Abstract:
An event based test system for testing an IC device under test (DUT) designed under an automatic electronic design (EDA) environment. The event based test system includes an event memory for storing event data derived directly from simulation of design data for an intended IC in the EDA environment where the event data to denote each event is formed with time index indicating a time length from a predetermined point and an event type indicating a type of change at an event, an event generation unit for generating test vectors based on the event data where waveform of each vector is determined by the event type and a timing of the waveform is determined by accumulating the time index of previous events, and means for supplying test vectors to the DUT and evaluating response outputs of the DUT at predetermined timings.
Abstract:
A method and structure for testing embedded memories in an integrated circuit chip having a microprocessor core therein. The method includes the steps of testing the microprocessor core by applying a test pattern and evaluating the resultant output of the microprocessor core, and confirming an integrity of the microprocessor core prior to testing the embedded memory, applying an object code of assembly language test program to the microprocessor core from a source external to the integrated circuit chip, generating a memory test pattern by the microprocessor core based on the object code of the assembly language test program, and applying the memory test pattern to the embedded memory and evaluating the resultant response of the memory by comparing the response with the expected data by the microprocessor core.
Abstract:
Hybrid CMOS circuit configurations that include both static CMOS logic and Domino CMOS logic include two registers that surround the Domino logic to allow that logic to be tested. One register receives an input test vector, loaded directly through a primary set of inputs or by a serial scan chain if the register inputs are not directly accessible. The second register latches the results of the test vector application. The register contents can either be read directly through a primary set of outputs if there is no static CMOS logic between the register outputs and a primary set of circuit outputs, or scanned out of the second register using a serial scan chain. Domino scan flip-flops, which reduce transistor count over conventional static scan flip-flops, can be used in the Domino logic as sequential elements to implement multiple logic functions. These scan flip-flops can be serially connected as part of a separate scan chain or integrated into a single scan chain with the registers and any other static scan flip-flops in the circuit. Domino scan flip-flops allow all of the nominal logic to be tested in conjunction with the two registers. A Domino clock used to drive the Domino logic and a system clock used to drive the static CMOS logic ensures that correct test data is applied and read out from the hybrid circuit.
Abstract:
An integrated circuit includes a plurality of signal lines, a plurality of pull transistors connected between the signal lines respectively and an electrical potential, and an IDDQ test control for turning on the pull transistors for normal operation, and for turning off the pull transistors for IDDQ testing. The IDDQ test control includes a test signal generator for generating an IDDQ test control signal that turns off the pull transistors, and an IDDQ test signal line that is connected to the test signal generator and to the pull transistors. The pull transistors are designed within a periphery of the circuit, and the IDDQ test signal line forms a ring. The test signal generator includes an external pin, a special buffer, or a boundary scan system including a chain of boundary scan cells and a test access port controller. The test control signal can be generated by one of the boundary scan cells, or by the test access port controller.
Abstract:
The present invention provides a test method of the complexity of 7n to test RAM devices, where n is the number of bits. This method tests all cell stuck-at-1/0 faults, state transition 1-to-0 and 0-to-1 faults, state coupling faults between two cells and data retention faults in random access memories. A standardized testable design memory (STD architecture) is presented which keeps the time required to test a RAM constant irrespective of the memory size. The design is shown through four examples to cover both bit and byte oriented memories. The memory address decoder is implemented in two or more levels. The decoder decoding the most significant addressed is modified by addition of an external control signal line. Memory of the RAM (memory cell array) is partitioned into blocks. The size of these blocks is defined by the last level (least significant address) of the memory address decoder. The design is highly structured and requires a very small amount of extra hardware. The architecture is not only applicable at chip level, but also at the board level. A slight modification allows fault diagnosis to be achieved in the STD architecture. This architecture also permits disconnection of faulty memory blocks and use the good part as 3/4 or 1/2 of the original capacity. Such reconfiguration in STD architecture can be done by specifying a fixed voltage (Gnd or Vdd) at the input of the most significant decoder. Such a reconfiguration does not require special hardware.
Abstract:
A manufacturing process for LSIs uses an event tester simulator and an event tester to avoid prototype hold. In the LSI manufacturing method an LSI is designed under an EDA (electronic design automation) environment to produce design data of a designed LSI, and logic simulation is performed on a device model of the LSI design in the EDA environment with use of a testbench and producing a test vector file of an event format as a result of the logic simulation. Then, simulation data files are verified with use of the design data and the testbench by operating an event tester simulator, and a prototype LSI is produced through a fabrication provider by using the design data. The prototype LSI is tested by an event tester by using the test vector file and the simulation data files and test results is feedbacked to the EDA environment or the fabrication provider.
Abstract:
An ATE calibration method and system that does not require external test equipment to calibrate individual functional pins and provides balanced timing skews among the functional pins and pincards is disclosed. A functional pin in the test system is selected as a reference or “golden” pin and another is selected as a precision measurement unit (PMU). External test equipment and the reference PMU are used to measure the AC and DC characteristics of the reference pin, and any deviation represents a measurement error in the reference PMU. All functional pins in the test system can be measured against the reference pin using the reference PMU, taking into account the measurement error, without the need for external test equipment. To ensure that skews are balanced among all pins, the location of the reference pin is selected to be as close as possible to the midpoint of the functional pin range.
Abstract:
The present invention is directed to a locking apparatus and loadboard assembly of a semiconductor testing device apparatus. The loadboard assembly includes a printed circuit board containing a device under test and an interface board secured to the bottom of the printed circuit board. The interface board has two members with a space between them. Spacers connect the members to form apertures for contact pins on a test head. The loadboard assembly is placed on top of a locking apparatus which is mounted on the top surface of the test head. The placement of the loadboard on the locking apparatus is done according to two pins of different cross-sections that extend through two holes in the interface board and printed circuit board of the loadboard assembly. When the loadboard assembly is placed on the locking mechanism, rollers mounted on the interface board are received in cam slots of a cam member of the locking apparatus. These rollers follow the cam slots as the cam member is moved. Based on the profile of the cam slots, the loadboard assembly can be gradually lowered to achieve contact between the printed circuit board and the contact pins on the test head and to lock the interface board.
Abstract:
An event based test system has a modular architecture for simultaneously testing a plurality of semiconductor devices (DUT) including memory and logic devices. The test system detects functional faults as well as physical faults in the DUT. The test system includes two or more tester modules each having a plurality of pin units, a main frame for accommodating the two or more tester modules, a test fixture for electrically connecting the tester modules and the DUT, a host computer for controlling an overall operation of the test system, and a data storage for storing a library of algorithmic test patterns and software tools for producing memory test patterns for testing memories. Memory test algorithm and information regarding the design and configuration of the memories to be tested are specified prior to the memory testing.
Abstract:
A method of testing an embedded analog core in an integrated circuit chip having a microprocessor core and a memory core. The method includes the steps of providing a test register in the integrated circuit chip between the microprocessor core and an analog core to be tested, testing the microprocessor core and the memory core, using an assembly language test program running on the microprocessor core to generate a test pattern by the microprocessor core, applying the test pattern to the analog core by the microprocessor core and evaluating the response of the analog core either by the microprocessor core or a test system provided outside of the integrated circuit chip.