摘要:
The invention relates to a radiation detector and a method for its production, wherein a series of converter plates (110) and interconnect layers (120), which extend into a border volume (BV) lateral of the converter plates (110), are stacked. By filling voids in the border volume (BV) with an underfill material and cutting through the border volume, a contact surface (CS) is generated in which electrical leads (123) of the interconnect layers (120) lie free. To allow a good contacting, said leads (123) are preferably provided with enlargements in the contact surface, for example by bonding wires (132) to them.
摘要:
An electrical contact for a cadmium tellurium component, in particular a cadmium zinc tellurium component comprising a cadmium tellurium component, a first layer (21) formed onto the cadmium tellurium component (10), wherein the first layer (21) comprises indium and a contact agent (30) being bonded directly or indirectly to the first layer (21) to be in electrical contact with the first layer (21). The contact agent may be a stud bump or a conductive adhesive interconnect being bonded indirectly to the first layer via noble metal shielding layer.
摘要:
A radiation-sensitive detector includes a first substrate 202 with first and second opposing sides. The first side detects incident radiation, and the first substrate 202 produces a signal indicative of the detected radiation. At least one electrical contact 204 is located on the first substrate 202. An electrically conductive material 214 is coupled to the at least one electrical contact 204. The electrically conductive material 214 has a melting point in a range of about seventy-two (72) degrees Celsius to about ninety-five (95) degrees Celsius.
摘要:
An imaging detector is formed from a conversion material and electrodes that are separated by trenches formed in the conversion material. The trenches increase the distance of the conductance path between electrodes or accommodate a grid of electrodes, thereby reducing current leakage between electrodes. In some embodiments, a passivation layer is used to provide improved adhesion of the electrodes to the conversion material or to shield the electrodes from grid electrode structures.
摘要:
The invention relates to a radiation detector and a method for its production, wherein a series of converter plates (110) and interconnect layers (120), which extend into a border volume (BV) lateral of the converter plates (110), are stacked. By filling voids in the border volume (BV) with an underfill material and cutting through the border volume, a contact surface (CS) is generated in which electrical leads (123) of the interconnect layers (120) lie free. To allow a good contacting, said leads (123) are preferably provided with enlargements in the contact surface, for example by bonding wires (132) to them.
摘要:
A radiation-sensitive detector includes a first substrate 202 with first and second opposing sides. The first side detects incident radiation, and the first substrate 202 produces a signal indicative of the detected radiation. At least one electrical contact 204 is located on the first substrate 202. An electrically conductive material 214 is coupled to the at least one electrical contact 204. The electrically conductive material 214 has a melting point in a range of about seventy-two (72) degrees Celsius to about ninety-five (95) degrees Celsius.
摘要:
An imaging detector is formed from a conversion material and electrodes that are separated by trenches formed in the conversion material. The trenches increase the distance of the conductance path between electrodes or accommodate a grid of electrodes, thereby reducing current leakage between electrodes. In some embodiments, a passivation layer is used to provide improved adhesion of the electrodes to the conversion material or to shield the electrodes from grid electrode structures.
摘要:
An electrical contact for a detector, the electrical component, comprising a cadmium tellurium component, a first layer formed onto the cadmium tellurium component, wherein the first layer comprises indium and a contact agent being bonded directly or indirectly to the first layer to be in electrical contact with the first layer. The contact agent may be a stud bump or a conductive adhesive interconnect being bonded indirectly to the first layer via noble metal shielding layer.