公开(公告)号：US5961728A

公开(公告)日：1999-10-05

申请号：US874388

申请日：1997-06-13

申请人： David Kerry Kiser ,  Robert J. Hyatt

发明人： David Kerry Kiser ,  Robert J. Hyatt

IPC分类号： G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  B08B3/12

CPC分类号： G01R1/07342 ,  G01R31/2886 ,  G01R31/2887 ,  G01R3/00 ,  Y10T436/114998

摘要： A method and apparatus for cleaning a test probe of a semiconductor probe card. In one embodiment, the method of cleaning includes the steps of placing the test probes in contact with a textured cleaning surface and providing a vibrational movement to the cleaning surface.

摘要翻译： 一种用于清洁半导体探针卡的测试探针的方法和装置。 在一个实施例中，清洁方法包括以下步骤：将测试探针放置在纹理清洁表面上并向清洁表面提供振动运动。

公开(公告)号：US6130545A

公开(公告)日：2000-10-10

申请号：US976837

申请日：1997-11-24

申请人： David Kerry Kiser ,  Robert J. Hyatt

发明人： David Kerry Kiser ,  Robert J. Hyatt

IPC分类号： G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  G01R1/06

CPC分类号： G01R1/07342 ,  G01R31/2886 ,  G01R31/2887 ,  G01R3/00 ,  Y10T436/114998

摘要： An improved method and apparatus for electrically coupling the bond pads of an integrated circuit to a tester. One embodiment the invention includes a probe card having a plurality of test probes and a means for placing the test probes in intimate contact with a corresponding set of bond pads located along the surface of an integrated circuit. Electrical contact is achieved between the test probes and bond pads by inducing a small and rapid cyclic movement between the test probes and bond pads such that the test probes pierce a dielectric layer on the surface of the bond pads. In one embodiment, the cyclic movement between the test probes and bond pads is achieved by the use of a piezoelectric actuator.

摘要翻译： 一种用于将集成电路的接合焊盘电耦合到测试器的改进的方法和装置。 本发明的一个实施例包括具有多个测试探针的探针卡和用于将测试探针与沿着集成电路的表面定位的相应的一组接合焊盘紧密接触的装置。 通过在测试探针和接合焊盘之间引起小而快速的循环移动，使得测试探针刺穿接合焊盘表面上的电介质层，在测试探针和接合焊盘之间实现电接触。 在一个实施例中，通过使用压电致动器来实现测试探针和接合焊盘之间的循环移动。

公开(公告)号：US5909121A

公开(公告)日：1999-06-01

申请号：US874821

申请日：1997-06-13

申请人： David Kerry Kiser ,  Robert J. Hyatt

发明人： David Kerry Kiser ,  Robert J. Hyatt

IPC分类号： G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  G01R1/04

CPC分类号： G01R1/07342 ,  G01R31/2886 ,  G01R31/2887 ,  G01R3/00 ,  Y10T436/114998

摘要： A method and apparatus for electrically coupling the bond pads of an integrated circuit to a tester using a probe card having a biasing element supporting a plurality of tests probes. In one embodiment, the method includes the steps of placing the test probes in contact with the bond pads and providing a vibrational movement to the biasing element such that the test probes move relative to the bond pads and such that the test probes remove an electrically non-conductive material on the surface of the bond pads to establish an electrical connection between the test probes and the bond pads.

摘要翻译： 一种用于使用具有支撑多个测试探针的偏置元件的探针卡将集成电路的接合焊盘电耦合到测试器的方法和装置。 在一个实施例中，该方法包括以下步骤：放置测试探针与接合焊盘接触并向偏置元件提供振动运动，使得测试探针相对于接合焊盘移动，并且使得测试探针去除电 导电材料在接合焊盘的表面上建立测试探针和接合焊盘之间的电连接。

公开(公告)号：US5020964A

公开(公告)日：1991-06-04

申请号：US441854

申请日：1989-11-27

申请人： Robert J. Hyatt ,  Edward H. Abbott ,  Robert E. Bush ,  Francis J. Shannon

发明人： Robert J. Hyatt ,  Edward H. Abbott ,  Robert E. Bush ,  Francis J. Shannon

IPC分类号： B23P19/00 ,  B25J17/02 ,  H05K13/04 ,  H05K13/08

CPC分类号： B23P19/102 ,  B25J17/0208 ,  H05K13/0404 ,  H05K13/08 ,  Y10S403/01

摘要： A robotic apparatus for positioning a tool or work hand that incorporates a compliant wrist effective to adjust to delicate but misaligned portions of the workpiece, comprising (a) structure for magnetically supporting a positioning member carrying a gripper tool; (b) pneumatic structure for selectively separating and floating the positioning member from said supporting structure to permit lateral adjustment of the positioning member in response to small forces received from the gripper tool as it carries out gripping; and (c) structure for locking the positioning member to the supporting structure upon completion of the desired lateral adjustment. A method of using such compliant wrist concept, comprising (a) magnetically suspending a positioning plate from a magnet, the plate carrying the gripper tool; (b) injecting a film of air between the interface of the magnet and plate to provide floating separation therebetween enabling ease of lateral movement; (c) closing a gripper tool about the part to be gripped causing any offcenter gripping forces to be translated back to the plate resulting in lateral movement in response thereto for seeking a centering position; and (d) upon achieving the desired centering position, deactivating the air injection to permit the magnet to lock the plate in position relative to the magnet for further robotic movement.