公开(公告)号：US4179802A

公开(公告)日：1979-12-25

申请号：US890445

申请日：1978-03-27

申请人： Kailash C. Joshi ,  Ronald N. Spaight

发明人： Kailash C. Joshi ,  Ronald N. Spaight

IPC分类号： H05K3/34 ,  H01L21/60 ,  H01L21/768 ,  H01L21/822 ,  H01L23/485 ,  H01L23/522 ,  H01L23/538 ,  H01L27/04 ,  H01L39/00

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  Y10S505/923 ,  Y10S505/927 ,  Y10T29/49126 ,  Y10T29/49149 ,  Y10T29/49156

摘要： A plurality of metal studs are plated on a chip carrier surface in a pattern to match a terminal metal footprint on a chip to be joined. The studs are of sufficient height to permit flux cleaning, if necessary. After the studs are in place, the chip is aligned with the carrier and attached thereto, the chip pads containing a small amount of solder to provide the connecting joints. The carrier and chip are made of materials having nearly equal thermal expansion characteristics.

摘要翻译： 将多个金属螺柱以图案电镀在芯片载体表面上以匹配要连接的芯片上的端子金属覆盖区。 如果需要，螺柱具有足够的高度以允许焊剂清洁。 在螺柱就位之后，芯片与载体对准并附接到其上，芯片焊盘包含少量焊料以提供连接接头。 载体和芯片由具有几乎相等的热膨胀特性的材料制成。