公开(公告)号：US20130126573A1

公开(公告)日：2013-05-23

申请号：US13640140

申请日：2011-07-12

申请人： S. Abbas Hosseini ,  Peter R. Herman

发明人： S. Abbas Hosseini ,  Peter R. Herman

IPC分类号： B23K26/00 ,  H01L21/263 ,  B26F3/00

CPC分类号： B23K26/0057 ,  B23K26/0006 ,  B23K26/0604 ,  B23K26/0619 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/083 ,  B23K26/53 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54 ,  B23K2103/56 ,  B26F3/00 ,  C03B33/0222 ,  C03C23/0025 ,  H01L21/2633 ,  H01L21/78 ,  Y10T225/12

摘要： A method is provided for the internal processing of a transparent substrate in preparation for a cleaving step. The substrate is irradiated with a focused laser beam that is comprised of pulses having an energy and pulse duration selected to produce a filament within the substrate. The substrate is translated relative to the laser beam to irradiate the substrate and produce an additional filament at one or more additional locations. The resulting filaments form an array defining an internally scribed path for cleaving said substrate. Laser beam parameters may be varied to adjust the filament length and position, and to optionally introduce V-channels or grooves, rendering bevels to the laser-cleaved edges. Preferably, the laser pulses are delivered in a burst train for lowering the energy threshold for filament formation, increasing the filament length, thermally annealing of the filament modification zone to minimize collateral damage, improving process reproducibility, and increasing the processing speed compared with the use of low repetition rate lasers.

摘要翻译： 提供了一种在制备切割步骤中对透明基板进行内部处理的方法。 用聚焦激光束照射衬底，该激光束由具有选择的能量和脉冲持续时间的脉冲组成，以在衬底内产生细丝。 衬底相对于激光束平移以照射衬底并在一个或多个附加位置产生另外的细丝。 所得到的长丝形成限定用于切割所述基底的内部刻划路径的阵列。 可以改变激光束参数以调节灯丝长度和位置，并且可选地引入V沟道或凹槽，从而使激光切割边缘产生斜面。 优选地，激光脉冲在突发串中传送，以降低灯丝形成的能量阈值，增加灯丝长度，灯丝改性区域的热退火以最小化附带损伤，提高工艺再现性，并且与使用相比提高了处理速度 的低重复率激光器。

公开(公告)号：US09296066B2

公开(公告)日：2016-03-29

申请号：US13640140

申请日：2011-07-12

申请人： S. Abbas Hosseini ,  Peter R. Herman

发明人： S. Abbas Hosseini ,  Peter R. Herman

IPC分类号： B23K26/00 ,  B23K26/06 ,  B26F3/00 ,  H01L21/263 ,  C03B33/02

CPC分类号： B23K26/0057 ,  B23K26/0006 ,  B23K26/0604 ,  B23K26/0619 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/083 ,  B23K26/53 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54 ,  B23K2103/56 ,  B26F3/00 ,  C03B33/0222 ,  C03C23/0025 ,  H01L21/2633 ,  H01L21/78 ,  Y10T225/12

摘要： A method is provided for the internal processing of a transparent substrate in preparation for a cleaving step. The substrate is irradiated with a focused laser beam that includes pulses having an energy and pulse duration selected to produce a filament within the substrate. The substrate is translated relative to the laser beam to irradiate the substrate and produce an additional filament at one or more additional locations. The resulting filaments form an array defining an internally scribed path for cleaving the substrate. Laser beam parameters may be varied to adjust the filament length and position, and to optionally introduce V-channels or grooves. The laser pulses may be delivered in a burst train for lowering the energy threshold for filament formation, increasing filament length, thermally annealing of the filament modification zone to minimize collateral damage, and increasing the processing speed compared with the use of low repetition rate lasers.

摘要翻译： 提供了一种在制备切割步骤中对透明基板进行内部处理的方法。 用聚焦激光束照射衬底，其包括具有选择的能量和脉冲持续时间的脉冲以在衬底内产生细丝。 衬底相对于激光束平移以照射衬底并在一个或多个附加位置产生另外的细丝。 所得到的长丝形成限定用于切割基底的内部刻划路径的阵列。 可以改变激光束参数以调节灯丝长度和位置，并且可选地引入V沟道或槽。 激光脉冲可以在脉冲串中传送，以降低灯丝形成的能量阈值，增加灯丝长度，灯丝改性区域的热退火以最小化附带损伤，以及与使用低重复率激光器相比增加处理速度。