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公开(公告)号：US06187087B1
公开(公告)日：2001-02-13
申请号：US09412521
申请日：1999-10-05
IPC分类号： C30B102
CPC分类号： C04B35/58071 , B01J3/06 , B01J19/087 , B01J2203/0685 , B22F3/093 , B22F3/105 , B22F2999/00 , B32B18/00 , C04B35/52 , C04B35/528 , C04B35/571 , C04B35/58092 , C04B35/581 , C04B35/645 , C04B37/021 , C04B2235/6567 , C04B2237/343 , C04B2237/365 , C04B2237/366 , C04B2237/403 , C04B2237/405 , C04B2237/567
摘要： A method of bonding a particle material to near theoretical density, includes placing a particle material in a die. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The method can be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts. The method may further be applied to repair a damaged or worn substrate or part, coat a particle onto a substrate, and grow single crystals of a particle material.
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2.发明授权公开(公告)号：US06309591B1
公开(公告)日：2001-10-30
申请号：US09412518
申请日：1999-10-05
IPC分类号： B22F314
CPC分类号： B22F3/093 , B22F3/14 , B22F2999/00 , C04B35/64 , Y10S29/031 , Y10S977/775 , Y10S977/776 , B22F3/105
摘要： An apparatus for bonding a particle material to near theoretical density, includes a chamber, a punch and die assembly for supporting a particle material, plungers for applying shear and/or axial pressures, and a power supply for applying a current. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The apparatus may be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts. The apparatus may further be used to repair a damaged or worn substrate or part, coat a particle onto a substrate, and grow single crystals of a particle material.
摘要翻译： 用于将颗粒材料粘合到接近理论密度的装置包括用于支撑颗粒材料的腔室，冲头和模具组件，用于施加剪切和/或轴向压力的柱塞以及用于施加电流的电源。 在第一阶段中，将约1至20,000安培的脉冲电流施加到颗粒材料预定时间段，并且基本同时施加约5-50MPa的剪切力。 在第二阶段中，将大约小于1至2,000MPa的轴向压力施加到颗粒材料预定时间段，并且基本同时施加约1至20,000安培的稳定电流。 被申请;被应用。 该装置可用于将金属，陶瓷，金属间和复合材料直接从前体或元素颗粒材料粘合到近净形状，而不需要合成材料。 该方法还可以用于进行反应性材料的燃烧合成，随后固化或接合到近净形状的制品或部件。 该装置还可用于修复损坏或磨损的基底或部件，将颗粒涂覆到基底上，并生长颗粒材料的单晶。
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公开(公告)号：US06270718B1
公开(公告)日：2001-08-07
申请号：US09412520
申请日：1999-10-05
IPC分类号： B22F700
CPC分类号： C04B35/58092 , B01J3/06 , B01J3/062 , B01J19/087 , B01J2203/062 , B01J2203/0655 , B01J2203/0685 , B22F3/105 , B22F2999/00 , B30B15/34 , B32B18/00 , C04B35/52 , C04B35/571 , C04B35/58071 , C04B35/581 , C04B35/645 , C04B35/6455 , C04B37/001 , C04B2235/6567 , C04B2237/343 , C04B2237/365 , Y10S29/031 , Y10S977/777 , B22F3/14 , B22F3/093
摘要： A method of bonding a particle material to near theoretical density, includes placing a particle material in a die. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The method can be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts. The method may further be applied to repair a damaged or worn substrate or part, coat a particle onto a substrate, and grow single crystals of a particle material.
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公开(公告)号：US06183690B2
公开(公告)日：2001-02-06
申请号：US09412519
申请日：1999-10-05
IPC分类号： B22F312
CPC分类号： C04B35/58092 , B01J3/06 , B01J3/062 , B01J19/087 , B01J2203/062 , B01J2203/0655 , B01J2203/0685 , B22F3/105 , B22F2999/00 , B30B15/34 , B32B18/00 , C04B35/52 , C04B35/571 , C04B35/58071 , C04B35/581 , C04B35/645 , C04B35/6455 , C04B37/001 , C04B2235/6567 , C04B2237/343 , C04B2237/365 , Y10S29/031 , Y10S977/777 , B22F3/14 , B22F3/093
摘要： A method of bonding a particle material to near theoretical density, includes placing a particle material in a die. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The method can be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts. The method may further be applied to repair a damaged or worn substrate or part, coat a particle onto a substrate, and grow single crystals of a particle material.
摘要翻译： 将颗粒材料粘合到接近理论密度的方法包括将颗粒材料放置在模具中。 在第一阶段中，将约1至20,000安培的脉冲电流施加到颗粒材料预定时间段，并且基本同时施加约5-50MPa的剪切力。 在第二阶段中，将大约小于1至2,000MPa的轴向压力施加到颗粒材料预定时间段，并且基本同时施加约1至20,000安培的稳定电流。 被申请;被应用。 该方法可用于将金属，陶瓷，金属间化合物和复合材料直接从前体或元素颗粒材料粘合到近净形状，而不需要合成材料。 该方法还可以用于进行反应性材料的燃烧合成，随后固化或接合到近净形状的制品或部件。 该方法可以进一步应用于修复损坏或磨损的基底或部件，将颗粒涂覆到基底上，并生长颗粒材料的单晶。
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5.发明授权
公开(公告)号：US5989487A
公开(公告)日：1999-11-23
申请号：US274878
申请日：1999-03-23
CPC分类号： B22F3/093 , B22F3/14 , C04B35/64 , B22F2999/00 , Y10S29/031 , Y10S977/775 , Y10S977/776
摘要： An apparatus for bonding a particle material to near theoretical density, includes a chamber, a punch and die assembly for supporting a particle material, plungers for applying shear and/or axial pressures, and a power supply for applying a current. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The apparatus may be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts. The apparatus may further be used to repair a damaged or worn substrate or part, coat a particle onto a substrate, and grow single crystals of a particle material.
摘要翻译： 用于将颗粒材料粘合到接近理论密度的装置包括用于支撑颗粒材料的腔室，冲头和模具组件，用于施加剪切和/或轴向压力的柱塞以及用于施加电流的电源。 在第一阶段中，将约1至20,000安培的脉冲电流施加到颗粒材料预定时间段，并且基本同时施加约5-50MPa的剪切力。 在第二阶段中，将大约小于1至2,000MPa的轴向压力施加到颗粒材料预定时间段，并且基本同时施加约1至20,000安培的稳定电流。 被申请;被应用。 该装置可用于将金属，陶瓷，金属间和复合材料直接从前体或元素颗粒材料粘合到近净形状，而不需要合成材料。 该方法还可以用于进行反应性材料的燃烧合成，随后固化或接合到近净形状的制品或部件。 该装置还可用于修复损坏或磨损的基底或部件，将颗粒涂覆到基底上，并生长颗粒材料的单晶。
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公开(公告)号：US6001304A
公开(公告)日：1999-12-14
申请号：US223964
申请日：1998-12-31
IPC分类号： B01J3/06 , B01J19/08 , B22F3/105 , C04B35/52 , C04B35/58 , C04B35/581 , C04B35/645 , C04B37/00 , B22F3/12
CPC分类号： C04B35/58092 , B01J19/087 , B01J3/06 , B01J3/062 , B22F3/105 , B30B15/34 , B32B18/00 , C04B35/52 , C04B35/571 , C04B35/58071 , C04B35/581 , C04B35/645 , C04B35/6455 , C04B37/001 , B01J2203/062 , B01J2203/0655 , B01J2203/0685 , B22F2999/00 , C04B2235/6567 , C04B2237/343 , C04B2237/365 , Y10S29/031 , Y10S977/777
摘要： A method of bonding a particle material to near theoretical density, includes placing a particle material in a die. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps, is applied. The method can be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts. The method may further be applied to repair a damaged or worn substrate or part, coat a particle onto a substrate, and grow single crystals of a particle material.
摘要翻译： 将颗粒材料粘合到接近理论密度的方法包括将颗粒材料放置在模具中。 在第一阶段中，将约1至20,000安培的脉冲电流施加到颗粒材料预定时间段，并且基本同时施加约5-50MPa的剪切力。 在第二阶段中，将大约小于1至2,000MPa的轴向压力施加到颗粒材料预定时间段，并且基本同时施加约1至20,000安培的稳定电流。 该方法可用于将金属，陶瓷，金属间化合物和复合材料直接从前体或元素颗粒材料粘合到近净形状，而不需要合成材料。 该方法还可以用于进行反应性材料的燃烧合成，随后固化或接合到近净形状的制品或部件。 该方法可以进一步应用于修复损坏或磨损的基底或部件，将颗粒涂覆到基底上，并生长颗粒材料的单晶。
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