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    Semi-compliant joining mechanism for semiconductor cooling applications
    1.
    发明授权
    Semi-compliant joining mechanism for semiconductor cooling applications 有权
    半合规半导体冷却应用的连接机制

    公开(公告)号：US07301773B2

    公开(公告)日：2007-11-27

    申请号：US10945807

    申请日：2004-09-20

    申请人： Richard Grant Brewer ,  Paul Tsao ,  Richard Herms ,  Mark Munch ,  Mark McMaster ,  Dave Corbin

    发明人： Richard Grant Brewer ,  Paul Tsao ,  Richard Herms ,  Mark Munch ,  Mark McMaster ,  Dave Corbin

    IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

    CPC分类号： H01L23/4006 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a vector that is collinear to the face-centered normal vector of the thermal interface of the heat source. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of mating force directed through the gimbal joint to the heat collection device. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.

    摘要翻译： 热收集装置使用包括万向接头的万向板安装在热源上。 万向节接头可以作为单点负载将作用于吸收装置的保持力作为单点负载。 保持力沿着与热源的热界面的面心法线向量共线的矢量施加。 这导致保持力在热界面区域上的平衡和集中应用。 万向节板使用弹簧装置直接安装到电路板上。 弹簧意味着调节通过万向节接头到集热装置的配合力的量。 由于万向节关节是旋转柔性的，构成热界面的两个配合面被强制并联配合。 以这种方式，产生高性能的TIM接口。

    Semi-compliant joining mechanism for semiconductor cooling applications
    2.
    发明申请
    Semi-compliant joining mechanism for semiconductor cooling applications 有权
    半合规半导体冷却应用的连接机制

    公开(公告)号：US20050270742A1

    公开(公告)日：2005-12-08

    申请号：US10945807

    申请日：2004-09-20

    申请人： Richard Brewer ,  Paul Tsao ,  Richard Herms ,  Mark Munch ,  Mark McMaster ,  Dave Corbin

    发明人： Richard Brewer ,  Paul Tsao ,  Richard Herms ,  Mark Munch ,  Mark McMaster ,  Dave Corbin

    IPC分类号： H01L23/40 ,  H01L23/473 ,  H05K7/20

    CPC分类号： H01L23/4006 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a vector that is collinear to the face-centered normal vector of the thermal interface of the heat source. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of mating force directed through the gimbal joint to the heat collection device. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.

    摘要翻译： 热收集装置使用包括万向接头的万向板安装在热源上。 万向节接头可以作为单点负载将作用于吸收装置的保持力作为单点负载。 保持力沿着与热源的热界面的面心法线向量共线的矢量施加。 这导致保持力在热界面区域上的平衡和集中应用。 万向节板使用弹簧装置直接安装到电路板上。 弹簧意味着调节通过万向节接头到集热装置的配合力的量。 由于万向节关节是旋转柔性的，构成热界面的两个配合面被强制并联配合。 以这种方式，产生高性能的TIM接口。

    Apparatus and method of efficient fluid delivery for cooling a heat producing device
    3.
    发明授权
    Apparatus and method of efficient fluid delivery for cooling a heat producing device 有权
    用于冷却发热装置的有效流体输送的装置和方法

    公开(公告)号：US07188662B2

    公开(公告)日：2007-03-13

    申请号：US11049313

    申请日：2005-02-01

    申请人： Richard Grant Brewer ,  Girish Upadhya ,  Peng Zhou ,  Mark McMaster ,  Paul Tsao

    发明人： Richard Grant Brewer ,  Girish Upadhya ,  Peng Zhou ,  Mark McMaster ,  Paul Tsao

    IPC分类号： F28D7/02

    CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat exchanger includes features for alleviating high pressure drops and controlling the expansion of fluid during freezing. The heat exchanger includes an interface layer in which heat is transferred from a heat source to a fluid. A manifold layer couples to the interface layer. The manifold layer includes a first set of substantially vertical fluid paths for directing the fluid to the interface layer. The manifold layer further includes a second set of substantially horizontal fluid paths, perpendicular to the first set of fluid paths, for removing the fluid from the interface layer. Preferably, the heat exchanger includes an upper layer for circulating the fluid to and from the manifold layer. The upper layer can include at least one of a plurality of protruding features and a porous structure. Preferably, a porous structure is disposed along the interface layer.

    摘要翻译： 热交换器包括用于缓解高压降和控制冷冻期间流体膨胀的特征。 热交换器包括热量从热源传递到流体的界面层。 歧管层耦合到界面层。 歧管层包括用于将流体引导到界面层的第一组基本垂直的流体路径。 歧管层还包括垂直于第一组流体路径的第二组基本水平的流体路径，用于从界面层移除流体。 优选地，热交换器包括用于将流体循环到歧管层和从歧管层循环的上层。 上层可以包括多个突出特征和多孔结构中的至少一个。 优选地，多孔结构沿着界面层设置。

    Liquid cooling loops for server applications
    9.
    发明申请
    Liquid cooling loops for server applications 有权
    用于服务器应用的液体冷却回路

    公开(公告)号：US20070201204A1

    公开(公告)日：2007-08-30

    申请号：US11707350

    申请日：2007-02-16

    申请人： Girish Upadhya ,  Mark Munch ,  Norman Chow ,  Paul Tsao ,  Douglas Werner ,  Mark McMaster ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

    发明人： Girish Upadhya ,  Mark Munch ,  Norman Chow ,  Paul Tsao ,  Douglas Werner ,  Mark McMaster ,  Frederic Landry ,  Ian Spearing ,  Tim Schrader

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20781 ,  H01L2924/0002 ,  H05K7/20727 ,  H05K7/20772 ,  H01L2924/00

    摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.

    摘要翻译： 液体冷却溶液，用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。 每个电子服务器包括一个或多个发热装置。 集成到每个电子服务器上是一种基于液体的冷却系统。 每个基于液体的冷却系统包括服务器泵和通过流体管线耦合在一起的一个或多个微通道冷板（MCP）。 用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP，服务器泵和排料板形成第一个闭环。 排料板通过热界面材料连接到底盘冷板。 在多电子服务器配置中，用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板，流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。