Chemical-mechanical polishing system having a bi-material wafer backing film and two-piece wafer carrier
    1.
    发明授权
    Chemical-mechanical polishing system having a bi-material wafer backing film and two-piece wafer carrier 失效
    化学机械抛光系统具有双材料晶片背衬膜和两片晶片载体

    公开(公告)号:US06171513B2

    公开(公告)日:2001-01-09

    申请号:US09303471

    申请日:1999-04-30

    IPC分类号: B24B100

    CPC分类号: B24B37/30

    摘要: A system for chemical-mechanical polishing is described which includes a wafer backing film having concentric first and second portions, and a wafer carrier having corresponding first and second portions for mounting the portions of the wafer backing film thereon. The portions of the wafer backing film are of different materials. The second portion of the wafer backing film has an annular shape and surrounds the first portion; the second portion of the wafer carrier is adjustable with respect to the first portion of the wafer carrier in a vertical direction. The second portion of the wafer backing film is less compressible than the first portion, and is adjusted in the vertical direction so that the outer edge of the wafer is substantially sealed when backside air is applied to the wafer during a film removal process.

    摘要翻译: 描述了一种用于化学机械抛光的系统,其包括具有同心的第一和第二部分的晶片背衬膜,以及具有相应的第一和第二部分的晶片载体,用于将晶片背衬膜的部分安装在其上。 晶片背衬膜的部分是不同的材料。 晶片背衬膜的第二部分具有环形形状并围绕第一部分; 晶片载体的第二部分在垂直方向上相对于晶片载体的第一部分是可调节的。 晶片背衬膜的第二部分比第一部分可压缩性低,并且在垂直方向上被调节,使得当在膜去除过程中将背面空气施加到晶片时,晶片的外边缘基本上被密封。

    Laser ablation top surface reference chuck
    3.
    发明授权
    Laser ablation top surface reference chuck 失效
    激光烧蚀顶面参考卡盘

    公开(公告)号:US5905566A

    公开(公告)日:1999-05-18

    申请号:US838588

    申请日:1997-04-10

    IPC分类号: H01L21/68 H02N13/00

    CPC分类号: H02N13/00 H01L21/68

    摘要: A reference chuck which is used with a leveling device for holding microelectronic substrates and other electronic component substrates for laser ablation and other exposure processes, the chuck comprising a frame body for supporting the substrate to be processed, clamping means at the periphery of the frame body for holding the substrate to the frame body and elastomeric means for urging the substrate mounted in the reference chuck against the clamping means. The undersides of the clamping means which contacts the upper surface of the substrate forms in its tightened position a clamping plane which clamping plane is parallel with an established plane of the lower surface of the chuck. The reference chuck provides a very low profile envelope for use with conventional leveling devices and the top surface of the substrate and the lower surface of the reference chuck are in parallel planes when the chuck is placed on the working surface of the leveling device.

    摘要翻译: 一种与用于保持微电子基板和其他用于激光烧蚀和其他曝光工艺的电子部件基板的调平装置一起使用的参考卡盘,该卡盘包括用于支撑待加工基板的框架体,在框体周边的夹紧装置 用于将基板保持在框体上,以及用于将安装在基准卡盘中的基板推向夹紧装置的弹性装置。 夹紧装置的与基板的上表面接触的下侧在紧固位置形成夹紧平面,夹紧平面与卡盘的下表面的已建立的平面平行。 参考卡盘提供了一个非常低的外形,用于与传统的调平装置一起使用,当卡盘放置在整平装置的工作表面上时,基板的顶表面和基准卡盘的下表面处于平行的平面。

    Probe positioning actuator
    4.
    发明授权
    Probe positioning actuator 失效
    探头定位执行器

    公开(公告)号:US5153472A

    公开(公告)日:1992-10-06

    申请号:US732557

    申请日:1991-07-19

    IPC分类号: G01R1/067 H01F7/122 H01F7/16

    摘要: An actuator for use in positioning a probe. The actuator has a magnet, two C-shaped cores on opposite sides of the magnet, an electromagnetic coil, and an armature movably connected with the cores. The armature has a projecting face located over portions of both pole faces for each core for the entire range of motion of the armature. The armature is primarily retained with the cores by magnetic attraction by the magnet. The actuator also has an armature position sensor which can include either an optical sensor or a magnetic sensor. A test probe is mounted to the armature which can be preloaded and have dual springs to prevent scrubbing and increase contact force with an object being tested.

    摘要翻译: 用于定位探头的致动器。 致动器具有磁体,在磁体的相对侧上的两个C形磁芯,电磁线圈和与芯可移动地连接的衔铁。 衔铁具有在电枢的整个运动范围内的每个芯的两个极面的部分上方的突出面。 电枢通过磁体的磁吸引力主要保持在芯体上。 致动器还具有可包括光学传感器或磁性传感器的电枢位置传感器。 测试探针安装到电枢上,该电枢可以被预加载,并具有双弹簧以防止擦洗并增加与待测物体的接触力。