公开(公告)号：US5613858A

公开(公告)日：1997-03-25

申请号：US683179

申请日：1996-07-18

申请人： Scott H. Estes ,  N. Deepak Swamy

发明人： Scott H. Estes ,  N. Deepak Swamy

IPC分类号： H01H1/12 ,  H01R29/00 ,  H05K1/00 ,  H05K1/18 ,  H05K3/22 ,  H05K3/40 ,  H05K3/42

CPC分类号： H01R12/526 ,  H01R12/523 ,  H01R29/00 ,  H05K3/222 ,  H05K3/403 ,  H05K1/0286 ,  H05K2201/09645 ,  H05K2201/10053 ,  H05K3/429 ,  Y10T29/49165

摘要： A circuit board structure is provided with a compact switching system for selectively connecting and disconnecting a pair of electrically conductive lead portions thereof. The switching system includes a through hole formed in the substrate portion and extending between its opposite sides. The interior side surface of the through hole is plated with an electrically conductive metal material. Portions of the plating are then removed to leave a mutually spaced plurality of plating segments within the through hole. Each plating segment is connected to an end of one of the circuit board leads. A switch structure is provided and has a contact portion which is insertable into the through hole and movable therein, into and out of engagement with a pair of the spaced plating segments, to selectively and electrically couple the circuit board leads associated with the plating segment pair.

摘要翻译： 电路板结构设置有用于选择性地连接和断开其一对导电引线部分的紧凑型开关系统。 切换系统包括形成在基板部分中并在其相对侧之间延伸的通孔。 通孔的内侧表面镀有导电金属材料。 然后去除电镀的部分以在通孔内留下相互间隔开的多个镀层段。 每个电镀段连接到一个电路板引线的一端。 提供了一种开关结构，并且具有可插入到通孔中并在其中可移动的接触部分，与一对间隔开的电镀部分接合，以便选择性地和电耦合与电镀部分对相关联的电路板引线 。