Abstract:
An integrated circuit package includes at least one one-time programmable element, such as a fuse, having a first end and a second end separated by a programmable link. The programmable element is positioned on a surface other than the top surface, e.g., a side surface or the bottom surface of the package substrate to render them less conspicuous to unscrupulous suppliers intent on tampering with the package. The information programmed by the fuses may relate to speed or voltage ratings for a microprocessor.
Abstract:
An improved multimode optical fiber having substantially higher bandwidth and lower loss is made by controlling process parameters such as the volume of the silica which is deposited in each pass of a torch assembly (41) along a substrate tube (31) to form a preform tube which is collapsed to provide a preform (80) from which the optical fiber is drawn. As a result, the amplitude variation of the refractive index across each layer is controlled to be within desired limits. Should the volume of the silica deposited in each pass be controlled to control the amplitude variation, the thicknesses of the outermost deposited glassy layers in the preform tube are greater and those of the innermost layers are less than those of layers in a preform tube made by prior art MCVD processes. Because the difference in the index of refraction across each glassy layer is reduced, the bandwidth is enhanced and the loss of the drawn optical fiber is reduced over those properties of optical fiber drawn from preforms made by prior art MCVD processes. Inasmuch as the inventive process also allows a higher deposition rate than before, it may be used to produce single-mode optical fiber at lower costs than before achieved.
Abstract:
A customizable environment is disclosed including an interactive presentation having a plurality of object placeholders, each for holding a presentable object or a presentable reference to an object. Each placeholder has a selector for selecting the presentable object or reference held therein and a selector for selecting the placeholder. The customizable interface further includes a data store for storing the presentable objects. The presentable objects are linked to indicate the relationship between the objects whereby the arrangement of the presentable objects, references, or both within the placeholders corresponds at least in part to the manner in which the presented objects and references are linked.
Abstract:
A carrier tray is provided for holding a semiconductor device that has a two dimensional array of regularly spaced rows and columns of holes having one and only one pitch and one and only one pocket size. The holes are configured to receive a solder ball from a ball grid array package. The carrier tray can engage at least two differently sized ball grid array packages, thereby avoiding the expense and long lag time associated with designing a new product carrier tray for each new semiconductor device.
Abstract:
A singulated article, such as a packaged semiconductor device is marked with a green laser, thereby broadening the scope of materials that can be marked vis-á-vis conventional infrared lasers.