公开(公告)号：US08461542B2

公开(公告)日：2013-06-11

申请号：US13062710

申请日：2009-09-01

申请人： Rob Van Asselt ,  Cornelis Slob ,  Nicolaas Johannes Anthonius Van Veen ,  Christian Baeumer ,  Roger Steadman Booker ,  Christoph Herrmann ,  Johannes Wilhelmus Weekamp ,  Klaus Jurgen Engel

发明人： Rob Van Asselt ,  Cornelis Slob ,  Nicolaas Johannes Anthonius Van Veen ,  Christian Baeumer ,  Roger Steadman Booker ,  Christoph Herrmann ,  Johannes Wilhelmus Weekamp ,  Klaus Jurgen Engel

IPC分类号： G01T1/24

CPC分类号： G01T1/2928

摘要： The invention relates to a radiation detector and a method for its production, wherein a series of converter plates (110) and interconnect layers (120), which extend into a border volume (BV) lateral of the converter plates (110), are stacked. By filling voids in the border volume (BV) with an underfill material and cutting through the border volume, a contact surface (CS) is generated in which electrical leads (123) of the interconnect layers (120) lie free. To allow a good contacting, said leads (123) are preferably provided with enlargements in the contact surface, for example by bonding wires (132) to them.

摘要翻译： 本发明涉及一种辐射检测器及其制造方法，其中一系列转换板（110）和互连层（120），其延伸到转换器板（110）的侧边的边界体积（BV）中， 。 通过用底部填充材料填充边界体积（BV）中的空隙并切割通过边界体积，产生接触表面（CS），其中互连层（120）的电引线（123）不存在。 为了允许良好的接触，所述引线（123）优选地设置在接触表面中的放大，例如通过将导线（132）接合到它们。

公开(公告)号：US20110168904A1

公开(公告)日：2011-07-14

申请号：US13062710

申请日：2009-09-01

申请人： Rob Van Asselt ,  Cornelis Slob ,  Nicolaas Johannes Anthonius Van Veen ,  Christian Baeumer ,  Roger Steadman Booker ,  Christoh Herrmann ,  Johannes Wilhelmus Weekamp ,  Klaus Jurgen Engel

发明人： Rob Van Asselt ,  Cornelis Slob ,  Nicolaas Johannes Anthonius Van Veen ,  Christian Baeumer ,  Roger Steadman Booker ,  Christoh Herrmann ,  Johannes Wilhelmus Weekamp ,  Klaus Jurgen Engel

IPC分类号： G01T1/24

CPC分类号： G01T1/2928

摘要： The invention relates to a radiation detector and a method for its production, wherein a series of converter plates (110) and interconnect layers (120), which extend into a border volume (BV) lateral of the converter plates (110), are stacked. By filling voids in the border volume (BV) with an underfill material and cutting through the border volume, a contact surface (CS) is generated in which electrical leads (123) of the interconnect layers (120) lie free. To allow a good contacting, said leads (123) are preferably provided with enlargements in the contact surface, for example by bonding wires (132) to them.

摘要翻译： 本发明涉及一种辐射检测器及其制造方法，其中一系列转换板（110）和互连层（120），其延伸到转换器板（110）的侧边的边界体积（BV）中， 。 通过用底部填充材料填充边界体积（BV）中的空隙并切割通过边界体积，产生接触表面（CS），其中互连层（120）的电引线（123）不存在。 为了允许良好的接触，所述引线（123）优选地设置在接触表面中的放大，例如通过将导线（132）接合到它们。

公开(公告)号：US20090091932A1

公开(公告)日：2009-04-09

申请号：US12298281

申请日：2007-04-19

申请人： Johannes Wilhelmus Weekamp ,  Cornelis Slob

发明人： Johannes Wilhelmus Weekamp ,  Cornelis Slob

IPC分类号： F21S4/00 ,  H01J9/24

CPC分类号： F21V21/002 ,  B21F45/00 ,  F21K9/90 ,  F21S4/15 ,  F21S4/28 ,  F21Y2115/10 ,  H01L33/62 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48465 ,  H01L2924/01047 ,  H01L2924/207 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/0002 ,  H01L2924/2076

摘要： Disclosed herein is a method for producing an LED array grid including the steps of (i) arranging N electrically conducting parallel wires, where N is an integer >1, thus creating an array of wires having a width D perpendicular to a direction of the wires, (ii) arranging LED components to the array of wires such that each LED component is electrically coupled to at least two adjacent wires, (iii) stretching the array of wires such that the width D increases, and arranging the stretched LED array grid onto a plate or between two plates

摘要翻译： 本文公开了一种制造LED阵列栅格的方法，包括以下步骤：（i）排列N导电平行导线，其中N为整数> 1，从而产生具有与导线方向垂直的宽度D的导线阵列 ，（ii）将LED组件布置到所述导线阵列中，使得每个LED组件电耦合到至少两个相邻的导线，（iii）拉伸所述线阵列，使得所述宽度D增加，以及将所述拉伸的LED阵列格栅布置到 一块板或两块板之间

公开(公告)号：US07884289B2

公开(公告)日：2011-02-08

申请号：US12297022

申请日：2007-04-11

申请人： Johannes W. Weekamp ,  Cornelis Slob ,  Jacob M. Scheer ,  Freerk E. Van Straten

发明人： Johannes W. Weekamp ,  Cornelis Slob ,  Jacob M. Scheer ,  Freerk E. Van Straten

IPC分类号： H05K7/02

CPC分类号： B81C1/00833 ,  B81C1/00269 ,  B81C2203/035 ,  H05K3/341 ,  H05K2201/10371 ,  H05K2201/10477 ,  H05K2203/1147 ,  Y02P70/613 ,  Y10T29/49117

摘要： The present invention relates to a method for manufacturing an electronic assembly (50) comprising an electronic component, a cavity and a substrate which method comprises; —providing an electronic component (10) having a first pattern with a substantially closed configuration; —providing a cover (18) on a surface of the electronic component, which cover together with said surface defines a cavity (20), the closed configuration of the first pattern substantially enclosing the cover at said surface; —providing a substrate (30) having a second pattern with a substantially closed configuration, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad; —disposing solder material at the solder pad; —positioning the electronic component and the substrate so as to align both the substantially closed configurations of the first and second pattern, while the substrate supports a top surface (28) of the cover; —reflow-soldering the solder material, therewith providing a soldered connection (52) between the first and second pattern. Furthermore the present invention relates to an electronic assembly (50), a cover (18) and a substrate (30).

摘要翻译： 本发明涉及一种用于制造电子组件（50）的方法，所述电子组件（50）包括电子部件，空腔和基板，所述方法包括： - 提供具有基本上封闭构造的第一图案的电子部件（10） - 提供与所述表面一起覆盖的所述电子部件的表面上的盖子（18）限定空腔（20），所述第一图案的所述封闭构造基本上在所述表面上包围所述盖子; - 提供具有基本封闭构造的第二图案的衬底（30），该封闭构造至少部分对应于第一图案的封闭构造，并且包括焊盘; - 在焊料垫上涂抹焊料; - 定位所述电子部件和所述基板，以使所述第一和第二图案的所述基本上封闭的构造对准，同时所述基板支撑所述盖的顶表面（28）; - 回流焊接焊料材料，从而在第一和第二图案之间提供焊接连接（52）。 此外，本发明涉及电子组件（50），盖（18）和基板（30）。

公开(公告)号：US07942551B2

公开(公告)日：2011-05-17

申请号：US12298281

申请日：2007-04-19

申请人： Johannes W. Weekamp ,  Cornelis Slob

发明人： Johannes W. Weekamp ,  Cornelis Slob

IPC分类号： F21S4/00

CPC分类号： F21V21/002 ,  B21F45/00 ,  F21K9/90 ,  F21S4/15 ,  F21S4/28 ,  F21Y2115/10 ,  H01L33/62 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48465 ,  H01L2924/01047 ,  H01L2924/207 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/0002 ,  H01L2924/2076

摘要： Disclosed herein is a method for producing an LED array grid including the steps of (i) arranging N electrically conducting parallel wires, where N is an integer>1, thus creating an array of wires having a width D perpendicular to a direction of the wires, (ii) arranging LED components to the array of wires such that each LED component is electrically coupled to at least two adjacent wires, (iii) stretching the array of wires such that the width D increases, and arranging the stretched LED array grid onto a plate or between two plates.

摘要翻译： 本文公开了一种制造LED阵列栅格的方法，包括以下步骤：（i）排列N导电平行导线，其中N为整数> 1，从而产生具有与导线方向垂直的宽度D的导线阵列 ，（ii）将LED组件布置到所述导线阵列中，使得每个LED组件电耦合到至少两个相邻的导线，（iii）拉伸所述线阵列，使得所述宽度D增加，以及将所述拉伸的LED阵列格栅布置到 一块板或两块板之间。

公开(公告)号：US20120170265A1

公开(公告)日：2012-07-05

申请号：US13496539

申请日：2010-09-10

申请人： Ralph Kurt ,  Cornelis Slob ,  Marc Andre De Samber ,  Michael Johan Ferdinand Marie Ter Laak ,  Gerard Kums ,  Egbert Lenderink ,  Marcellus Jacobus Johannes Van Der Lubbe ,  Mark Eduard Johan Sipkes

发明人： Ralph Kurt ,  Cornelis Slob ,  Marc Andre De Samber ,  Michael Johan Ferdinand Marie Ter Laak ,  Gerard Kums ,  Egbert Lenderink ,  Marcellus Jacobus Johannes Van Der Lubbe ,  Mark Eduard Johan Sipkes

IPC分类号： F21V9/00 ,  F21V21/00 ,  F21V29/00 ,  F21V7/00

CPC分类号： H05K1/181 ,  F21S2/005 ,  F21V23/06 ,  F21Y2113/13 ,  F21Y2115/10 ,  G02F1/133603 ,  G02F2001/133612 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05B33/0824 ,  H05K1/117 ,  H05K2201/09709 ,  H05K2201/10106 ,  H05K2201/10969 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00014

摘要： A light-emitting module (3a-c; 23; 26; 33a-c) comprising a plurality of light-sources (12a-e; 27a-h) arranged in at least a first and a second column (18a-b; 28a-c) arranged side by side and extending along a first direction of extension (X1) of the light-emitting module (3a-c; 23; 26; 33a-c); and a plurality of connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b), each being electrically connected to a corresponding one of the light-sources (3a-c; 23; 26; 33a-c) for enabling supply of electrical power thereto. Each connector terminal pair (13a-b, 14a-b, 15a-b, 16a-b 17a-b) comprises a first connector terminal (13a, 14a, 15a, 16a 17a) and a second connector terminal (13b, 14b, 15b, 16b 17b) being arranged at opposite sides of the light-emitting module (3a-c; 23; 26; 33a-c). The light-sources (12a-e; 27a-h) are arranged in a predetermined light-source sequence along the first direction of extension (X1) of the light-emitting module (3a-c; 23; 26; 33a-c), and the connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b) being electrically connected to the corresponding light-sources (12a-e; 27a-h) are arranged in the predetermined light-source sequence along the first direction of extension (X1) of the light-emitting module.

摘要翻译： 包括布置在至少第一和第二列（18a-b; 28a）中的多个光源（12a-e; 27a-h）的发光模块（3a-c; 23; 26; 33a-c） -c），沿着所述发光模块（3a-c; 23; 26; 33a-c）的第一延伸方向（X1）延伸; 以及多个连接器端子对（13a-b，14a-b，15a-b，16a-b 17a-b），每个连接器端子对电连接到相应的一个光源（3a-c; 23; 26; 33a-c），用于使其能够供电。 每个连接器端子对（13a-b，14a-b，15a-b，16a-b 17a-b）包括第一连接器端子（13a，14a，15a，16a 17a）和第二连接器端子（13b，14b，15b ，16b 17b）布置在发光模块（3a-c; 23; 26; 33a-c）的相对侧。 光源（12a-e; 27a-h）沿着发光模块（3a-c; 23; 26; 33a-c）的第一延伸方向（X1）以预定的光源顺序排列， ，并且电连接到对应的光源（12a-e; 27a-h）的连接器端子对（13a-b，14a-b，15a-b，16a-b 17a-b）被布置在预定的光 沿着发光模块的第一延伸方向（X1）的源序列。

公开(公告)号：US09743521B2

公开(公告)日：2017-08-22

申请号：US13496539

申请日：2010-09-10

申请人： Ralph Kurt ,  Cornelis Slob ,  Marc Andre De Samber ,  Michael Johan Ferdinand Marie Ter Laak ,  Gerard Kums ,  Egbert Lenderink ,  Marcellus Jacobus Johannes Van Der Lubbe ,  Mark Eduard Johan Sipkes

发明人： Ralph Kurt ,  Cornelis Slob ,  Marc Andre De Samber ,  Michael Johan Ferdinand Marie Ter Laak ,  Gerard Kums ,  Egbert Lenderink ,  Marcellus Jacobus Johannes Van Der Lubbe ,  Mark Eduard Johan Sipkes

IPC分类号： F21V9/00 ,  H05K1/18 ,  F21S2/00 ,  H05B33/08 ,  F21V23/06 ,  G02F1/1335 ,  H01L25/075 ,  H05K1/11 ,  F21Y115/10 ,  F21Y113/13

CPC分类号： H05K1/181 ,  F21S2/005 ,  F21V23/06 ,  F21Y2113/13 ,  F21Y2115/10 ,  G02F1/133603 ,  G02F2001/133612 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05B33/0824 ,  H05K1/117 ,  H05K2201/09709 ,  H05K2201/10106 ,  H05K2201/10969 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00014

摘要： A light-emitting module (3a-c; 23; 26; 33a-c) comprising a plurality of light-sources (12a-e; 27a-h) arranged in at least a first and a second column (18a-b; 28a-c) arranged side by side and extending along a first direction of extension (X1) of the light-emitting module (3a-c; 23; 26; 33a-c); and a plurality of connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b), each being electrically connected to a corresponding one of the light-sources (3a-c; 23; 26; 33a-c) for enabling supply of electrical power thereto. Each connector terminal pair (13a-b, 14a-b, 15a-b, 16a-b 17a-b) comprises a first connector terminal (13a, 14a, 15a, 16a 17a) and a second connector terminal (13b, 14b, 15b, 16b 17b) being arranged at opposite sides of the light-emitting module (3a-c; 23; 26; 33a-c). The light-sources (12a-e; 27a-h) are arranged in a predetermined light-source sequence along the first direction of extension (X1) of the light-emitting module (3a-c; 23; 26; 33a-c), and the connector terminal pairs (13a-b, 14a-b, 15a-b, 16a-b 17a-b) being electrically connected to the corresponding light-sources (12a-e; 27a-h) are arranged in the predetermined light-source sequence along the first direction of extension (X1) of the light-emitting module.

公开(公告)号：US20090159331A1

公开(公告)日：2009-06-25

申请号：US12297022

申请日：2007-04-11

申请人： Johannes W. Weekamp ,  Cornelis Slob ,  Jacob M. Scheer ,  Freerk E. Van Straten

发明人： Johannes W. Weekamp ,  Cornelis Slob ,  Jacob M. Scheer ,  Freerk E. Van Straten

IPC分类号： H05K7/02 ,  H05K1/11 ,  B23K1/00 ,  B23K37/00

CPC分类号： B81C1/00833 ,  B81C1/00269 ,  B81C2203/035 ,  H05K3/341 ,  H05K2201/10371 ,  H05K2201/10477 ,  H05K2203/1147 ,  Y02P70/613 ,  Y10T29/49117

摘要： The present invention relates to a method for manufacturing an electronic assembly (50) comprising an electronic component, a cavity and a substrate which method comprises; —providing an electronic component (10) having a first pattern with a substantially closed configuration; —providing a cover (18) on a surface of the electronic component, which cover together with said surface defines a cavity (20), the closed configuration of the first pattern substantially enclosing the cover at said surface; —providing a substrate (30) having a second pattern with a substantially closed configuration, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad; —disposing solder material at the solder pad; —positioning the electronic component and the substrate so as to align both the substantially closed configurations of the first and second pattern, while the substrate supports a top surface (28) of the cover; —reflow-soldering the solder material, therewith providing a soldered connection (52) between the first and second pattern. Furthermore the present invention relates to an electronic assembly (50), a cover (18) and a substrate (30).

摘要翻译： 本发明涉及一种用于制造电子组件（50）的方法，所述电子组件（50）包括电子部件，空腔和基板，所述方法包括： - 提供具有基本上封闭构造的第一图案的电子部件（10） - 提供与所述表面一起覆盖的所述电子部件的表面上的盖子（18）限定空腔（20），所述第一图案的所述封闭构造基本上在所述表面上包围所述盖子; - 提供具有基本封闭构造的第二图案的衬底（30），该封闭构造至少部分对应于第一图案的封闭构造，并且包括焊盘; - 在焊料垫上涂抹焊料; - 定位所述电子部件和所述基板，以使所述第一和第二图案的所述基本上封闭的构造对准，同时所述基板支撑所述盖的顶表面（28）; - 回流焊接焊料材料，从而在第一和第二图案之间提供焊接连接（52）。 此外，本发明涉及电子组件（50），盖（18）和基板（30）。