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公开(公告)号：US4698240A
公开(公告)日：1987-10-06
申请号：US830843
申请日：1986-02-19
申请人： Yusuke Ono , Sachio Ohotoshi , Masaru Yamauchi
发明人： Yusuke Ono , Sachio Ohotoshi , Masaru Yamauchi
CPC分类号： H05K3/285 , C09D133/16 , H01B3/447 , H05K2201/09872 , Y10T428/3154
摘要： A method for moistureproof coating of an electrical product, which comprises applying an organic solution of a polyfluoroalkyl group-containing polymer dissolved in a non-combustible low boiling point organic solvent, to a surface of an electrical product, and drying it by evaporating the low boiling point organic solvent, to form a coating layer of the polyfluoroalkyl group-containing polymer on the surface of the electrical product, wherein said polyfluoroalkyl group-containing polymer is a copolymer of a polymerizable compound having a polyfluoroalkyl group with other polymerizable compound, and the copolymer has a glass transition temperature of not higher than 60.degree. C.
摘要翻译： 一种电气产品的防潮涂覆方法，其特征在于，将溶解在不燃性低沸点有机溶剂中的含有多氟烷基的聚合物的有机溶液涂布在电气产品的表面，通过蒸发低温 沸点有机溶剂，在电气产品的表面形成含有多氟烷基的聚合物的涂层，其中所述含多氟烷基的聚合物是具有多氟烷基的聚合性化合物与其它聚合性化合物的共聚物， 共聚物的玻璃化转变温度不高于60℃
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公开(公告)号：US4615479A
公开(公告)日：1986-10-07
申请号：US703613
申请日：1985-02-21
申请人： Sachio Ohotoshi , Fumio Hase
发明人： Sachio Ohotoshi , Fumio Hase
CPC分类号： H05K3/3452 , B23K35/224 , H05K2201/015 , H05K2201/0166 , H05K2203/0769 , H05K2203/0783 , H05K2203/122 , H05K3/0094 , H05K3/3489
摘要： A method for soldering an electrical product with a soldering flux, wherein an aqueous dispersion or an organic solvent solution of a compound containing a polyfluoroalkyl or polyfluoroether group having from 4 to 21 carbon atoms is applied to a peripheral portion around the soldering portion and dried to form a coating of said compound so as to prevent the soldering flux from penetrating to or depositing on said peripheral portion.
摘要翻译： 一种用助焊剂焊接电气产品的方法，其中将包含具有4至21个碳原子的多氟烷基或多氟醚基团的化合物的水分散体或有机溶剂溶液施加到焊接部分周围的周边部分并干燥至 形成所述化合物的涂层，以防止焊剂渗入或沉积在所述周边部分上。
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