公开(公告)号：US20100238331A1

公开(公告)日：2010-09-23

申请号：US12722069

申请日：2010-03-11

申请人： Taku Umebayashi ,  Hiroshi Takahashi ,  Reijiroh Shohji

发明人： Taku Umebayashi ,  Hiroshi Takahashi ,  Reijiroh Shohji

IPC分类号： H04N5/335 ,  H01L31/14 ,  H01L31/18 ,  H01L27/146

CPC分类号： H01L27/14634 ,  H01L21/76898 ,  H01L23/481 ,  H01L27/14612 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14687 ,  H01L27/1469 ,  H01L2224/11 ,  H04N5/225 ,  H04N5/374

摘要： A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.

摘要翻译： 提供了一种半导体器件作为背照式固态成像器件。 该器件通过将具有半成品状态的像素阵列的第一半导体晶片和具有半成品状态的逻辑电路的第二半导体晶片结合在一起而制造，使得第一半导体晶片成为薄膜，电 连接像素阵列和逻辑电路，使得像素阵列和逻辑电路成为成品状态，并将第一半导体晶片和第二半导体结合在一起成为微芯片。

公开(公告)号：US09451131B2

公开(公告)日：2016-09-20

申请号：US12722069

申请日：2010-03-11

申请人： Taku Umebayashi ,  Hiroshi Takahashi ,  Reijiroh Shohji

发明人： Taku Umebayashi ,  Hiroshi Takahashi ,  Reijiroh Shohji

IPC分类号： H01L21/00 ,  H01L31/062 ,  H01L31/113 ,  H04N5/225 ,  H01L27/146 ,  H04N5/374

CPC分类号： H01L27/14634 ,  H01L21/76898 ,  H01L23/481 ,  H01L27/14612 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14687 ,  H01L27/1469 ,  H01L2224/11 ,  H04N5/225 ,  H04N5/374

摘要： A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.

摘要翻译： 提供了一种半导体器件作为背照式固态成像器件。 该器件通过将具有半成品状态的像素阵列的第一半导体晶片和具有半成品状态的逻辑电路的第二半导体晶片结合在一起而制造，使得第一半导体晶片成为薄膜，电 连接像素阵列和逻辑电路，使得像素阵列和逻辑电路成为成品状态，并将第一半导体晶片和第二半导体结合在一起成为微芯片。