公开(公告)号：US20140235016A1

公开(公告)日：2014-08-21

申请号：US14155243

申请日：2014-01-14

Applicant: SIGETRONICS Inc. ,  Electronics and Telecommunications Research Institute

Inventor： Jong-Moon PARK ,  Jin Ho LEE ,  Deok-Ho CHO ,  Kyu-Hwan SHIM

IPC: H01L23/00

CPC classification number: H01L23/4827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/0345 ,  H01L2224/04026 ,  H01L2224/05138 ,  H01L2224/05638 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/2745 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/29144 ,  H01L2224/29166 ,  H01L2224/29171 ,  H01L2224/32227 ,  H01L2224/32502 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8346 ,  H01L2224/83805 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/01026 ,  H01L2924/01014 ,  H01L2924/00

Abstract: Provided is a method of fabricating a semiconductor package, including preparing a die including a first metal layer and a second metal layer which are sequentially stacked on a silicon substrate, preparing a package substrate including a lead frame, and forming an adhesive layer between the lead frame and the first metal layer and attaching the die to the package substrate, wherein the forming of the adhesive layer is performed by eutectic bonding between the silicon substrate and the second metal layer. According to the semiconductor package according to an embodiment of the present invention, an adhesive layer can be easily formed by eutectic bonding without a process of forming a preform.

Abstract translation: 提供一种制造半导体封装的方法，包括制备包括依次层叠在硅衬底上的第一金属层和第二金属层的管芯，制备包括引线框架的封装衬底，以及在引线之间形成粘合剂层 框架和第一金属层并将管芯附接到封装衬底，其中通过硅衬底和第二金属层之间的共晶接合来执行粘合剂层的形成。 根据本发明的实施方式的半导体封装，通过共晶接合可以容易地形成粘合层，而不需要形成预成型体。