公开(公告)号：US20100167041A1

公开(公告)日：2010-07-01

申请号：US12457885

申请日：2009-06-24

申请人： Yousuke Matsuyama ,  Reiki Akita ,  Takuya Hasaki

发明人： Yousuke Matsuyama ,  Reiki Akita ,  Takuya Hasaki

IPC分类号： B32B3/26 ,  B05D5/00

CPC分类号： H05K3/0047 ,  H05K2203/0214 ,  H05K2203/0786 ,  H05K2203/127 ,  Y10T428/249953

摘要： A process for the production of an entry sheet for drilling a printed wiring board material, which process comprises forming a multi-layered water-soluble resin composition layer on at least one surface of a metal foil, wherein an aqueous solution of a water-soluble resin composition is applied to the metal foil, dried and solidified to form one water-soluble resin composition layer, the application, drying and solidification of the aqueous solution of the water-soluble resin composition are repeated at least once to form at least one water-soluble resin composition layer on the above one water-soluble resin composition layer, the multi-layered water-soluble resin composition layer is composed of these water-soluble resin composition layers, the multi-layered water-soluble resin composition layer has a thickness of at least 50 μm and is almost free from air bubbles, and an entry sheet for drilling a printed wiring board material obtained by the above process.

摘要翻译： 一种用于生产用于钻孔印刷线路板材料的入口板的方法，该方法包括在金属箔的至少一个表面上形成多层水溶性树脂组合物层，其中水溶性水溶液 将树脂组合物施加到金属箔上，干燥固化形成一个水溶性树脂组合物层，将水溶性树脂组合物的水溶液的涂布，干燥和固化重复至少一次以形成至少一种水 在上述一种水溶性树脂组合物层上的多层水溶性树脂组合物层中，多层水溶性树脂组合物层由这些水溶性树脂组合物层构成，多层水溶性树脂组合物层的厚度 至少为50μm，几乎没有气泡，以及用于钻孔通过上述方法获得的印刷线路板材料的入口板。

公开(公告)号：US09315673B2

公开(公告)日：2016-04-19

申请号：US13386201

申请日：2010-07-09

申请人： Takahiro Matsumoto ,  Hirotaka Tsuruya ,  Hajime Ban ,  Reiki Akita

发明人： Takahiro Matsumoto ,  Hirotaka Tsuruya ,  Hajime Ban ,  Reiki Akita

IPC分类号： C08K5/56 ,  H01B1/04 ,  B82Y30/00 ,  C09C1/56 ,  C01B31/02 ,  C08K7/04 ,  C08K9/04 ,  H01B3/00 ,  H05K1/03

CPC分类号： C09C1/56 ,  B82Y30/00 ,  C01B32/05 ,  C01P2004/03 ,  C01P2004/16 ,  C01P2004/32 ,  C01P2004/64 ,  C01P2006/40 ,  C08K7/04 ,  C08K9/04 ,  H01B3/004 ,  H05K1/0373 ,  H05K2201/0239 ,  H05K2201/0323 ,  Y10T428/2982

摘要： Provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed and further adding water thereto and a method for producing the same. Also, provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed, further adding a coupling agent having an alkoxide group and then adding water thereto and a method for producing the same. Further, provided is a high dielectric constant resin composite material obtained by blending the insulated ultrafine powder of the present invention with a resin in a volume ratio (insulated ultrafine powder/resin) falling in a range of 5/95 to 50/50.

摘要翻译： 提供一种通过将液体金属醇盐加入到其中分散有包含碳材料的导电超细粉末并进一步加入水的含甲醇的有机溶剂中获得的绝缘超微粉及其制备方法。 此外，提供了通过将液体金属醇盐添加到其中分散有包含碳材料的导电性超微粉末的含甲醇的有机溶剂中而进一步添加具有醇盐基团的偶联剂然后向其中加入水而获得的绝缘超细粉末， 其制造方法 此外，提供了通过将本发明的绝缘超细粉末与体积比（绝缘超细粉末/树脂）的树脂混合在5/95至50/50的范围内而获得的高介电常数树脂复合材料。

公开(公告)号：US20120142836A1

公开(公告)日：2012-06-07

申请号：US13386201

申请日：2010-07-09

申请人： Takahiro Matsumoto ,  Hirotaka Tsuruya ,  Hajime Ban ,  Reiki Akita

发明人： Takahiro Matsumoto ,  Hirotaka Tsuruya ,  Hajime Ban ,  Reiki Akita

IPC分类号： C08K5/56 ,  H01B1/04 ,  B82Y30/00

CPC分类号： C09C1/56 ,  B82Y30/00 ,  C01B32/05 ,  C01P2004/03 ,  C01P2004/16 ,  C01P2004/32 ,  C01P2004/64 ,  C01P2006/40 ,  C08K7/04 ,  C08K9/04 ,  H01B3/004 ,  H05K1/0373 ,  H05K2201/0239 ,  H05K2201/0323 ,  Y10T428/2982

摘要： Provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed and further adding water thereto and a method for producing the same. Also, provided are an insulated ultrafine powder obtained by adding liquid metal alkoxide to a methanol-containing organic solvent in which a conductive ultrafine powder comprising a carbon material is dispersed, further adding a coupling agent having an alkoxide group and then adding water thereto and a method for producing the same. Further, provided is a high dielectric constant resin composite material obtained by blending the insulated ultrafine powder of the present invention with a resin in a volume ratio (insulated ultrafine powder/resin) falling in a range of 5/95 to 50/50.

摘要翻译： 提供一种通过将液体金属醇盐加入到其中分散有包含碳材料的导电超细粉末并进一步加入水的含甲醇的有机溶剂中获得的绝缘超微粉及其制备方法。 此外，提供了通过将液体金属醇盐添加到其中分散有包含碳材料的导电性超微粉末的含甲醇的有机溶剂中而进一步添加具有醇盐基团的偶联剂然后向其中加入水而获得的绝缘超细粉末， 其制造方法 此外，提供了通过将本发明的绝缘超细粉末与体积比（绝缘超细粉末/树脂）的树脂混合在5/95至50/50的范围内而获得的高介电常数树脂复合材料。

公开(公告)号：US20070281181A1

公开(公告)日：2007-12-06

申请号：US11806015

申请日：2007-05-29

申请人： Reiki Akita ,  Shinya Komatsu ,  Takuya Hasaki

发明人： Reiki Akita ,  Shinya Komatsu ,  Takuya Hasaki

IPC分类号： B32B15/08 ,  B05D1/38 ,  B05D1/36

CPC分类号： H05K3/0047 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0214 ,  H05K2203/0786 ,  Y10T428/12569 ,  Y10T428/12736 ,  Y10T428/26 ,  Y10T428/265

摘要： There are provided a process for the production of an entry sheet for drilling, comprising preparing a water-soluble resin composition solution by using a mixed solvent containing water and isopropyl alcohol in a specific ratio as a solvent of a water-soluble resin composition, then applying the solution to a sheet-like base material and drying the resultant base material to form a resin layer on the base material, and a method of drilling a printed wiring board material using the above entry sheet. According to the present invention, the problems of remaining bubbles in the resin layer and a decrease in surface flatness and smoothness due to the occurrence of a ridge, which are caused because the melting point of the water-soluble resin is lower than the boiling point of water, are overcome, and an entry sheet for drilling excellent in hole position accuracy is provided.

摘要翻译： 提供了一种用于生产钻孔入口板的方法，包括通过使用含有特定比例的水和异丙醇的混合溶剂作为水溶性树脂组合物的溶剂制备水溶性树脂组合物溶液，然后 将该溶液施加到片状基材上，干燥所得基材以在基材上形成树脂层，以及使用上述条目片材对印刷线路板材料进行钻孔的方法。 根据本发明，由于水溶性树脂的熔点导致的树脂层中的气泡残留和由于发生脊的表面平坦度和平滑度的降低的问题低于沸点 的水，克服了，并且提供了一种钻孔准确性优异的钻孔入口板。

公开(公告)号：US09986644B2

公开(公告)日：2018-05-29

申请号：US12457885

申请日：2009-06-24

申请人： Yousuke Matsuyama ,  Reiki Akita ,  Takuya Hasaki

发明人： Yousuke Matsuyama ,  Reiki Akita ,  Takuya Hasaki

IPC分类号： H05K3/00

CPC分类号： H05K3/0047 ,  H05K2203/0214 ,  H05K2203/0786 ,  H05K2203/127 ,  Y10T428/249953

摘要： A process for the production of an entry sheet for drilling a printed wiring board material, which process comprises forming a multi-layered water-soluble resin composition layer on at least one surface of a metal foil, wherein an aqueous solution of a water-soluble resin composition is applied to the metal foil, dried and solidified to form one water-soluble resin composition layer, the application, drying and solidification of the aqueous solution of the water-soluble resin composition are repeated at least once to form at least one water-soluble resin composition layer on the above one water-soluble resin composition layer, the multi-layered water-soluble resin composition layer is composed of these water-soluble resin composition layers, the multi-layered water-soluble resin composition layer has a thickness of at least 50 μm and is almost free from air bubbles, and an entry sheet for drilling a printed wiring board material obtained by the above process.

公开(公告)号：US07641934B2

公开(公告)日：2010-01-05

申请号：US11806015

申请日：2007-05-29

申请人： Reiki Akita ,  Shinya Komatsu ,  Takuya Hasaki

发明人： Reiki Akita ,  Shinya Komatsu ,  Takuya Hasaki

IPC分类号： B05D3/02

CPC分类号： H05K3/0047 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0214 ,  H05K2203/0786 ,  Y10T428/12569 ,  Y10T428/12736 ,  Y10T428/26 ,  Y10T428/265

摘要： There are provided a process for the production of an entry sheet for drilling, comprising preparing a water-soluble resin composition solution by using a mixed solvent containing water and isopropyl alcohol in a specific ratio as a solvent of a water-soluble resin composition, then applying the solution to a sheet-like base material and drying the resultant base material to form a resin layer on the base material, and a method of drilling a printed wiring board material using the above entry sheet. According to the present invention, the problems of remaining bubbles in the resin layer and a decrease in surface flatness and smoothness due to the occurrence of a ridge, which are caused because the melting point of the water-soluble resin is lower than the boiling point of water, are overcome, and an entry sheet for drilling excellent in hole position accuracy is provided.

摘要翻译： 提供了一种用于生产钻孔入口板的方法，包括通过使用含有特定比例的水和异丙醇的混合溶剂作为水溶性树脂组合物的溶剂制备水溶性树脂组合物溶液，然后 将该溶液施加到片状基材上，干燥所得基材以在基材上形成树脂层，以及使用上述条目片材对印刷线路板材料进行钻孔的方法。 根据本发明，由于水溶性树脂的熔点导致的树脂层中的气泡残留和由于发生脊的表面平坦度和平滑度的降低的问题低于沸点 的水，克服了，并且提供了一种钻孔准确性优异的钻孔入口板。