公开(公告)号：US5901037A

公开(公告)日：1999-05-04

申请号：US877849

申请日：1997-06-18

Applicant: Robin E. Hamilton ,  Thomas J. Fagan ,  Paul G. Kennedy ,  William S. Woodward

Inventor： Robin E. Hamilton ,  Thomas J. Fagan ,  Paul G. Kennedy ,  William S. Woodward

IPC: F28F3/12 ,  F28F27/02 ,  H01L23/473 ,  H05K7/20

CPC classification number: F28F3/12 ,  F28F9/0282 ,  H01L23/473 ,  F28F2250/08 ,  F28F2260/02 ,  H01L2924/0002

Abstract: A closed loop liquid cooling system for an RF transistor module including a plurality of elongated microchannels connected between a pair of coolant manifolds for conducting liquid coolant beneath one or more transistor dies to dissipate the heat generated thereby, a heat exchanger, a miniature circulating pump located on the module, and passive check valves having tapered passages for controlling the flow of coolant in the loop. The valves are truncated tapered passage microchannel valves having no moving parts and are fabricated so as to be a part of either the circulating pump, the coolant manifolds, or the microchannels.

Abstract translation: 一种用于RF晶体管模块的闭环液体冷却系统，包括连接在一对冷却剂歧管之间的多个细长微通道，用于将一个或多个晶体管管芯下的液体冷却剂传导，以散发由此产生的热量，热交换器，微型循环泵 在模块上，以及具有用于控制回路中的冷却剂流动的锥形通道的被动止回阀。 这些阀是没有运动部件的截头锥形通道微通道阀，并且被制造成循环泵，冷却剂歧管或微通道的一部分。

公开(公告)号：US5726605A

公开(公告)日：1998-03-10

申请号：US626899

申请日：1996-04-14

Applicant: Alfred W. Morse ,  Paul M. Esker ,  Robin E. Hamilton

Inventor： Alfred W. Morse ,  Paul M. Esker ,  Robin E. Hamilton

IPC: H01L25/16 ,  H03F3/60 ,  H03F3/68 ,  H03F1/30

CPC classification number: H01L25/16 ,  H03F3/604 ,  H01L2924/0002 ,  H01L2924/3011

Abstract: An RF power amplifier module utilizing a plurality of silicon carbide transistor power amplifier circuits, each including a transistor assembly having multiple cells, respectively providing power amplification of an input signal. In a preferred embodiment of the invention, four mutually staggered silicon carbide transistor assemblies, each containing multiple transistor cells, are operated in parallel while being arranged in close proximity on a common substrate. Each silicon carbide amplifier circuit assembly is commonly driven by a fifth silicon carbide amplifier circuit. The outputs of the parallely driven silicon carbide transistor power amplifier circuits are combined so as to provide a single composite RF output signal which may be in the order of 1000 watts or more when operated at a frequency of, for example, 600 MHz.

Abstract translation: 一种利用多个碳化硅晶体管功率放大器电路的RF功率放大器模块，每个都包括具有多个单元的晶体管组件，分别提供输入信号的功率放大。 在本发明的一个优选实施例中，四个相互交错的碳化硅晶体管组件（每个包含多个晶体管单元）并行地并行布置在公共衬底附近。 每个碳化硅放大器电路组件通常由第五碳化硅放大器电路驱动。 并联驱动的碳化硅晶体管功率放大器电路的输出被组合以提供单个复合RF输出信号，当以例如600MHz的频率操作时，其可以处于1000瓦特或更多的数量级。

公开(公告)号：US5801442A

公开(公告)日：1998-09-01

申请号：US681207

申请日：1996-07-22

Applicant: Robin E. Hamilton ,  Paul G. Kennedy ,  John Ostop ,  Martin L. Baker ,  Gregory A. Arlow ,  John C. Golombeck ,  Thomas J Fagan, Jr.

Inventor： Robin E. Hamilton ,  Paul G. Kennedy ,  John Ostop ,  Martin L. Baker ,  Gregory A. Arlow ,  John C. Golombeck ,  Thomas J Fagan, Jr.

IPC: H01L23/473 ,  H01L23/34

CPC classification number: H01L23/473 ,  F28F2260/02 ,  F28F3/12 ,  H01L2924/0002 ,  H01L2924/3011

Abstract: Cooling of densely packaged semiconductor devices is achieved by microchannels which extract heat by forced convection and the use of fluid coolant located as close as possible to the heat source. The microchannels maximize heat sink surface area and provides improved heat transfer coefficients, thereby allowing a higher power density of semiconductor devices without increasing junction temperature or decreasing reliability. In its preferred embodiment, a plurality of microchannels are formed directly in the substrate portion of a silicon or silicon carbide chip or die mounted on a ground plane element of a circuit board and where a liquid coolant is fed to and from the microchannels through the ground plane. The microchannels comprise a plurality of closed-ended slots or grooves of generally rectangular cross section. Fabrication methods include deposition and etching, lift-off processing, micromachining and laser cutting techniques.

Abstract translation: 密集封装的半导体器件的冷却是通过微通道实现的，微通道通过强制对流提取热量以及使用尽可能靠近热源的流体冷却剂。 微通道使散热器表面积最大化，并提供改进的传热系数，从而允许半导体器件的功率密度更高，而不会增加结温或降低可靠性。 在其优选实施例中，多个微通道直接形成在安装在电路板的接地平面元件上的硅或碳化硅芯片或裸片的衬底部分中，并且其中液体冷却剂被馈送到微通道并通过地面 飞机 微通道包括多个具有大致矩形横截面的闭合端的槽或凹槽。 制造方法包括沉积和蚀刻，剥离加工，微加工和激光切割技术。

公开(公告)号：US5998240A

公开(公告)日：1999-12-07

申请号：US71776

申请日：1998-05-04

Applicant: Robin E. Hamilton ,  Paul G. Kennedy ,  John Ostop ,  Martin L. Baker ,  Gregory A. Arlow ,  John C. Golombeck ,  Thomas J. Fagan, Jr.

Inventor： Robin E. Hamilton ,  Paul G. Kennedy ,  John Ostop ,  Martin L. Baker ,  Gregory A. Arlow ,  John C. Golombeck ,  Thomas J. Fagan, Jr.

IPC: H01L23/473 ,  H01L21/44

CPC classification number: H01L23/473 ,  F28F2260/02 ,  F28F3/12 ,  H01L2924/0002 ,  H01L2924/3011

Abstract: Cooling of densely packaged semiconductor devices is achieved by microchannels which extract heat by forced convection and the use of fluid coolant located as close as possible to the heat source. The microchannels maximize heat sink surface area and provides improved heat transfer coefficients, thereby allowing a higher power density of semiconductor devices without increasing junction temperature or decreasing reliability. In its preferred embodiment, a plurality of microchannels are formed directly in the substrate portion of a silicon or silicon carbide chip or die mounted on a ground plane element of a circuit board and where a liquid coolant is fed to and from the microchannels through the ground plane. The microchannels comprise a plurality of closed-ended slots or grooves of generally rectangular cross section. Fabrication methods include deposition and etching, lift-off processing, micromachining and laser cutting techniques.

Abstract translation: 密集封装的半导体器件的冷却是通过微通道实现的，微通道通过强制对流提取热量以及使用尽可能靠近热源的流体冷却剂。 微通道使散热器表面积最大化，并提供改进的传热系数，从而允许半导体器件的功率密度更高，而不会增加结温或降低可靠性。 在其优选实施例中，多个微通道直接形成在安装在电路板的接地平面元件上的硅或碳化硅芯片或裸片的衬底部分中，并且其中液体冷却剂被馈送到微通道并通过地面 飞机 微通道包括多个具有大致矩形横截面的闭合端的槽或凹槽。 制造方法包括沉积和蚀刻，剥离加工，微加工和激光切割技术。

公开(公告)号：US5852339A

公开(公告)日：1998-12-22

申请号：US878441

申请日：1997-06-18

Applicant: Robin E. Hamilton ,  Paul G. Kennedy ,  Raymond A. Smith

Inventor： Robin E. Hamilton ,  Paul G. Kennedy ,  Raymond A. Smith

IPC: F21V23/02 ,  F21V29/00 ,  F28D15/02 ,  H01J61/52 ,  H01J61/56 ,  H01J65/04 ,  H01J61/00

CPC classification number: F21V29/74 ,  F21K9/232 ,  F21V23/026 ,  F21V29/00 ,  F21V29/004 ,  F21V29/006 ,  F21V29/51 ,  F21V29/56 ,  F21V29/773 ,  F28D15/02 ,  F28F1/16 ,  H01J61/52 ,  H01J61/56 ,  H01J65/048 ,  F21Y2101/00

Abstract: An electrodeless light bulb assembly having a standard light bulb base located at one end of an extruded cylindrical heat sink including a set of elongated fins extending radially outward from an annular inner body portion. An electrodeless light bulb, excitation coil, and transparent cover for the bulb are located at the other end of the heat sink. A solid state electrodeless lamp driver circuit is thermally coupled to the heat sink and is located in a hollow inner space region formed by the inner body portion. The annular inner body portion also includes at least one but preferably a plurality of boiler/condenser heat pipes located around its periphery for thermally coupling the heat from excitation coil and the driver to the fins where heat is transferred to the air via natural convection. The excitation coil can be formed from a length of conventional electrical conductor or it can be formed from a length of heat pipe connected at one end to the driver and at the other end to the heat sink.

Abstract translation: 一种无电极灯泡组件，其具有位于挤出的圆柱形散热器的一端处的标准灯泡基座，其包括从环形内部主体部分径向向外延伸的一组细长翅片。 一个无电极的灯泡，激励线圈和灯泡透明盖位于散热片的另一端。 固态无电极灯驱动器电路热耦合到散热器并且位于由内部主体部分形成的中空的内部空间区域中。 环形内主体部分还包括位于其周边周围的至少一个但优选多个锅炉/冷凝器热管，用于将来自激励线圈和驱动器的热量热耦合到翅片，其中热量通过自然对流传递到空气。 励磁线圈可以由一定长度的常规电导体形成，或者可以由一端连接到驱动器并且在另一端连接到散热器的一段热管形成。

公开(公告)号：US5763951A

公开(公告)日：1998-06-09

申请号：US681345

申请日：1996-07-22

Applicant: Robin E. Hamilton ,  Paul G. Kennedy ,  Christopher R. Vale

Inventor： Robin E. Hamilton ,  Paul G. Kennedy ,  Christopher R. Vale

IPC: H01L23/473 ,  H02K44/04 ,  H05K1/02 ,  H05K7/20 ,  H01L23/34

CPC classification number: H02K44/04 ,  H01L23/473 ,  H02K99/00 ,  F28F2260/02 ,  H01L2924/0002 ,  H05K1/0201

Abstract: A liquid cooling system contained completely on a circuit board assembly. The liquid cooling system uses microchannels etched within the circuit board, those microchannels being filled with electrically conductive fluid that is pumped by a non-mechanical, magnetic pump. The pump can be separate from the device on the circuit board which is to be cooled or it can be integrated with the device that is to be cooled. In the latter circumstance, the same current which flows through the electronic device is the current which generates the Lorentz force that pumps the electrically conductive fluid through the microchannel.

Abstract translation: 液体冷却系统完全包含在电路板组件上。 液体冷却系统使用蚀刻在电路板内的微通道，这些微通道充满由非机械磁力泵泵送的导电流体。 泵可以与要冷却的电路板上的装置分离，或者可以与要冷却的装置集成。 在后一种情况下，流过电子装置的相同电流是产生将导电流体泵送通过微通道的洛伦兹力的电流。

公开(公告)号：US5692558A

公开(公告)日：1997-12-02

申请号：US681343

申请日：1996-07-22

Applicant: Robin E. Hamilton ,  Paul G. Kennedy

Inventor： Robin E. Hamilton ,  Paul G. Kennedy

IPC: F28F13/00 ,  H01L23/473 ,  F28F7/00

CPC classification number: F28F13/00 ,  H01L23/473 ,  H01L2924/0002

Abstract: Aviation fuel is used as the coolant for a microchannel heat sink for airborne electronics. The use of preexisting aviation fuel as a coolant medium eliminates the weight, size and expense of a separate liquid system dedicated solely to electronics cooling. The heat sink is comprised of a body of material having high thermal conductivity and in which are formed a set of parallel closed-ended microchannels on the order of 0.001 in. by 0.004 in. separated by a distance of 0.001 in.

Abstract translation: 航空燃料用作机载电子设备的微通道散热器的冷却剂。 使用先前存在的航空燃料作为冷却剂介质消除了专用于电子冷却的单独液体系统的重量，尺寸和费用。 散热器由具有高导热性的材料体组成，并且其中形成有一组平行的封闭式微通道，其数量级为0.001英寸×约0.004英寸，间隔0.001英寸。

公开(公告)号：US5841244A

公开(公告)日：1998-11-24

申请号：US877848

申请日：1997-06-18

Applicant: Robin E. Hamilton ,  Paul G. Kennedy ,  Raymond A. Smith

Inventor： Robin E. Hamilton ,  Paul G. Kennedy ,  Raymond A. Smith

IPC: H01J61/52 ,  H01J65/04 ,  H05B41/24 ,  H05B41/28 ,  H05B41/16

CPC classification number: F28D15/04 ,  H01J61/523 ,  H01J65/048 ,  H05B41/24 ,  H05B41/2806 ,  Y02B20/22

Abstract: An electrodeless light bulb assembly including a case or housing supporting an electrodeless light bulb as well as a convection type heat exchanger. A solid state RF driver circuit is located inside the housing and connects to an excitation coil wrapped around the light bulb. The excitation coil comprises a metal heat pipe so as to provide an efficient thermal transport mechanism for the heat generated by the coil and the heat radiated thereto from the electrodeless bulb to the heat exchanger in addition to generating an RF excitation field for the electrodeless light bulb.

Abstract translation: 一种无电极灯泡组件，其包括支撑无电极灯泡的壳体或壳体以及对流型热交换器。 固态RF驱动器电路位于壳体内部并连接到缠绕在灯泡周围的激励线圈。 励磁线圈包括金属热管，以便为线圈产生的热量和从无电极灯泡向热交换器辐射的热量提供有效的热传输机构，并且为无电极灯泡产生RF激励场 。