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公开(公告)号：US08430482B2
公开(公告)日：2013-04-30
申请号：US12893124
申请日：2010-09-29
CPC分类号： B41J2/1601 , B41J2/1607 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1635
摘要： A micro-fluid ejection head has multiple ejection chips joined adjacently to create a lengthy array across a media to-be-imaged. The chips have fluid firing elements arranged to seamlessly stitch together fluid ejections from adjacent chips. Each chip aligns with other chips at peripheral regions having edge tolerances closer than elsewhere along the periphery. The tolerances result from both etching and dicing during chip singulation. Etching occurs at the areas of alignment. Dicing occurs elsewhere. Etching techniques include deep reactive ion etching or wet etching. It cuts a planar periphery through an entire thickness of the wafer. The etching may also occur simultaneously with etching a fluid via. Dicing techniques include blade, laser or ion beam. It cuts an entire remainder of the periphery connecting the portions already etched to free single chips from the wafer. Edge tolerances, planar shapes, dicing lines, etch patterns, and wafer layout provide still further embodiments.
摘要翻译： 微流体喷射头具有相邻连接的多个喷射芯片，以跨越待成像的介质产生冗长的阵列。 芯片具有布置成将来自相邻芯片的流体喷射无缝缝合的流体点火元件。 每个芯片与周边区域的其他芯片对准，其边缘容限比其他地方沿边缘更近。 在芯片单片化期间由于蚀刻和切割都产生公差。 蚀刻发生在对准区域。 切片发生在其他地方。 蚀刻技术包括深反应离子蚀刻或湿蚀刻。 它通过晶片的整个厚度切割平面周边。 蚀刻也可以在蚀刻流体通孔的同时进行。 切割技术包括刀片，激光或离子束。 它切割周边的整个剩余部分，连接已经被蚀刻的部分以从晶片释放单个芯片。 边缘公差，平面形状，切割线，蚀刻图案和晶片布局提供了另外的实施例。
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公开(公告)号：US20120075383A1
公开(公告)日：2012-03-29
申请号：US12893124
申请日：2010-09-29
IPC分类号： B41J2/155 , H01L21/304
CPC分类号： B41J2/1601 , B41J2/1607 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1635
摘要： A micro-fluid ejection head has multiple ejection chips joined adjacently to create a lengthy array across a media to-be-imaged. The chips have fluid firing elements arranged to seamlessly stitch together fluid ejections from adjacent chips. Each chip aligns with other chips at peripheral regions having edge tolerances closer than elsewhere along the periphery. The tolerances result from both etching and dicing during chip singulation. Etching occurs at the areas of alignment. Dicing occurs elsewhere. Etching techniques include deep reactive ion etching or wet etching. It cuts a planar periphery through an entire thickness of the wafer. The etching may also occur simultaneously with etching a fluid via. Dicing techniques include blade, laser or ion beam. It cuts an entire remainder of the periphery connecting the portions already etched to free single chips from the wafer. Edge tolerances, planar shapes, dicing lines, etch patterns, and wafer layout provide still further embodiments.
摘要翻译： 微流体喷射头具有相邻连接的多个喷射芯片，以跨越待成像的介质产生冗长的阵列。 芯片具有布置成将来自相邻芯片的流体喷射无缝缝合的流体点火元件。 每个芯片与周边区域的其他芯片对准，其边缘容限比其他地方沿边缘更近。 在芯片单片化期间由于蚀刻和切割都产生公差。 蚀刻发生在对准区域。 切片发生在其他地方。 蚀刻技术包括深反应离子蚀刻或湿蚀刻。 它通过晶片的整个厚度切割平面周边。 蚀刻也可以在蚀刻流体通孔的同时进行。 切割技术包括刀片，激光或离子束。 它切割周边的整个剩余部分，连接已经被蚀刻的部分以从晶片释放单个芯片。 边缘公差，平面形状，切割线，蚀刻图案和晶片布局提供了另外的实施例。
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公开(公告)号：US20120050408A1
公开(公告)日：2012-03-01
申请号：US12872215
申请日：2010-08-31
IPC分类号： B41J2/145
CPC分类号： B41J2/145 , B41J2002/14459 , B41J2202/18 , B41J2202/20
摘要： A micro-fluid ejection head has multiple ejection chips joined adjacently to create a lengthy array across a media to-be-imaged. The chips have fluid firing elements arranged along multiple fluid vias to seamlessly stitch together fluid ejections from different chips. Each of the chips has a shape defining a trapezoid. Adjacent chips are inverted from one to the next across the array. The geometry shortens a distance between same color fluid vias on adjacent chips. The fluid vias may parallel the two parallel sides of the trapezoid or only one non-parallel side. They may all have differing lengths. Same colored vias on adjacent chips may combine together to be equal to the length of fluid vias for other colors. Commonly configured modules define still other embodiments as do frames to seat the modules to define arrays of variable length. Singulating chips from larger wafers provide still further embodiments.
摘要翻译： 微流体喷射头具有相邻连接的多个喷射芯片，以跨越待成像的介质产生冗长的阵列。 芯片具有沿着多个流体通孔布置的流体激发元件，以将来自不同芯片的流体喷射无缝地缝合在一起。 每个芯片具有限定梯形的形状。 相邻的芯片从阵列中的一个到另一个相反。 几何缩小了相邻芯片上相同颜色的液体通道之间的距离。 流体通道可以平行于梯形的两个平行侧或仅一个非平行侧。 他们可能都有不同的长度。 相邻芯片上的相同的通孔可以组合在一起等于其它颜色的流体通孔的长度。 通常配置的模块还定义了其他实施例，作为将模块定位以定义可变长度的阵列的框架。 从较大的晶片制造芯片提供了另外的实施例。
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公开(公告)号：US07354794B2
公开(公告)日：2008-04-08
申请号：US11062019
申请日：2005-02-18
IPC分类号： H01L21/00
CPC分类号： B41J2/14072 , H01L2224/48091 , H01L2224/73265 , Y10T29/49401 , H01L2924/00014
摘要： Methods of connecting a circuit device to a semiconductor substrate and micro-fluid ejection devices made by the methods. One method includes printing an elongate strip of an electrically conductive fluid to electrically interconnect a first contact pad on a semiconductor substrate containing fluid ejection actuator devices with a second contact pad on an electrical trace circuit, wherein the electrical trace circuit is disposed adjacent to and spaced-apart from the semiconductor substrate. The electrically conductive fluid contains a liquid component and a conductive particle component. The liquid component is removed from the conductive particle component to provide a solid elongate strip of conductive material interconnecting the first contact pad and the second contact pad.
摘要翻译： 将电路装置与半导体基板连接的方法和由该方法制成的微流体喷射装置。 一种方法包括印刷导电流体的细长条以将包含流体喷射致动器装置的半导体衬底上的第一接触焊盘与电迹线电路上的第二接触焊盘电互连，其中电迹线电路邻近并间隔开 从半导体衬底放置。 导电流体包含液体组分和导电颗粒组分。 将液体组分从导电颗粒组分移除以提供将第一接触垫和第二接触垫相互连接的导电材料的实心细长带。
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公开(公告)号：US20110316930A1
公开(公告)日：2011-12-29
申请号：US12825851
申请日：2010-06-29
CPC分类号： B41J2/15 , B41J2/155 , B41J2202/19 , Y10T29/49401
摘要： A modular micro-fluid ejection device includes a carrier frame supporting pluralities of micro-fluid ejection modules. Each of the modules has a plate of nozzles defining a plane. Adjacent nozzle plates are substantially coplanar and registered with one another across the entirety of the carrier frame. Methods to mount the modules to the frame include, first, temporarily mounting one module and then another, and then permanently mounting both with a durable adhesive. Manufacturing systems include suction devices to hold a first module in place on a fixture while later modules are suctioned and registered to each other. Once set in place, a carrier frame is commonly contacted to the modules and the suction to released. Adhesives between the frame and modules cause the modules to separate from the fixture and transfer to the frame. All remain properly registered upon transfer.
摘要翻译： 模块化微流体喷射装置包括支撑多个微流体喷射模块的载体框架。 每个模块具有限定平面的喷嘴板。 相邻的喷嘴板基本上共面并且在整个载体框架上相互对准。 将模块安装到框架上的方法包括：首先临时安装一个模块，然后临时安装一个模块，然后用耐用的粘合剂永久地安装两个模块。 制造系统包括抽吸装置，以将第一模块保持在固定装置上的适当位置，而稍后模块被抽吸并彼此登记。 一旦设置到位，通常将载体框架与模块接触并且抽吸被释放。 框架和模块之间的粘合剂导致模块与夹具分离并传输到框架。 转让后，所有人都保持妥善的登记。
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公开(公告)号：US5005939A
公开(公告)日：1991-04-09
申请号：US499238
申请日：1990-03-26
申请人： Nicolaos C. Arvanitakis , Vincent J. BLack , Richard E. Corley, Jr. , Richard G. Nolan , Leonard T. Olson, Jr.
发明人： Nicolaos C. Arvanitakis , Vincent J. BLack , Richard E. Corley, Jr. , Richard G. Nolan , Leonard T. Olson, Jr.
CPC分类号： G02B6/4277 , G02B6/4204 , G02B6/4246 , G02B6/4292
摘要： An optoelectronic assembly for providing bidirectional data transmission between fiber optic means (e.g., a pair of optical fibers) and an electrical circuit member (e.g., a printed circuit board). The assembly includes a two-part housing with first and second receptacle sections designed for accommodating a pair of optoelectronic devices. One of these devices serves as a receiver and the other a transmitter. These devices are aligned within the housing and electrically connected to a substrate member (e.g., ceramic) also positioned within the housing. The substrate provides the necessary electrical functioning and is in turn electrically connected (e.g., via conductor pins) to the described circuit member, this connection occurring through an opening within the bottom portion of the two-part housing. The assembly is designed for coupling with individual optical fiber members or, alternatively with a common duplex connector having optical fibers therein.
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