公开(公告)号：US08547288B2

公开(公告)日：2013-10-01

申请号：US12994048

申请日：2009-04-29

申请人： Manfred Rietzler ,  Raymond Freeman

发明人： Manfred Rietzler ,  Raymond Freeman

IPC分类号： H01Q9/28

CPC分类号： H01Q1/2208 ,  G06K19/07749 ,  H01Q9/26 ,  H01Q9/28

摘要： The present invention relates to an antenna arrangement (10) for the production of chip cards, in particular chip cards used in the UHF frequency range, having a substrate and a plurality of antenna conductor structures (11) formed on the substrate using a coating method, the antenna conductor structures having a terminal arrangement (24) for connecting the antenna conductor structures to a chip, wherein the substrate is formed as a substrate sheet (12), and the antenna conductor structures are disposed on the substrate sheet in a matrix arrangement (13) having a plurality of columns and rows.

摘要翻译： 本发明涉及一种用于制造芯片卡的天线装置（10），特别是在UHF频率范围内使用的芯片卡，具有基板和使用涂覆方法在基板上形成的多个天线导体结构（11） 所述天线导体结构具有用于将天线导体结构连接到芯片的端子装置（24），其中所述基板形成为基板（12），并且所述天线导体结构以矩阵布置在所述基板上 （13）具有多个列和行。

公开(公告)号：US20110074001A1

公开(公告)日：2011-03-31

申请号：US12994078

申请日：2009-05-14

申请人： Manfred Rietzler ,  Raymond Freeman

发明人： Manfred Rietzler ,  Raymond Freeman

IPC分类号： H01L23/02 ,  H01L21/50

CPC分类号： G06K19/07745 ,  G06K19/07703 ,  G06K19/07718 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention relates to a chip card and a method for the production of a chip card having a chip (21) which is arranged in a card body, and having a plurality of components (18, 19, 22) being electrically conductively connected to the chip by means of a conductor arrangement (20), wherein the card body is composed of a plurality of substrate layers (11, 12, 13) which are arranged in a layer structure, wherein the components and the conductor arrangement are arranged in different substrate layers, specifically a component layer arrangement and a connecting layer arrangement, and have contact surfaces (23, 24, 25, 26, 31, 32, 33, 34), which are disposed so as to overlap one another, for producing an electrically conductive contacting.

摘要翻译： 芯片卡和芯片卡的制造方法技术领域本发明涉及一种芯片卡及其制造方法，该芯片卡具有芯片（21），芯片（21）布置在卡体内，并且具有多个部件（18,19,22）导电地连接到 所述芯片通过导体装置（20）形成，其中，所述卡体由以层结构布置的多个基底层（11,12,13）组成，其中所述部件和所述导体布置被布置成不同的 衬底层，具体地是组件层布置和连接层布置，并且具有设置成彼此重叠的接触表面（23,24,25,26,31,32,33,34），用于产生电 导电接触。

公开(公告)号：US20110016703A1

公开(公告)日：2011-01-27

申请号：US12933711

申请日：2009-03-20

申请人： Manfred Rietzler ,  Raymond Freeman

发明人： Manfred Rietzler ,  Raymond Freeman

IPC分类号： H01Q17/00 ,  B23P19/00

CPC分类号： H01L24/86 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01082

摘要： The present invention relates to a method for application of a chip module to an antenna module, wherein antenna contact surfaces formed on an application side (36) of the chip module are contacted with contact surfaces of an antenna disposed on an antenna side of an antenna substrate in an electrically conductive manner, wherein a plurality of chip modules are arranged in a row arrangement on a sheet carrier and the row arrangement is supplied to a separating device arranged at the application location by means of a supply device, the chip module separated from the row arrangement is subsequently positioned on the antenna substrate by means of an application device and contacting of the antenna contact surfaces of the chip module with the contact surfaces of the antenna is performed. The invention further relates to a device for the application of a chip module to an antenna module.

摘要翻译： 本发明涉及一种将芯片模块应用于天线模块的方法，其中形成在芯片模块的应用侧（36）上的天线接触表面与设置在天线的天线侧的天线的接触表面接触 基板，其中多个芯片模块以行布置布置在片材载体上，并且行布置通过供应装置供应到布置在施加位置处的分离装置，芯片模块从 随后通过施加装置将行布置定位在天线基板上，并且执行芯片模块的天线接触表面与天线的接触表面的接触。 本发明还涉及一种将芯片模块应用于天线模块的装置。

公开(公告)号：US08669910B2

公开(公告)日：2014-03-11

申请号：US12994089

申请日：2009-04-28

申请人： Manfred Rietzler ,  Raymond Freeman

发明人： Manfred Rietzler ,  Raymond Freeman

IPC分类号： H01Q9/28

CPC分类号： G06K19/07749 ,  G06K19/07756 ,  G06K19/07786 ,  H01L23/49855 ,  H01L23/66 ,  H01L2924/0002 ,  H01Q1/2208 ,  H01Q1/2216 ,  H01Q9/28 ,  H01L2924/00

摘要： An antenna arrangement for a chip card includes an antenna conductor structure that is formed from a surface conductor. The antenna conductor structure includes a dipole arrangement arranged on a card substrate and that has a first antenna strand and a second antenna strand. The antenna conductor structure includes a terminal arrangement connecting the antenna conductor structure to a chip and for forming a transponder including the antenna conductor structure and the chip. A surface of the card substrate is divided into a grasping zone for handling the chip card and a transponder zone for arranging the transponder in such a manner that the grasping zone extends beyond a center region of the substrate surface and at least one lateral edge of the grasping zone is formed by a lateral edge of the substrate surface.

摘要翻译： 用于芯片卡的天线装置包括由表面导体形成的天线导体结构。 天线导体结构包括布置在卡片基板上并具有第一天线线和第二天线线的偶极装置。 天线导体结构包括将天线导体结构连接到芯片并形成包括天线导体结构和芯片的应答器的端子装置。 卡片基板的表面被分成用于处理芯片卡的抓握区域和用于布置应答器的应答器区域，使得抓取区域延伸超过基板表面的中心区域，并且至少一个侧边缘 抓握区由基板表面的侧边缘形成。

公开(公告)号：US20110074645A1

公开(公告)日：2011-03-31

申请号：US12994048

申请日：2009-04-29

申请人： Manfred Rietzler ,  Raymond Freeman

发明人： Manfred Rietzler ,  Raymond Freeman

IPC分类号： H01Q1/38 ,  H01Q9/28

CPC分类号： H01Q1/2208 ,  G06K19/07749 ,  H01Q9/26 ,  H01Q9/28

摘要： The present invention relates to an antenna arrangement (10) for the production of chip cards, in particular chip cards used in the UHF frequency range, having a substrate and a plurality of antenna conductor structures (11) formed on the substrate using a coating method, the antenna conductor structures having a terminal arrangement (24) for connecting the antenna conductor structures to a chip, wherein the substrate is formed as a substrate sheet (12), and the antenna conductor structures are disposed on the substrate sheet in a matrix arrangement (13) having a plurality of columns and rows.

摘要翻译： 本发明涉及一种用于制造芯片卡的天线装置（10），特别是在UHF频率范围内使用的芯片卡，具有基板和使用涂覆方法在基板上形成的多个天线导体结构（11） 所述天线导体结构具有用于将天线导体结构连接到芯片的端子装置（24），其中所述基板形成为基板（12），并且所述天线导体结构以矩阵布置在所述基板上 （13）具有多个列和行。

公开(公告)号：US08665172B2

公开(公告)日：2014-03-04

申请号：US12921700

申请日：2009-03-20

申请人： Manfred Rietzler ,  Raymond Freeman

发明人： Manfred Rietzler ,  Raymond Freeman

IPC分类号： H01Q21/00

CPC分类号： G06K19/07749 ,  G06K19/07747 ,  G06K19/07752 ,  G06K19/07779 ,  G06K19/07783 ,  H01L23/49855 ,  H01L2924/0002 ,  H01L2924/00

摘要： A chip carrier for contacting with a chip and an antenna is disposed on an antenna substrate. The chip carrier features a carrier substrate having a chip contact arrangement located at a distance from longitudinal ends of the carrier substrate for electrical contacting with a chip. The carrier substrate includes two antenna contact surfaces having the chip contact arrangement therebetween for electrical contacting with the antenna. The chip contact arrangement and the antenna contact surfaces are located on an application surface of the chip carrier. At least one insulation surface-is formed on the application surface between the chip contact arrangement and the antenna contact surfaces.

摘要翻译： 用于与芯片和天线接触的芯片载体设置在天线基板上。 芯片载体具有载体基板，其具有位于与载体基板的纵向端部一定距离处的芯片接触装置，用于与芯片电接触。 载体衬底包括两个天线接触表面，其间具有与天线电接触的芯片接触布置。 芯片接触布置和天线接触表面位于芯片载体的应用表面上。 至少一个绝缘表面形成在芯片接触装置和天线接触表面之间的施加表面上。

公开(公告)号：US08522422B2

公开(公告)日：2013-09-03

申请号：US12933711

申请日：2009-03-20

申请人： Manfred Rietzler ,  Raymond Freeman

发明人： Manfred Rietzler ,  Raymond Freeman

IPC分类号： H01Q17/00

CPC分类号： H01L24/86 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01082

摘要： A method for application of a chip module to an antenna module includes supplying a plurality of chip modules arranged in a row arrangement on a sheet carrier. Separating chip modules from the row arrangement and transferring the separated chip modules to a application device. The chip module separated from the row arrangement are subsequently positioned on the antenna substrate by the application device and contacting of the antenna contact surfaces of the chip module with the contact surfaces of the antenna is performed. The invention further relates to a device for the application of a chip module to an antenna module.

摘要翻译： 将芯片模块应用于天线模块的方法包括将以行排列布置的多个芯片模块提供在片载体上。 将芯片模块与行布置分离，并将分离的芯片模块传送到应用设备。 与行布置分离的芯片模块随后通过施加装置定位在天线基板上，并且执行芯片模块的天线接触表面与天线的接触表面的接触。 本发明还涉及一种将芯片模块应用于天线模块的装置。

公开(公告)号：US08505825B2

公开(公告)日：2013-08-13

申请号：US12921673

申请日：2009-03-13

申请人： Manfred Rietzler ,  Raymond Freeman

发明人： Manfred Rietzler ,  Raymond Freeman

IPC分类号： G06K19/02

CPC分类号： B42D25/305 ,  B32B37/142 ,  B32B37/182 ,  B32B37/185 ,  B32B2425/00 ,  B32B2519/02 ,  B42D25/00 ,  B42D25/45 ,  B42D2033/30 ,  B42D2033/46 ,  Y10T156/10 ,  Y10T428/24983

摘要： The present invention relates to a layered composite (10) for producing a card body comprising a chip module (12) for a chip card, having a substrate layer arrangement (11) for arranging the chip module, and having intermediate layers (18, 19) disposed on both sides of the substrate layer arrangement, each having a cover layer (21, 22), wherein the substrate layer arrangement and the cover layers are designed in relation to the intermediate layers such that the substrate layer arrangement and the cover layers are formed as layers having a relatively rigid shape and hard surfaces, and the intermediate layers are formed as layers having a relatively elastic shape and soft surfaces, and also relates to a method for producing a layered composite.

摘要翻译： 本发明涉及一种用于制造卡片体的层叠复合体（10），其包括用于芯片卡的芯片模块（12），具有用于布置芯片模块的基板层布置（11），并具有中间层（18,19） ），其设置在所述基板层布置的两侧，每个具有覆盖层（21,22），其中所述基底层布置和所述覆盖层相对于所述中间层设计，使得所述基底层布置和所述覆盖层是 形成为具有相对刚性形状和硬表面的层，并且中间层形成为具有相对弹性形状和软表面的层，并且还涉及层状复合材料的制造方法。

公开(公告)号：US20110181477A1

公开(公告)日：2011-07-28

申请号：US12994089

申请日：2009-04-28

申请人： Manfred Rietzler ,  Raymond Freeman

发明人： Manfred Rietzler ,  Raymond Freeman

IPC分类号： H01Q1/24

CPC分类号： G06K19/07749 ,  G06K19/07756 ,  G06K19/07786 ,  H01L23/49855 ,  H01L23/66 ,  H01L2924/0002 ,  H01Q1/2208 ,  H01Q1/2216 ,  H01Q9/28 ,  H01L2924/00

摘要： The present invention relates to an antenna arrangement for a chip card, comprising an antenna conductor structure (16) that is formed from a surface conductor, wherein the antenna conductor structure comprises a dipole arrangement (17) that is arranged on a card substrate (10) and that has a first antenna strand (18) and a second antenna strand (19), and the antenna conductor structure comprises a terminal arrangement (26) for connecting the antenna conductor structure to a chip and for forming a transponder comprising the antenna conductor structure and the chip, to wherein a surface (11) of the card substrate is divided into a grasping zone (12) for handling the chip card and a transponder zone (13) for arranging the transponder in such a manner that the grasping zone extends beyond a center region of the substrate surface and at least one lateral edge (32) of the grasping zone is formed by a lateral edge (34) of the substrate surface.

摘要翻译： 本发明涉及一种用于芯片卡的天线装置，包括由表面导体形成的天线导体结构（16），其中天线导体结构包括布置在卡片基板（10）上的偶极装置（17） ），并且其具有第一天线线（18）和第二天线线（19），并且天线导体结构包括用于将天线导体结构连接到芯片的端子装置（26），并且用于形成包括天线导体的应答器 结构和芯片，其中卡片基板的表面（11）被分成用于处理芯片卡的抓握区域（12）和用于布置应答器的应答器区域（13），使得抓握区域延伸 超过衬底表面的中心区域，并且抓握区域的至少一个侧边缘（32）由衬底表面的侧边缘（34）形成。

公开(公告)号：US20110006967A1

公开(公告)日：2011-01-13

申请号：US12921700

申请日：2009-03-20

申请人： Manfred Rietzler ,  Raymond Freeman

发明人： Manfred Rietzler ,  Raymond Freeman

IPC分类号： H01Q1/00 ,  H01Q7/00

CPC分类号： G06K19/07749 ,  G06K19/07747 ,  G06K19/07752 ,  G06K19/07779 ,  G06K19/07783 ,  H01L23/49855 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention relates to a chip carrier (15) for contacting with a chip (16) and an antenna (13) disposed on an antenna substrate (17, 54, 61), wherein the chip carrier features a strip-shaped carrier substrate (18) which is provided with a chip contact arrangement (29) located at a distance from longitudinal ends (25, 26) of the carrier substrate for electrical contacting with a chip and which is provided with two antenna contact surfaces (27, 28) having the chip contact arrangement therebetween for electrical contacting with the antenna, wherein the chip contact arrangement and the antenna contact surfaces are located on an application surface (31) of the chip carrier and at least one insulation surface (20) is formed on the application surface (20) between the chip contact arrangement and the antenna contact surfaces. The invention also relates to a chip carrier arrangement comprising a plurality of chip carriers which are disposed on a film-like sheet carrier in at least one row extending in the longitudinal direction of the sheet carrier, wherein the individual chip carriers extend in the longitudinal direction of the sheet carrier.

摘要翻译： 本发明涉及一种用于与芯片（16）和设置在天线基板（17,54,61）上的天线（13）接触的芯片载体（15），其中芯片载体具有带状载体基板 18），其设置有与载体基板的纵向端部（25,26）一定距离的芯片接触装置（29），用于与芯片电接触，并且设置有两个天线接触表面（27,28），其具有 其间的芯片接触布置与天线电接触，其中芯片接触装置和天线接触表面位于芯片载体的施加表面（31）上，并且至少一个绝缘表面（20）形成在施加表面上 （20）在芯片接触装置和天线接触表面之间。 本发明还涉及一种芯片载体装置，其包括多个芯片载体，所述多个芯片载体在片状载体的纵向延伸的至少一列中设置在薄膜状载体上，其中各个芯片载体在纵向方向上延伸 的片材载体。