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8 条记录 (耗时 0.014 秒)

    Portable data support with a break-off mini-chip card
    3.
    发明授权
    Portable data support with a break-off mini-chip card 失效
    便携式数据支持带有一个断开的小型芯片卡

    公开(公告)号：US06561432B1

    公开(公告)日：2003-05-13

    申请号：US09869289

    申请日：2001-10-11

    申请人： Klaus Vedder ,  Renee-Lucia Barak

    发明人： Klaus Vedder ,  Renee-Lucia Barak

    IPC分类号： G06K1906

    CPC分类号： G06K19/07739 ,  G06K19/077

    摘要： A portable data carrier with a break-out mini smart card embedded therein. The mini smart card is separated from the remaining card body by a free punch extending over substantial parts of the mini smart card. According to the invention, another rated breaking line is provided within the mini smart card, preferably consisting of a perforated line and permitting further reduction in size of the mini smart card.

    摘要翻译： 具有嵌入其中的突发性迷你智能卡的便携式数据载体。 迷你智能卡通过在迷你智能卡的主要部分上延伸的自由穿孔与剩余的卡体分开。 根据本发明，在迷你智能卡内提供另一个额定断线，优选地由穿孔线组成，并允许进一步减小迷你智能卡的尺寸。

    Carrier element to be incorporated into an identity card
    4.
    发明授权
    Carrier element to be incorporated into an identity card 失效
    运输单位要纳入身份证

    公开(公告)号：US5027190A

    公开(公告)日：1991-06-25

    申请号：US581394

    申请日：1990-09-12

    申请人： Yahya Haghiri-Tehrani ,  Renee-Lucia Barak

    发明人： Yahya Haghiri-Tehrani ,  Renee-Lucia Barak

    IPC分类号： B42D15/02 ,  B42D15/10 ,  G06K19/077

    CPC分类号： G06K19/07747 ,  G06K19/07745 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/01004 ,  H01L2924/01079

    摘要： A carrier element is described that has one or more ICs to be incorporated into an identity card or credit card. The carrier element comprises a substrate having on its surface a plurality of contact areas which are connected via connector paths to corresponding terminals of the IC disposed on the substrate. The IC, including the connections to the conductor paths, is protected from mechanical stresses by a cured casting compound. In order to prevent the casting compound from flowing off uncontrollably during its application, an opening is provided in the heat-set adhesive layer applied to one side of the substrate, said opening holding back the liquid resin during its application and acting as a limiting frame. The opening in the adhesive layer is located at least where the IC is to be disposed.

    摘要翻译： 描述了具有要包含在身份证或信用卡中的一个或多个IC的载体元件。 载体元件包括在其表面上具有多个接触区域的基板，该多个接触区域经由连接器路径连接到设置在基板上的IC的相应端子。 包括与导体路径的连接的IC被保护而不被固化的浇注化合物的机械应力。 为了防止浇注混合物在施加期间不受控制地流出，在施加到基材的一侧的热固性粘合剂层中设置有开口，所述开口在其应用期间阻止液体树脂并用作限制框架 。 粘合剂层中的开口至少位于要放置IC的位置。

    Electronic module and a data carrier having an electronic module
    5.
    发明授权
    Electronic module and a data carrier having an electronic module 失效
    电子模块和具有电子模块的数据载体

    公开(公告)号：US5834755A

    公开(公告)日：1998-11-10

    申请号：US567458

    申请日：1995-12-05

    申请人： Yahya Haghiri-Tehrani ,  Renee-Lucia Barak

    发明人： Yahya Haghiri-Tehrani ,  Renee-Lucia Barak

    IPC分类号： B42D15/10 ,  G06K19/077 ,  G06K19/00

    CPC分类号： G06K19/07728 ,  G06K19/07743 ,  G06K19/07745 ,  H01L2224/48091 ,  H01L2924/01079 ,  H01L2924/3511

    摘要： A lead frame module to be incorporated in data carriers is presented which is divided into two areas, namely a central area receiving the sensitive components of the module, and an outer area protruding beyond the edge of the central area and serving to glue the lead frame module to the data carrier. To prevent forces from being transmitted from the outer area of the electronic module to the central area upon bending loads of the data carrier, the outer area is decoupled mechanically from the central area. This can be done for example by providing partial discontinuities including relieving punchings in the transition between the central and outer area.

    摘要翻译： 本发明提供一种引入框架模块，其被并入数据载体中，其分为两个区域，即接收模块的敏感部件的中心区域和突出超出中心区域边缘的外部区域，并用于将引线框架 模块到数据载体。 为了防止在数据载体的弯曲载荷时力从电子模块的外部区域传递到中心区域，外部区域与中心区域机械地分离。 这可以例如通过提供部分不连续性来实现，包括在中心区域和外部区域之间的过渡中缓解穿孔。

    Method for incorporating a carrier element
    6.
    发明授权
    Method for incorporating a carrier element 失效
    用于结合载体元件的方法

    公开(公告)号：US5514240A

    公开(公告)日：1996-05-07

    申请号：US237154

    申请日：1994-05-03

    申请人： Yahya Hagiiiri-Teiirani ,  Renee-Lucia Barak

    发明人： Yahya Hagiiiri-Teiirani ,  Renee-Lucia Barak

    IPC分类号： B42D15/10 ,  G06K19/077 ,  G07F7/08 ,  B32B31/18

    CPC分类号： G06K19/07718 ,  G06K19/07745 ,  H01L2924/0002 ,  Y10S283/904 ,  Y10T156/1056 ,  Y10T156/1062 ,  Y10T156/107

    摘要： The invention relates to a method for incorporating a carrier element or module in a card body. The card body is provided with a recess shaped accordingly for incorporating the carrier element. The carrier element comprises a substrate on which an integrated circuit is disposed. Before the carrier element is incorporated a contact adhesive element is first introduced into the recess by means of a suitable tool. The carrier element can then be connected firmly and permanently with the card body with the aid of the contact adhesive element under the action of pressure.

    摘要翻译： 本发明涉及一种将载体元件或模块结合在卡体内的方法。 卡体设置有相应地形成用于结合载体元件的凹部。 载体元件包括其上设置集成电路的基板。 在引入载体元件之前，首先通过合适的工具将接触粘合元件引入凹部中。 然后可以在压力作用下借助于接触粘合元件将载体元件牢固地永久地连接到卡体上。

    Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame
    7.
    发明授权
    Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame 失效
    使用粘合阻挡框架制造封装半导体封装的方法

    公开(公告)号：US5304513A

    公开(公告)日：1994-04-19

    申请号：US60704

    申请日：1993-05-13

    申请人： Yahya Haghiri-Tehrani ,  Renee-Lucia Barak

    发明人： Yahya Haghiri-Tehrani ,  Renee-Lucia Barak

    IPC分类号： G06K19/077 ,  H01L21/52 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60

    CPC分类号： G06K19/07747 ,  G06K19/07745 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/01079

    摘要： A process for manufacturing a carrier element is described that has one or more ICs to be incorporated into an identity card or credit card. The carrier element comprises a substrate having on its surface a plurality of contact areas which are connected via connector paths to corresponding terminals of the IC disposed on the substrate. The IC, including the connections to the conductor paths, is protected from mechanical stresses by a cured casting compound. In order to prevent the casting compound from flowing off uncontrollably during its application, an opening is provided in the heat-set adhesive layer applied to one side of the substrate, said opening holding back the liquid resin during its application and acting as a limiting frame. The opening in the adhesive layer is located at least where the IC is to be disposed.

    摘要翻译： 描述了一种用于制造载体元件的方法，其具有要被并入身份证或信用卡中的一个或多个IC。 载体元件包括在其表面上具有多个接触区域的基板，该多个接触区域经由连接器路径连接到设置在基板上的IC的相应端子。 包括与导体路径的连接的IC被保护而不被固化的浇注化合物的机械应力。 为了防止浇注混合物在施加期间不受控制地流出，在施加到基材的一侧的热固性粘合剂层中设置有开口，所述开口在其应用期间阻止液体树脂并用作限制框架 。 粘合剂层中的开口至少位于要放置IC的位置。