes into the microstructure of the bonding surfaces of the devices. The material property of a porosified material is softer as compared to a non-porosified material. For the same bonding conditions, the use of the porosified bonding surfaces enhances the bond strength of the bonded interface as compared to the non-porosified material.
摘要翻译: 公开了具有至少一个孔隙化表面的粘合装置。 孔化过程将纳米多孔孔引入装置的结合表面的微结构中。 与非孔隙化材料相比,孔化材料的材料性质更软。 对于相同的接合条件,与非孔隙化材料相比,使用孔隙化粘合表面增强了粘结界面的粘结强度。
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公开(公告)号:US08513767B2
公开(公告)日:2013-08-20
申请号:US13052134
申请日:2011-03-21
申请人: Rama Krishna Kotlanka , Rakesh Kumar , Premachandran Chirayarikathuveedu Sankarapillai , Pradeep Ramachandramurthy Yelehanka
发明人: Rama Krishna Kotlanka , Rakesh Kumar , Premachandran Chirayarikathuveedu Sankarapillai , Pradeep Ramachandramurthy Yelehanka
IPC分类号: H01L23/48 , H01L21/768 , H01L21/76
CPC分类号: H01L21/76898 , B81B7/007 , B81B2207/095 , B81B2207/096 , H01L23/147 , H01L23/481 , H01L23/49827 , H01L2224/16225 , H01L2924/01322 , H01L2924/1461 , H01L2924/15311 , H01L2924/00
摘要: A method for forming a device is disclosed. A support substrate having first and second major surfaces is provided. An interconnect is formed through the first and second major surfaces in the support substrate. The interconnect has first and second portions. The first portion extends from one of the first or second major surfaces and the second portion extends from the other of the first and second major surfaces. The interconnect includes a partial via plug having a conductive material in a first portion of the interconnect. The via plug has a bottom at about an interface of the first and second portions. The second portion of the interconnect is heavily doped with dopants of a first polarity type.
摘要翻译: 公开了一种用于形成装置的方法。 提供具有第一和第二主表面的支撑基板。 通过支撑衬底中的第一和第二主表面形成互连。 互连具有第一和第二部分。 第一部分从第一或第二主表面中的一个延伸,第二部分从第一和第二主表面中的另一个延伸。 互连包括在互连的第一部分中具有导电材料的部分通孔塞。 通孔塞在第一和第二部分的界面的大约一个界面处具有底部。 互连的第二部分用第一极性类型的掺杂剂重掺杂。
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3.
公开(公告)号:US08940616B2
公开(公告)日:2015-01-27
申请号:US13559626
申请日:2012-07-27
申请人: Rama Krishna Kotlanka , Rakesh Kumar , Premachandran Chirayarikathuveedu Sankarapillai , Huamao Lin , Pradeep Yelehanka
发明人: Rama Krishna Kotlanka , Rakesh Kumar , Premachandran Chirayarikathuveedu Sankarapillai , Huamao Lin , Pradeep Yelehanka
CPC分类号: B81B7/0006 , B81C1/00269 , B81C3/001 , B81C2201/0115 , H01L21/50 , H01L23/481 , H01L23/5226 , H01L2924/0002 , H01L2924/00
摘要: A bonded device having at least one porosified surface is disclosed. The porosification process introduces nanoporous holes into the microstructure of the bonding surfaces of the devices. The material property of a porosified material is softer as compared to a non-porosified material. For the same bonding conditions, the use of the porosified bonding surfaces enhances the bond strength of the bonded interface as compared to the non-porosified material.
摘要翻译: 公开了具有至少一个孔隙化表面的粘合装置。 孔化过程将纳米多孔孔引入装置的结合表面的微结构中。 与非孔隙化材料相比,孔化材料的材料性质更软。 对于相同的接合条件,与非孔隙化材料相比,使用孔隙化粘合表面增强了粘结界面的粘结强度。
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公开(公告)号:US20120241901A1
公开(公告)日:2012-09-27
申请号:US13052134
申请日:2011-03-21
申请人: Rama Krishna KOTLANKA , Rakesh KUMAR , Premachandran CHIRAYARIKATHUVEEDU SANKARAPILLAI , Pradeep Ramachandramurthy YELEHANKA
发明人: Rama Krishna KOTLANKA , Rakesh KUMAR , Premachandran CHIRAYARIKATHUVEEDU SANKARAPILLAI , Pradeep Ramachandramurthy YELEHANKA
IPC分类号: H01L23/48 , H01L21/768 , H01L21/76
CPC分类号: H01L21/76898 , B81B7/007 , B81B2207/095 , B81B2207/096 , H01L23/147 , H01L23/481 , H01L23/49827 , H01L2224/16225 , H01L2924/01322 , H01L2924/1461 , H01L2924/15311 , H01L2924/00
摘要: A method for forming a device is disclosed. A support substrate having first and second major surfaces is provided. An interconnect is formed through the first and second major surfaces in the support substrate. The interconnect has first and second portions. The first portion extends from one of the first or second major surfaces and the second portion extends from the other of the first and second major surfaces. The interconnect includes a partial via plug having a conductive material in a first portion of the interconnect. The via plug has a bottom at about an interface of the first and second portions. The second portion of the interconnect is heavily doped with dopants of a first polarity type.
摘要翻译: 公开了一种用于形成装置的方法。 提供具有第一和第二主表面的支撑基板。 通过支撑衬底中的第一和第二主表面形成互连。 互连具有第一和第二部分。 第一部分从第一或第二主表面中的一个延伸,第二部分从第一和第二主表面中的另一个延伸。 互连包括在互连的第一部分中具有导电材料的部分通孔塞。 通孔塞在第一和第二部分的界面的大约一个界面处具有底部。 互连的第二部分用第一极性类型的掺杂剂重掺杂。
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