公开(公告)号：US6032362A

公开(公告)日：2000-03-07

申请号：US070847

申请日：1998-05-01

申请人： Susumu Okikawa ,  Saburou Kitaguchi

发明人： Susumu Okikawa ,  Saburou Kitaguchi

IPC分类号： H01L23/373 ,  H01L23/433 ,  H01L23/495 ,  B23P15/26

CPC分类号： H01L23/4951 ,  H01L23/3733 ,  H01L23/4334 ,  H01L24/29 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/351 ,  Y10T29/4935 ,  Y10T29/49366 ,  Y10T29/49393 ,  Y10T428/12632 ,  Y10T428/12917

摘要： A heat spreader for a semiconductor device is constituted by an integral laminate of alternatingly stacked and diffusion-bonded Fe--Ni alloy sheets and copper-group metal sheets, the laminate having a one-directional stripe pattern of the Fe--Ni alloy sheets and the copper-group metal sheets, which appears on a planar surface on which a silicon chip is disposed. It is produced by (a) alternatingly stacking Fe--Ni alloy sheets and copper-group metal sheets, (b) hot isostatic-pressing the resulting stack of the metal sheets to form a slab, (c) rolling the slab vertically to the laminating direction of the metal sheets to form an integrated stripe-pattern laminate, and (d) cutting the integrated stripe-pattern laminate to a predetermined shape.

摘要翻译： 用于半导体器件的散热器由交替层叠和扩散接合的Fe-Ni合金片和铜族金属片的整体层压体构成，该层压体具有Fe-Ni合金片的单向条纹图案和 铜基金属片，其出现在其上设置硅芯片的平面上。 （a）交替堆叠Fe-Ni合金板和铜族金属片，（b）对所得到的金属板叠层进行热等静压加工，形成板坯，（c）将板坯垂直轧制成层压 方向形成一体的条纹图案层叠体，（d）将一体的条纹图案层叠体切割成规定的形状。

公开(公告)号：US5844310A

公开(公告)日：1998-12-01

申请号：US694790

申请日：1996-08-09

申请人： Susumu Okikawa ,  Saburou Kitaguchi

发明人： Susumu Okikawa ,  Saburou Kitaguchi

IPC分类号： H01L23/373 ,  H01L23/433 ,  H01L23/495 ,  H01L23/28 ,  H01L23/29

CPC分类号： H01L23/4951 ,  H01L23/3733 ,  H01L23/4334 ,  H01L24/29 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/351 ,  Y10T29/4935 ,  Y10T29/49366 ,  Y10T29/49393 ,  Y10T428/12632 ,  Y10T428/12917

摘要： A heat spreader for a semiconductor device is constituted by an integral laminate of alternatingly stacked and diffusion-bonded Fe-Ni alloy sheets and copper-group metal sheets, the laminate having a one-directional stripe pattern of the Fe-Ni alloy sheets and the copper-group metal sheets, which appears on a planar surface on which a silicon chip is disposed. It is produced by (a) alternatingly stacking Fe-Ni alloy sheets and copper-group metal sheets, (b) hot isostatic-pressing the resulting stack of the metal sheets to form a slab, (c) rolling the slab vertically to the laminating direction of the metal sheets to form an integrated stripe-pattern laminate, and (d) cutting the integrated stripe-pattern laminate to a predetermined shape.

摘要翻译： 用于半导体器件的散热器由交替层叠和扩散接合的Fe-Ni合金片和铜族金属片的整体层压体构成，该层压体具有Fe-Ni合金片的单向条纹图案和 铜基金属片，其出现在其上设置硅芯片的平面上。 （a）交替堆叠Fe-Ni合金板和铜族金属片，（b）对所得到的金属板叠层进行热等静压加工，形成板坯，（c）将板坯垂直轧制成层压 方向形成一体的条纹图案层叠体，（d）将一体的条纹图案层叠体切割成规定的形状。