摘要:
An integrated circuit containing a memory array with memory bits and a differential sense amplifier for reading the logic state of the memory bits. The integrated circuit also contains redundant vias which are in the via path that couples a bitline to Vss. Moreover, an integrated circuit containing a FLASH memory bit with redundant vias in the via path from the bitline to Vss.
摘要:
A method of achieving reduced modulation range requirement in a Digitally Controlled Oscillator (DCO) which is deployed as part of a DRP (Digital Radio Processor) and tuned to a tuning frequency range having operating-channel center-frequencies, wherein phase difference between consecutive samples is termed as FCW (Frequency Control Word), uses the steps of digitally modifying and limiting the FCW so that the FCW does not exceed known FCW thresholds, e.g., chosen from π/2, π/4, π/8, and redistributing the FCWs while maintaining a cumulative sum of phases and without significant EVM (Error Vector Magnitude) degradation. The FCW threshold can be chosen arbitrarily and need not be in the form of π/2n. The method uses a FCW limiting algorithm which reduces supply voltage sensitivity of the DCO and enables significant reduction in area of capacitor bank which would be otherwise needed.
摘要:
An integrated circuit containing a memory array with memory bits and a differential sense amplifier for reading the logic state of the memory bits. The integrated circuit also contains redundant vias which are in the via path that couples a bitline to Vss. Moreover, an integrated circuit containing a FLASH memory bit with redundant vias in the via path from the bitline to Vss.
摘要:
A method for fabricating a flash memory device having a self-aligned source includes providing a semiconductor substrate having a source region separated from a drain region by a channel region. The method also includes forming an isolation structure in the semiconductor substrate that crosses the source, drain, and channel regions of the semiconductor substrate. The method also includes forming a continuous stack structure outwardly from the channel region of the semiconductor substrate and the isolation structure. The method includes depositing a bottom anti-reflective layer over the semiconductor substrate, the isolation structure and the stack structure to substantially uniformly planarize the semiconductor substrate and the isolation structure. The method further includes depositing a photoresist layer over select portions of the bottom anti-reflective layer and the continuous stack structure to form a self-aligned source pattern using a photo mask. The method includes etching the isolation structure and the bottom anti-reflective layer corresponding to the self aligned source pattern using a low selectivity etch process to remove a portion of the isolation structure and etching a remaining portion of the isolation structure using high selectivity etch process.
摘要:
A method of fabricating a semiconductor device having a memory array (9) that includes a source line (24) is provided. The method of forming the source line (24) may include providing a semiconductor substrate (52) having a source region (60) separated from a drain region (62) by a channel region (64). An isolation structure (70) may be formed in the semiconductor substrate (52). The isolation structure (70) may cross the source region (60), the drain region (62), and the channel region (64) of the semiconductor substrate (52). An isolation dielectric material (78) may be formed within the isolation structure (70). A continuous stack structure (50) may be formed outwardly from the channel region (64) of the semiconductor substrate (52) and the isolation structure (70). A first photomask (100) may be formed outwardly from the continuous stack structure (50) and the semiconductor substrate (52). The first photomask (100) may expose a strip region (102) of the semiconductor substrate (52) and the isolation structure (70). The isolation dielectric material (78) may be removed from the exposed portion the isolation structure (70) to expose the semiconductor substrate (52). A dopant may be implanted into the exposed semiconductor substrate (52) to form the source line (24) in the semiconductor device.
摘要:
A receiver in a packet based communication system includes a programmable block and a detection block that detects at least one of an operating condition of the receiver and a protocol condition of the communication system. Further, the receiver includes a control circuit coupled to the programmable block that controls the programmable block to transition to a set of radio modes according to at least one of the operating condition and the protocol condition.
摘要:
An integrated circuit containing a memory array with memory bits and a differential sense amplifier for reading the logic state of the memory bits. The integrated circuit also contains redundant vias which are in the via path that couples a bitline to Vss. Moreover, an integrated circuit containing a FLASH memory bit with redundant vias in the via path from the bitline to Vss.
摘要:
An integrated circuit containing a memory array with memory bits and a differential sense amplifier for reading the logic state of the memory bits. The integrated circuit also contains redundant vias which are in the via path that couples a bitline to Vss. Moreover, an integrated circuit containing a FLASH memory bit with redundant vias in the via path from the bitline to Vss.
摘要:
A multi-carrier (MC) receiver receives a multi-carrier signal containing data symbols as well as pilot symbols. The MC receiver estimates a carrier frequency offset in a downconverted base-band multi-carrier signal in the frequency domain based on deviations of one or more characteristics of the pilot signals from predetermined values, and corrects for the offset in the time domain. In an embodiment, a second order phase locked loop (PLL) estimates the phase of the pilot signals to determine the carrier frequency offset. Changes in pilot phases caused due to the time domain correction are cancelled to allow the PLL to minimize deviations from the lock position.
摘要:
An improved apparatus and process for detecting aberrations in production process operations is provided. In one embodiment, operations of a plasma etch reactor (10) are monitored to detect aberrations in etching operations. A reference end-point trace (EPT) is defined (62) for the etch process. Regions are defined in the reference end-point trace (70) and characteristics and tolerances for each region are defined (72-80). The etcher is run and an actual EPT is obtained (82) from the running of the etcher. The actual EPT is analyzed to identify proposed regions of the actual EPT (86), and then the proposed regions of the actual EPT are matched with regions of the reference EPT (96). The system employs a series of heuristic functions in matching proposed regions of the actual EPT with regions of the reference EPT. Characteristics of the matched regions of the actual end-point trace are compared (66) with characteristics of the corresponding regions of the reference end-point trace to determine whether aberrations have occurred during the etch process. The invention provides for an improved matching and improved comparison of actual end-point traces with reference end-point traces.