公开(公告)号：US4217570A

公开(公告)日：1980-08-12

申请号：US910178

申请日：1978-05-30

申请人： Robert E. Holmes

发明人： Robert E. Holmes

IPC分类号： H01C17/242 ,  H01C1/034 ,  H01C7/00 ,  H01C17/26 ,  H01L27/01 ,  B23K26/00

CPC分类号： H01C7/006 ,  H01C1/034 ,  H01C17/265 ,  Y10T29/49099 ,  Y10T29/49156

摘要： Microcircuit structures including thin-film electrical components are provided with a multilayer passivation coating that permits laser trimming of the components through the coating without damaging it. Such a passivation coating suitably includes an underlayer of silicon oxide or other oxygen-containing material and an outer layer of silicon nitride.

摘要翻译： 包括薄膜电气部件的微电路结构设置有多层钝化涂层，其允许通过涂层激光修整组件而不损坏组件。 这种钝化涂层适当地包括氧化硅或其它含氧材料的底层和氮化硅的外层。

公开(公告)号：US4847445A

公开(公告)日：1989-07-11

申请号：US697099

申请日：1985-02-01

申请人： Earl R. Helderman ,  Robert E. Holmes ,  Robert R. Zimmerman

发明人： Earl R. Helderman ,  Robert E. Holmes ,  Robert R. Zimmerman

IPC分类号： H01C7/00 ,  H01L21/3205 ,  H01L21/48 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K3/38 ,  H05K3/46

CPC分类号： H01L21/4846 ,  H01L23/49866 ,  H05K3/388 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/0346 ,  H05K1/09 ,  H05K3/38 ,  Y10T428/24917

摘要： A thin-film metal conductor system using a zirconium adhesion layer is disclosed. The system is formed by first plating a layer of zirconium over a substrate material and any electrical components, such as resistors, which are fixed on the substrate. A conductive layer is then deposited over those portions of the zirconium layer which are to provide conductive pathways. The resulting unit is thermally treated in an oxidizing environment, such as air, to oxidize the exposed portions of the zirconium layer and thereby form regions of zirconium oxide. The zirconium oxide is nonconductive and protects underlying components from moisture and physical abrasion.

摘要翻译： 公开了一种使用锆粘附层的薄膜金属导体系统。 该系统通过首先在衬底材料和固定在衬底上的任何电气部件（例如电阻器）上镀覆一层锆而形成。 然后将导电层沉积在提供导电路径的锆层的那些部分上。 所得单元在诸如空气的氧化环境中进行热处理，以氧化锆层的暴露部分，从而形成氧化锆区域。 氧化锆是不导电的，并保护底层组分免受潮湿和物理磨损。

公开(公告)号：US4328794A

公开(公告)日：1982-05-11

申请号：US139451

申请日：1980-04-11

申请人： Robert E. Holmes

发明人： Robert E. Holmes

IPC分类号： A61F5/04

CPC分类号： A61F5/04

摘要： This invention is a traction splint including a tension applying mechanism with an outer knob to apply tension to a tension stirrup through belting wound about a shaft while such tension is released by turning of an inner knob in the opposite direction. Both of these knobs are uni-directional relative to rotative movement but in opposite directions. A folding support leg and relatively simple and yet extremely efficient bindings and appendage supports are also included features.

摘要翻译： 本发明是一种牵引夹板，其包括具有外旋钮的张力施加机构，以通过围绕轴线缠绕缠绕的张力马镫来施加张力，同时通过沿相反方向转动内旋钮释放该张力。 这两个旋钮都相对于旋转运动是单向的，但是在相反的方向上。 折叠支撑腿和相对简单但非常高效的绑定和附件支撑也包括在内。

公开(公告)号：US4288776A

公开(公告)日：1981-09-08

申请号：US110562

申请日：1980-01-09

申请人： Robert E. Holmes

发明人： Robert E. Holmes

IPC分类号： H01C17/242 ,  H01C1/034 ,  H01C7/00 ,  H01C17/26 ,  H01L27/01 ,  B05D3/06

CPC分类号： H01C7/006 ,  H01C1/034 ,  H01C17/265 ,  Y10T29/49099 ,  Y10T29/49156

摘要： Thin-film microcircuit structures passivated with silicon nitride are provided in which included electrical components containing nickel, chromium or other nitride-forming metals are encapsulated in an oxide material, preferably silicon oxide. The metal-containing components are thus prevented from reacting with the silicon nitride passivation coating during through-passivation laser trimming of the components.

摘要翻译： 提供了用氮化硅钝化的薄膜微电路结构，其中包含镍，铬或其它形成氮化物的金属的电子部件被包封在氧化物材料，优选氧化硅中。 因此，在组件的钝化激光修整期间，防止含金属成分与氮化硅钝化涂层反应。

公开(公告)号：US4153518A

公开(公告)日：1979-05-08

申请号：US852991

申请日：1977-11-18

申请人： Robert E. Holmes ,  Robert R. Zimmerman

发明人： Robert E. Holmes ,  Robert R. Zimmerman

IPC分类号： H01L23/15 ,  H01L27/01 ,  H05K1/03 ,  H05K3/38 ,  C25D5/54

CPC分类号： H05K3/388 ,  H01L23/15 ,  H01L27/016 ,  H01L2924/0002 ,  H05K1/0306 ,  Y10T428/12597 ,  Y10T428/12618

摘要： A method of fabricating a hybrid circuit including a siliceous substrate and thick metal conductors. A thin film barrier layer is provided intermediate the substrate and a vacuum-deposited metal layer, which metal layer is subsequently electroplated to provide the desired metal thickness. The barrier layer, which may suitably be a refractory metal oxide such as the oxides of zirconium, tantalum, titanium, or tungsten, prevents loss of adhesion between the vacuum deposited metal and substrate that occurs during electroplating.

摘要翻译： 一种制造包括硅质衬底和厚金属导体的混合电路的方法。 在衬底中间设置薄膜阻挡层和真空沉积的金属层，该金属层随后被电镀以提供所需的金属厚度。 阻挡层，其可适当地是诸如锆，钽，钛或钨的氧化物的难熔金属氧化物，防止在电镀期间发生的真空沉积金属和基板之间的粘附损失。