公开(公告)号：US07546941B2

公开(公告)日：2009-06-16

申请号：US11746686

申请日：2007-05-10

申请人： Hai Ju No ,  Hee Sung Kim ,  Jung Bum Woo ,  Sang Nam Go ,  Tae Hyung Kim

发明人： Hai Ju No ,  Hee Sung Kim ,  Jung Bum Woo ,  Sang Nam Go ,  Tae Hyung Kim

IPC分类号： B23K20/08

CPC分类号： H01R43/0256 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/15311 ,  H01L2924/181 ,  H01R43/0235 ,  H05K3/3478 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/082 ,  Y10T29/49222 ,  Y10T29/53191 ,  Y10T29/53204 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A ball attaching apparatus for respectively attaching solder balls onto a plurality of ball lands of a material which has mold caps formed between the ball lands. The apparatus includes an indexer on which the material is seated and fixed; a holder located above the indexer such that it can be raised and lowered; an attachment plate installed on a lower surface of the holder, having projections at positions corresponding to the mold caps of the material, and defined with grooves at positions corresponding to the ball lands of the material, in which the solder balls are placed; and eject pins arranged in the respective grooves of the attachment plate for conveying and dropping the solder balls through introduction and removal of vacuum.

摘要翻译： 一种球附着装置，用于将焊球分别安装在具有形成在球台之间的模具帽的材料的多个球台上。 该装置包括一个分度器，材料就座并固定在该分度器上; 位于分度器上方的支架，使其能够升高和降低; 安装在所述保持器的下表面上的安装板，在与所述材料的所述模具盖相对应的位置处具有突出部，并且在与所述材料的所述球焊台相对应的位置处限定有凹槽，所述焊接球放置在所述焊盘中; 以及布置在附接板的相应凹槽中的销，用于通过引入和去除真空来输送和滴落焊球。

公开(公告)号：US20080222888A1

公开(公告)日：2008-09-18

申请号：US11746686

申请日：2007-05-10

申请人： Hai Ju No ,  Hee Sung Kim ,  Jung Bum Woo ,  Sang Nam Go ,  Tae Hyung Kim

发明人： Hai Ju No ,  Hee Sung Kim ,  Jung Bum Woo ,  Sang Nam Go ,  Tae Hyung Kim

IPC分类号： B23P19/00 ,  H01R43/00

CPC分类号： H01R43/0256 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/15311 ,  H01L2924/181 ,  H01R43/0235 ,  H05K3/3478 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/082 ,  Y10T29/49222 ,  Y10T29/53191 ,  Y10T29/53204 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A ball attaching apparatus for respectively attaching solder balls onto a plurality of ball lands of a material which has mold caps formed between the ball lands. The apparatus includes an indexer on which the material is seated and fixed; a holder located above the indexer such that it can be raised and lowered; an attachment plate installed on a lower surface of the holder, having projections at positions corresponding to the mold caps of the material, and defined with grooves at positions corresponding to the ball lands of the material, in which the solder balls are placed; and eject pins arranged in the respective grooves of the attachment plate for conveying and dropping the solder balls through introduction and removal of vacuum.

摘要翻译： 一种球附着装置，用于将焊球分别安装在具有形成在球台之间的模具帽的材料的多个球台上。 该装置包括一个分度器，材料就座并固定在该分度器上; 位于分度器上方的支架，使其能够升高和降低; 安装在所述保持器的下表面上的安装板，在与所述材料的所述模具盖相对应的位置处具有突出部，并且在与所述材料的所述球焊台相对应的位置处限定有凹槽，所述焊接球放置在所述焊盘中; 以及布置在附接板的各个槽中的销，用于通过引入和去除真空来输送和滴落焊球。