公开(公告)号：US20190215975A1

公开(公告)日：2019-07-11

申请号：US15864583

申请日：2018-01-08

申请人： Samarth Alva ,  Krishnakumar Varadarajan ,  Yogesh Channaiah ,  Prakash Pillai ,  Sagar Pawar ,  Aneesh Tuljapurkar ,  Raghavendra N

发明人： Samarth Alva ,  Krishnakumar Varadarajan ,  Yogesh Channaiah ,  Prakash Pillai ,  Sagar Pawar ,  Aneesh Tuljapurkar ,  Raghavendra N

IPC分类号： H05K5/02 ,  G06F1/16 ,  H01F7/02 ,  G06K7/10

CPC分类号： H05K5/0256 ,  G06F1/1615 ,  G06F1/1656 ,  G06K7/10158 ,  H01F7/02

摘要： Illustrative examples include a system for coupling a first electronic device to a second electronic device. The first electronic device may include a housing having a first engagement surface and a first magnet array. The first engagement surface may be adapted to receive the second electronic device. The second electronic device may include a second magnet array. An actuator coupled to the first magnet array may move the first magnet array relative to the housing and the second magnetic array, to attractively couple or repulsively de-couple the second electronic device from the first electronic device.

公开(公告)号：US20220322569A1

公开(公告)日：2022-10-06

申请号：US17848583

申请日：2022-06-24

申请人： Arnab Sen ,  Samarth Alva ,  Jeff Ku

发明人： Arnab Sen ,  Samarth Alva ,  Jeff Ku

IPC分类号： H05K7/20

摘要： Apparatus, systems, and methods are disclosed for cooling an electronic device. An example electronic device includes a chassis, a first fan including a first outlet and a second outlet, and a second fan having a third outlet and a fourth outlet. In the example electronic device, the first fan is to exhaust air through the first outlet and the second fan is to exhaust air through the third outlet to create a positive pressure in the chassis. The first fan is to exhaust air through the second outlet to an exterior of the chassis, and the second fan is to exhaust air through the fourth outlet to an exterior of the chassis.

公开(公告)号：US20210350952A1

公开(公告)日：2021-11-11

申请号：US17380656

申请日：2021-07-20

申请人： Navneet Kumar Singh ,  Samarth Alva ,  Raghavendra S. Kanivihalli ,  Aiswarya M. Pious ,  Samantha Rao ,  Bijendra Singh

发明人： Navneet Kumar Singh ,  Samarth Alva ,  Raghavendra S. Kanivihalli ,  Aiswarya M. Pious ,  Samantha Rao ,  Bijendra Singh

IPC分类号： H01B7/42 ,  H05K7/20 ,  G06F1/20 ,  G05B15/02

摘要： An air mover external to a mobile computing device provides enhanced cooling to the device by generating forced air delivered to the device via cooling channels connected to openings in the device chassis. If the mobile computing device is passively cooled (is a fanless device), the enhanced cooling can enable the device or device components to operate at a higher power consumption level without exceeding device/component thermal limits or for features that consume high amounts of power (e.g., fast charging) to be incorporated into the device. The air mover can be integrated into or attached to a cable that provides power to the mobile computing device. The air mover can be powered by the cable. The air mover can dynamically adjust the flow rate of the forced air based on device/component performance information (temperature, power consumption, current consumption) or operational state information of the device.

公开(公告)号：US20230125348A1

公开(公告)日：2023-04-27

申请号：US18066271

申请日：2022-12-14

申请人： Shantanu D. Kulkarni ,  Ruander Cardenas ,  Jeff Ku ,  Mark A. MacDonald ,  Samarth Alva ,  Vipin Ghanshamrao Bokade ,  Srinivasarao Konakalla ,  Arnab Sen

发明人： Shantanu D. Kulkarni ,  Ruander Cardenas ,  Jeff Ku ,  Mark A. MacDonald ,  Samarth Alva ,  Vipin Ghanshamrao Bokade ,  Srinivasarao Konakalla ,  Arnab Sen

IPC分类号： F04D29/40 ,  F03G7/06 ,  F04D29/02

摘要： Dynamically modifiable air movers can be modified during operation of a computing system to allow the performance of the fan (air flow, air flow split between exhausts) to be adjusted based on a workload being performed by the system. The physical modifications that an air mover can undergo are physical in nature and include adjusting the placement of one or more cutwaters, expanding or contracting an expandable portion of the fan housing, covering or uncovering an exhaust to provide or remove cooling to memory components, and moving a slidable strip to extend or withdraw from an exhaust. Causing one or more of these physical modifications to be made can be performed in response to the system determining that a temperature, rate of temperature change, power consumption level, rate of power consumption level change of the system or system components exceeds or has dropped below a threshold level.

公开(公告)号：US20220322567A1

公开(公告)日：2022-10-06

申请号：US17848664

申请日：2022-06-24

申请人： Jeff Ku ,  Cora Nien ,  Arnab Sen ,  Samarth Alva ,  Boon Ping Koh ,  Min Suet Lim ,  Arvind S ,  Lance Lin ,  Prakash Kumar Raju ,  Shantanu Kulkarni

发明人： Jeff Ku ,  Cora Nien ,  Arnab Sen ,  Samarth Alva ,  Boon Ping Koh ,  Min Suet Lim ,  Arvind S ,  Lance Lin ,  Prakash Kumar Raju ,  Shantanu Kulkarni

IPC分类号： H05K7/20 ,  G06F1/20

摘要： Apparatus, systems, and methods are disclosed for cooling an electronic device. An example electronic device includes a chassis including a first cover and a second cover. The example electronic device also includes a first looped frame spaced apart from the first cover, a second looped frame spaced apart from the second cover, and a printed circuit board between the first looped frame and the second looped frame.