专利检索 cpc:"H01L2224/8346" 第 1 页

1.

发明申请
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY 审中-公开

公开(公告)号：US20180068982A1

公开(公告)日：2018-03-08

申请号：US15800127

申请日：2017-11-01

申请人： Infineon Technologies AG

发明人： Alexander Heinrich

IPC分类号： H01L25/065 , H01L21/683

CPC分类号： H01L25/0655 , H01L21/6835 , H01L23/13 , H01L23/4827 , H01L23/49503 , H01L23/49513 , H01L23/544 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/83 , H01L24/97 , H01L25/50 , H01L2221/68354 , H01L2223/54426 , H01L2223/54486 , H01L2224/04026 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/05184 , H01L2224/05624 , H01L2224/05639 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05684 , H01L2224/05687 , H01L2224/06183 , H01L2224/26145 , H01L2224/26175 , H01L2224/27334 , H01L2224/27436 , H01L2224/2908 , H01L2224/291 , H01L2224/29105 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29116 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/2916 , H01L2224/29166 , H01L2224/29171 , H01L2224/2919 , H01L2224/29294 , H01L2224/293 , H01L2224/29339 , H01L2224/29347 , H01L2224/32225 , H01L2224/32245 , H01L2224/32503 , H01L2224/75102 , H01L2224/75251 , H01L2224/75265 , H01L2224/75303 , H01L2224/75753 , H01L2224/7598 , H01L2224/83002 , H01L2224/83005 , H01L2224/83007 , H01L2224/83024 , H01L2224/83055 , H01L2224/83065 , H01L2224/83075 , H01L2224/8309 , H01L2224/83091 , H01L2224/83092 , H01L2224/83101 , H01L2224/83127 , H01L2224/83132 , H01L2224/83143 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83201 , H01L2224/83203 , H01L2224/83208 , H01L2224/83222 , H01L2224/83385 , H01L2224/83424 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83464 , H01L2224/83466 , H01L2224/83469 , H01L2224/8381 , H01L2224/83815 , H01L2224/8382 , H01L2224/83825 , H01L2224/8384 , H01L2224/83851 , H01L2224/83855 , H01L2224/83856 , H01L2224/83862 , H01L2224/83907 , H01L2224/83986 , H01L2224/97 , H01L2924/00012 , H01L2924/01015 , H01L2924/04941 , H01L2924/0496 , H01L2924/15153 , H01L2924/15156 , H01L2924/15157 , H01L2924/157 , H01L2924/15747 , H01L2924/1576 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2224/83 , H01L2924/00014 , H01L2924/014 , H01L2924/01047 , H01L2924/01028 , H01L2924/01026 , H01L2924/0105 , H01L2924/01082 , H01L2924/01074 , H01L2924/01024 , H01L2924/01023 , H01L2924/01027

摘要： A method of forming a chip assembly may include forming a plurality of cavities in a carrier; The method may further include arranging a die attach liquid in each of the cavities; arranging a plurality of chips on the die attach liquid, each chip comprising a rear side metallization and a rear side interconnect material disposed over the rear side metallization, wherein the rear side interconnect material faces the carrier; evaporating the die attach liquid; and after the evaporating the die attach liquid, fixing the plurality of chips to the carrier.

2.

发明授权
Electric power semiconductor device 有权
标题翻译：电力半导体装置

公开(公告)号：US09433075B2

公开(公告)日：2016-08-30

申请号：US14417370

申请日：2013-08-09

申请人： Mitsubishi Electric Corporation

发明人： Junji Fujino , Yutaka Yoneda , Yoshitaka Onishi , Masafumi Sugawara

IPC分类号： H05K7/20 , H05K1/02 , H01L23/13 , H01L23/36 , H01L23/373 , H01L23/492 , H01L23/00 , H01L25/18 , H01L23/473 , H01L25/07

CPC分类号： H05K1/0203 , H01L23/13 , H01L23/36 , H01L23/3735 , H01L23/492 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/0603 , H01L2224/06181 , H01L2224/29111 , H01L2224/32245 , H01L2224/37012 , H01L2224/37147 , H01L2224/4005 , H01L2224/40105 , H01L2224/4024 , H01L2224/4118 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4824 , H01L2224/48472 , H01L2224/49175 , H01L2224/73263 , H01L2224/73265 , H01L2224/83424 , H01L2224/83447 , H01L2224/8346 , H01L2224/83801 , H01L2224/84447 , H01L2224/84801 , H01L2224/85205 , H01L2224/92247 , H01L2924/10254 , H01L2924/10272 , H01L2924/1033 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/15724 , H01L2924/15747 , H01L2924/1576 , H01L2924/16152 , H01L2924/16172 , H01L2924/16251 , H01L2924/181 , H01L2924/19107 , H01L2224/48247 , H01L2924/00012 , H01L2224/291 , H01L2924/014 , H01L2924/00014 , H01L2224/92252 , H01L2224/85 , H01L2224/40499 , H01L2224/8546 , H01L2224/85424 , H01L2224/85447 , H01L2924/01074 , H01L2224/3716 , H01L2224/37124 , H01L2924/01083 , H01L2924/01051 , H01L2924/00 , H01L2924/207 , H01L2224/48624 , H01L2924/00011 , H01L2224/48647 , H01L2224/4866 , H01L2224/48824 , H01L2224/4886 , H01L2224/48747 , H01L2224/48847 , H01L2224/48724 , H01L2224/4876 , H01L2924/013 , H01L2924/01029 , H01L2924/01047 , H01L2924/00013 , H01L2924/2076

摘要： An electric power semiconductor device includes a heat transfer plate. A printed wire board is spaced a predetermined gap apart from the heat transfer plate. An opening portion is provided in the vicinity of an electrode strip formed on the outer side of the printed wire board. An electric power semiconductor element is disposed between the heat transfer plate and the printed wire board, and adhered to the heat transfer plate. A wiring member has one end bonded to a first bonding portion of a main power electrode of the electric power semiconductor element, and the other end is bonded to a second bonding portion. At least part of the second bonding portion is included in a space that extends from the main power electrode to the printed wire board, and the first bonding portion is included in a space that extends from the opening portion.

摘要翻译： 电力半导体装置包括传热板。印刷线路板与传热板间隔开预定间隙。在形成在印刷线路板的外侧的电极条的附近设置有开口部。电力半导体元件设置在传热板和印刷线路板之间，并附着在传热板上。布线构件的一端与电力半导体元件的主电极的第一接合部分接合，另一端接合到第二接合部。第二接合部的至少一部分包括在从主电极延伸到印刷线基板的空间中，并且第一接合部包括在从开口部延伸的空间中。

3.

发明申请
SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件

公开(公告)号：US20150294928A1

公开(公告)日：2015-10-15

申请号：US14669169

申请日：2015-03-26

申请人： ROHM CO., LTD.

发明人： Kenji FUJII , Yasumasa KASUYA , Mamoru YAMAGAMI , Naoki KINOSHITA , Motoharu HAGA

IPC分类号： H01L23/495 , H01L23/00 , H01L23/367 , H01L23/31 , H01L23/29

CPC分类号： H01L23/49527 , H01L23/291 , H01L23/293 , H01L23/3107 , H01L23/3114 , H01L23/3142 , H01L23/3171 , H01L23/3675 , H01L23/4334 , H01L23/4822 , H01L23/49503 , H01L23/49548 , H01L23/49551 , H01L23/49568 , H01L23/49572 , H01L23/525 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/33 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/02311 , H01L2224/02331 , H01L2224/0239 , H01L2224/024 , H01L2224/0345 , H01L2224/03452 , H01L2224/0346 , H01L2224/03462 , H01L2224/0401 , H01L2224/05008 , H01L2224/05073 , H01L2224/05082 , H01L2224/05083 , H01L2224/05084 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05181 , H01L2224/05548 , H01L2224/05567 , H01L2224/05572 , H01L2224/05582 , H01L2224/05583 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05681 , H01L2224/05684 , H01L2224/1145 , H01L2224/1146 , H01L2224/1147 , H01L2224/1161 , H01L2224/11825 , H01L2224/13008 , H01L2224/13011 , H01L2224/13016 , H01L2224/13017 , H01L2224/13019 , H01L2224/13024 , H01L2224/13147 , H01L2224/13561 , H01L2224/13582 , H01L2224/13624 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13664 , H01L2224/13666 , H01L2224/16014 , H01L2224/16245 , H01L2224/16258 , H01L2224/17107 , H01L2224/29008 , H01L2224/29082 , H01L2224/29124 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/29164 , H01L2224/29166 , H01L2224/32245 , H01L2224/73253 , H01L2224/753 , H01L2224/75301 , H01L2224/75981 , H01L2224/81191 , H01L2224/81192 , H01L2224/81201 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/8146 , H01L2224/81464 , H01L2224/81466 , H01L2224/8183 , H01L2224/83191 , H01L2224/83201 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83464 , H01L2224/83466 , H01L2224/8383 , H01L2224/92225 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01073 , H01L2924/01074 , H01L2924/05042 , H01L2924/07025 , H01L2924/17724 , H01L2924/17747 , H01L2924/181 , H01L2924/182 , H01L2924/186 , H01L2924/00012 , H01L2924/00014 , H01L2224/05166 , H01L2924/01028 , H01L2924/0665

摘要： A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.

摘要翻译： 半导体器件具有设置有功能表面的半导体元件，功能电路形成在其上，并且背面面向与功能表面相反的方向，同时还具有支撑半导体元件并与半导体元件电连接的引线以及覆盖半导体元件和引线的至少一部分的树脂封装。半导体元件具有形成在功能面上的功能面侧电极，其具有在功能面朝向的方向突出的功能面侧凸起部。功能面侧电极的功能面侧隆起部通过固态接合而与引线接合。

4.

发明申请
ELECTRIC POWER SEMICONDUCTOR DEVICE 有权
标题翻译：电力半导体器件

公开(公告)号：US20150223316A1

公开(公告)日：2015-08-06

申请号：US14417370

申请日：2013-08-09

申请人： Mitsubishi Electric Corporation

发明人： Junji Fujino , Yutaka Yoneda , Yoshitaka Onishi , Masafumi Sugawara

IPC分类号： H05K1/02

CPC分类号： H05K1/0203 , H01L23/13 , H01L23/36 , H01L23/3735 , H01L23/492 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/0603 , H01L2224/06181 , H01L2224/29111 , H01L2224/32245 , H01L2224/37012 , H01L2224/37147 , H01L2224/4005 , H01L2224/40105 , H01L2224/4024 , H01L2224/4118 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4824 , H01L2224/48472 , H01L2224/49175 , H01L2224/73263 , H01L2224/73265 , H01L2224/83424 , H01L2224/83447 , H01L2224/8346 , H01L2224/83801 , H01L2224/84447 , H01L2224/84801 , H01L2224/85205 , H01L2224/92247 , H01L2924/10254 , H01L2924/10272 , H01L2924/1033 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/15724 , H01L2924/15747 , H01L2924/1576 , H01L2924/16152 , H01L2924/16172 , H01L2924/16251 , H01L2924/181 , H01L2924/19107 , H01L2224/48247 , H01L2924/00012 , H01L2224/291 , H01L2924/014 , H01L2924/00014 , H01L2224/92252 , H01L2224/85 , H01L2224/40499 , H01L2224/8546 , H01L2224/85424 , H01L2224/85447 , H01L2924/01074 , H01L2224/3716 , H01L2224/37124 , H01L2924/01083 , H01L2924/01051 , H01L2924/00 , H01L2924/207 , H01L2224/48624 , H01L2924/00011 , H01L2224/48647 , H01L2224/4866 , H01L2224/48824 , H01L2224/4886 , H01L2224/48747 , H01L2224/48847 , H01L2224/48724 , H01L2224/4876 , H01L2924/013 , H01L2924/01029 , H01L2924/01047 , H01L2924/00013 , H01L2924/2076

摘要： An electric power semiconductor device includes a heat transfer plate. A printed wire board is spaced a predetermined gap apart from the heat transfer plate. An opening portion is provided in the vicinity of an electrode strip formed on the outer side of the printed wire board. An electric power semiconductor element is disposed between the heat transfer plate and the printed wire board, and adhered to the heat transfer plate. A wiring member has one end bonded to a first bonding portion of a main power electrode of the electric power semiconductor element, and the other end is bonded to a second bonding portion. At least part of the second bonding portion is included in a space that extends from the main power electrode to the printed wire board, and the first bonding portion is included in a space that extends from the opening portion.

摘要翻译： 电力半导体装置包括传热板。印刷线路板与传热板间隔开预定间隙。在形成在印刷线路板的外侧的电极条的附近设置有开口部。电力半导体元件设置在传热板和印刷线路板之间，并附着在传热板上。布线构件的一端与电力半导体元件的主电极的第一接合部分接合，另一端接合到第二接合部。第二接合部的至少一部分包括在从主电极延伸到印刷线基板的空间中，并且第一接合部包括在从开口部延伸的空间中。

5.

发明授权
Semiconductor device including a contact clip having protrusions and manufacturing thereof 有权
标题翻译：半导体装置包括具有突起的接触夹和其制造

公开(公告)号：US08987879B2

公开(公告)日：2015-03-24

申请号：US13177110

申请日：2011-07-06

申请人： Ralf Otremba

发明人： Ralf Otremba

IPC分类号： H01L23/495 , H01L23/00 , H01L23/31

CPC分类号： H01L23/49562 , H01L23/3107 , H01L23/49513 , H01L23/49524 , H01L24/06 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/34 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L24/97 , H01L2224/04026 , H01L2224/04042 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/0603 , H01L2224/06181 , H01L2224/2745 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/32245 , H01L2224/33181 , H01L2224/35831 , H01L2224/37011 , H01L2224/37147 , H01L2224/3716 , H01L2224/4007 , H01L2224/40095 , H01L2224/40247 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48599 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48666 , H01L2224/48669 , H01L2224/48671 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/48766 , H01L2224/48769 , H01L2224/48771 , H01L2224/48799 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/48866 , H01L2224/48869 , H01L2224/48871 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/77272 , H01L2224/83191 , H01L2224/83192 , H01L2224/83385 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83801 , H01L2224/8381 , H01L2224/8382 , H01L2224/83986 , H01L2224/84801 , H01L2224/92147 , H01L2224/92157 , H01L2224/92165 , H01L2224/92166 , H01L2224/92246 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01047 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/12042 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1431 , H01L2924/1434 , H01L2924/1461 , H01L2924/181 , H01L2924/19105 , H01L2924/00012 , H01L2924/01023 , H01L2924/01028 , H01L2224/27 , H01L2924/0105 , H01L2924/01049 , H01L2924/01014 , H01L2224/83 , H01L2224/84 , H01L2224/85 , H01L2224/48227 , H01L2924/00 , H01L2924/01005

摘要： A semiconductor device includes a leadframe with a die pad and a first lead, a semiconductor chip with a first electrode, and a contact clip with a first contact area and a second contact area. The semiconductor chip is placed over the die pad. The first contact area is placed over the first lead and the second contact area is placed over the first electrode of the semiconductor chip. A plurality of protrusions extends from each of the first and second contact areas and each of the protrusions has a height of at least 5 μm.

摘要翻译： 半导体器件包括具有管芯焊盘和第一引线的引线框架，具有第一电极的半导体芯片以及具有第一接触区域和第二接触区域的接触夹。将半导体芯片放置在管芯焊盘的上方。第一接触区域放置在第一引线上，并且第二接触区域被放置在半导体芯片的第一电极之上。多个突起从第一和第二接触区域中的每一个延伸，并且每个突起具有至少5μm的高度。

6.

发明授权
Semiconductor packages with lead extensions and related methods 有权
标题翻译：具有导线延伸和相关方法的半导体封装

公开(公告)号：US08674487B2

公开(公告)日：2014-03-18

申请号：US13421570

申请日：2012-03-15

申请人： Lin-Wang Yu , Ping-Cheng Hu , Che-Chin Chang , Yu-Fang Tsai

发明人： Lin-Wang Yu , Ping-Cheng Hu , Che-Chin Chang , Yu-Fang Tsai

IPC分类号： H01L23/495

CPC分类号： H01L24/97 , H01L21/4832 , H01L21/561 , H01L21/568 , H01L23/3128 , H01L23/49541 , H01L23/49548 , H01L23/49579 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/78 , H01L24/83 , H01L24/85 , H01L2224/2919 , H01L2224/29294 , H01L2224/29339 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/78251 , H01L2224/83447 , H01L2224/8346 , H01L2224/8385 , H01L2224/85444 , H01L2224/85455 , H01L2224/85464 , H01L2224/85805 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/83 , H01L2224/45099

摘要： A semiconductor package with a die pad, a die disposed on the die pad, and a first lead disposed about the die pad. The first lead includes a contact element, an extension element extending substantially in the direction of the die pad, and a concave surface disposed between the contact element and the extension element. A second lead having a concave surface is also disposed about the die pad. The first lead concave surface is opposite in direction to the second lead concave surface.

摘要翻译： 具有管芯焊盘的半导体封装，设置在管芯焊盘上的管芯和围绕管芯焊盘设置的第一引线。第一引线包括接触元件，基本上沿芯片焊盘的方向延伸的延伸元件，以及设置在接触元件和延伸元件之间的凹表面。具有凹面的第二引线也围绕芯片焊盘设置。第一引线凹面与第二引线凹面的方向相反。

7.

发明申请
CIRCUIT PACKAGE, AN ELECTRONIC CIRCUIT PACKAGE, AND METHODS FOR ENCAPSULATING AN ELECTRONIC CIRCUIT 审中-公开
标题翻译：电路封装，电子电路封装以及封装电子电路的方法

公开(公告)号：US20130249069A1

公开(公告)日：2013-09-26

申请号：US13425589

申请日：2012-03-21

申请人： Khalil Hosseini , Joachim Mahler , Edward Fuergut

发明人： Khalil Hosseini , Joachim Mahler , Edward Fuergut

IPC分类号： H01L23/495 , H05K1/02 , H05K3/30 , H01L21/56

CPC分类号： H01L23/051 , H01L21/561 , H01L21/568 , H01L23/3107 , H01L23/49524 , H01L23/49562 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/75 , H01L24/83 , H01L24/96 , H01L2224/04105 , H01L2224/27318 , H01L2224/2732 , H01L2224/2745 , H01L2224/291 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/32245 , H01L2224/331 , H01L2224/33181 , H01L2224/753 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83424 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83464 , H01L2224/83801 , H01L2224/8384 , H01L2224/83851 , H01L2224/96 , H01L2924/01327 , H01L2924/12032 , H01L2924/12042 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , Y10T29/49146 , H01L2924/00 , H01L2924/014 , H01L2924/00014 , H01L2224/83

摘要： A circuit package is provided, the circuit package including: an electronic circuit; a metal block next to the electronic circuit; encapsulation material between the electronic circuit and the metal block; a first metal layer structure electrically contacted to at least one first contact on a first side of the electronic circuit; a second metal layer structure electrically contacted to at least one second contact on a second side of the electronic circuit, wherein the second side is opposite to the first side; wherein the metal block is electrically contacted to the first metal layer structure and to the second metal layer structure by means of an electrically conductive medium; and wherein the electrically conductive medium includes a material different from the material of the first and second metal layer structures or has a material structure different from the material of the first and second metal layer structures.

摘要翻译： 提供电路封装，电路封装包括：电子电路; 靠近电子电路的金属块; 电子电路与金属块之间的封装材料; 与所述电子电路的第一侧上的至少一个第一接触电接触的第一金属层结构; 与所述电子电路的第二侧上的至少一个第二接触电接触的第二金属层结构，其中所述第二侧与所述第一侧相对; 其中所述金属块通过导电介质与所述第一金属层结构和所述第二金属层结构电接触; 并且其中所述导电介质包括不同于所述第一和第二金属层结构的材料的材料或具有不同于所述第一和第二金属层结构的材料的材料结构。