公开(公告)号：US5613858A

公开(公告)日：1997-03-25

申请号：US683179

申请日：1996-07-18

申请人： Scott H. Estes ,  N. Deepak Swamy

发明人： Scott H. Estes ,  N. Deepak Swamy

IPC分类号： H01H1/12 ,  H01R29/00 ,  H05K1/00 ,  H05K1/18 ,  H05K3/22 ,  H05K3/40 ,  H05K3/42

CPC分类号： H01R12/526 ,  H01R12/523 ,  H01R29/00 ,  H05K3/222 ,  H05K3/403 ,  H05K1/0286 ,  H05K2201/09645 ,  H05K2201/10053 ,  H05K3/429 ,  Y10T29/49165

摘要： A circuit board structure is provided with a compact switching system for selectively connecting and disconnecting a pair of electrically conductive lead portions thereof. The switching system includes a through hole formed in the substrate portion and extending between its opposite sides. The interior side surface of the through hole is plated with an electrically conductive metal material. Portions of the plating are then removed to leave a mutually spaced plurality of plating segments within the through hole. Each plating segment is connected to an end of one of the circuit board leads. A switch structure is provided and has a contact portion which is insertable into the through hole and movable therein, into and out of engagement with a pair of the spaced plating segments, to selectively and electrically couple the circuit board leads associated with the plating segment pair.

摘要翻译： 电路板结构设置有用于选择性地连接和断开其一对导电引线部分的紧凑型开关系统。 切换系统包括形成在基板部分中并在其相对侧之间延伸的通孔。 通孔的内侧表面镀有导电金属材料。 然后去除电镀的部分以在通孔内留下相互间隔开的多个镀层段。 每个电镀段连接到一个电路板引线的一端。 提供了一种开关结构，并且具有可插入到通孔中并在其中可移动的接触部分，与一对间隔开的电镀部分接合，以便选择性地和电耦合与电镀部分对相关联的电路板引线 。

公开(公告)号：US5587885A

公开(公告)日：1996-12-24

申请号：US275854

申请日：1994-07-15

申请人： N. Deepak Swamy

发明人： N. Deepak Swamy

IPC分类号： H05K1/11 ,  H05K3/06 ,  H05K3/32 ,  H05K3/42 ,  H05K3/46 ,  H05K7/02

CPC分类号： H05K1/114 ,  H05K3/325 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/10393 ,  H05K2201/10734 ,  H05K2203/0723 ,  H05K3/062 ,  H05K3/426 ,  H05K3/4644

摘要： To facilitate the registered connection between a laminated multi chip module and an associated multi-tiered circuit board, spaced series of vias are formed transversely through the circuit board and module substrates between their opposite first and second sides. Gold plated BGA leads, offset from the module substrate vias, are formed on the first module substrate side on multi-layer plating structures disposed thereon and extending along the module via interior side surfaces. A spaced series of relatively shallow, circularly cross-sectioned socket areas, offset from the circuit board vias, are also formed on the first side of the circuit board. The sockets have diameters slightly larger that those of the generally ball-shaped BGA leads of the multi chip module, and are positioned on the same centerline pattern as the leads. After the circuit board vias and sockets are formed, a multi-layer metallic coating is deposited on their interiors and around their open ends on the first board side, with the coating being extended across the first board side between associated socket and via pairs. Like the BGA leads, this coating has a gold outer layer. The multi chip module is placed against the first circuit board side in a manner causing the BGA leads to partially enter the plated sockets, and a resilient clamping structure is used to releasably hold the BGA leads in their associated metal-coated sockets.

摘要翻译： 为了便于层叠多芯片模块和相关联的多层电路板之间的注册连接，间隔开的一系列通孔横向穿过电路板和模块基板在其相对的第一和第二侧之间形成。 在模块基板通孔上偏移的镀金BGA引线在其上设置的多层电镀结构上形成在第一模块基板侧，并且经由内侧表面沿模块延伸。 在电路板的第一侧上还形成有间隔开的一系列比电路板通孔偏离的较浅的圆形横截面的插座区域。 插座的直径略大于多芯片模块的大致球形的BGA引线的直径，并且位于与引线相同的中心线图案上。 在形成电路板通孔和插座之后，多层金属涂层沉积在其内部并且围绕其第一板侧的开口端，涂层在相关联的插座和通孔对之间跨越第一板侧延伸。 像BGA导线一样，这种涂层具有金外层。 多芯片模块以使得BGA导致部分进入电镀插座的方式放置在第一电路板侧，并且使用弹性夹持结构来将BGA引线可释放地保持在其相关联的金属涂覆插座中。

公开(公告)号：US5935244A

公开(公告)日：1999-08-10

申请号：US786057

申请日：1997-01-21

申请人： N. Deepak Swamy ,  Robert L. McMahan

发明人： N. Deepak Swamy ,  Robert L. McMahan

IPC分类号： G06F1/00 ,  G06F1/16 ,  G06F21/00 ,  G06F12/14 ,  G06F3/00 ,  G06F13/00 ,  G06F15/00

CPC分类号： G06F1/1684 ,  G06F1/1616 ,  G06F1/169 ,  G06F21/34 ,  G06F21/88

摘要： The present invention provides a personal computer system for receiving and retaining data and capable of securing data retained within the system against unauthorized access. More particularly, the system includes a computer including a processor and a detachable input/output (I/O) device that functions as a conventional computer interface when docked to the computer and wherein the computer system enters a suspend mode when the detachable I/O device is detached from the computer whereby the system data is secured against unauthorized access. A security module controls access to at least certain levels of data retained within the system by distinguishing between the detachable I/O device docked to the computer and the detachable I/O device detached from the computer. A docking station is coupled to the processor and is detachably coupled to the detachable I/O device. The detachable I/O device is, for example, a detachable trackpad or trackball I/O device and the docking station includes a sensor for detecting when the detachable I/O device is docked to the computer.

摘要翻译： 本发明提供了一种个人计算机系统，用于接收和保留数据，并且能够保护保留在系统内的数据免遭未经授权的访问。 更具体地说，该系统包括一计算机，该计算机包括处理器和可拆卸的输入/输出（I / O）设备，当与计算机对接时，其可用作传统的计算机接口，并且其中当可拆卸的I / O 设备与计算机分离，由此系统数据被保护以防止未经授权的访问。 安全模块通过区分停靠在计算机上的可拆卸I / O设备与从计算机分离的可拆卸I / O设备来控制对系统中保留的至少某些级别的数据的访问。 对接站耦合到处理器并且可拆卸地耦合到可拆卸I / O设备。 可拆卸I / O设备例如是可拆卸的触控板或轨迹球I / O设备，并且对接站包括用于检测何时可拆卸的I / O设备与计算机对接的传感器。

公开(公告)号：US6035350A

公开(公告)日：2000-03-07

申请号：US787500

申请日：1997-01-21

申请人： N. Deepak Swamy ,  Robert L. McMahan

发明人： N. Deepak Swamy ,  Robert L. McMahan

IPC分类号： G06F1/16 ,  G06F3/033

CPC分类号： G06F1/1616 ,  G06F1/169

摘要： A trackpad or other input/output device is detachable from a computer and adapted with a remote communication functionality using radio frequency (RF) or infrared (IR) technologies, thereby facilitating the performance of slide presentations and other graphic displays. A remote presentation capability allows a computer user to conveniently address a group from a position at a suitable location, such as a podium, that is removed from the computer system. A remote interface includes a trackpad or other input/output device and activation buttons. The input/output device is housed in a small removable enclosure which is adapted for docking into an aperture in the computer. The input/output device is rechargeable with a charger installed into the computer so that the input/output device is recharged during docking with the computer. A portable computer includes a removable input/output (I/O) device that functions as a conventional computer interface when docked to the portable computer and functions as a remote control for controlling operations of the portable computer when the I/O device is removed from the portable computer. The removable I/O device includes one or more activation buttons for usage in controlling operations such as the display operations of an audio-visual presentation. When the I/O device is removed from the portable computer, the I/O device communicates with the portable computer using a remote communication technique such as radio frequency (RF) or infrared (IR) remote communication techniques. The removable I/O device include rechargeable batteries that power the I/O device while the device is used remotely. The rechargeable batteries are charged by the portable computer when the I/O device is returned to the portable computer and docked to the portable computer.

摘要翻译： 触控板或其他输入/输出设备可从计算机拆卸并且使用射频（RF）或红外（IR）技术来适应远程通信功能，从而便于幻灯片演示和其他图形显示的性能。 远程呈现功能允许计算机用户从位于从计算机系统移除的合适位置（例如讲台）上的位置方便地寻址组。 远程接口包括触控板或其他输入/输出设备和激活按钮。 输入/输出设备容纳在适于对接到计算机中的孔中的小型可移除外壳中。 输入/输出设备可以用计算机中安装的充电器进行充电，以便在与计算机对接期间对输入/输出设备进行充电。 便携式计算机包括可拆卸的输入/输出（I / O）设备，当与便携式计算机对接时用作常规的计算机接口，并且当I / O设备被移除时用作用于控制便携式计算机的操作的遥控器 便携式电脑。 可移动I / O设备包括用于控制诸如视听呈现的显示操作的操作的一个或多个激活按钮。 当从便携式计算机移除I / O设备时，I / O设备使用诸如射频（RF）或红外（IR）远程通信技术的远程通信技术与便携式计算机进行通信。 可移动I / O设备包括可在远程使用设备时为I / O设备供电的可充电电池。 当I / O设备返回到便携式计算机并且与便携式计算机对接时，可充电电池由便携式计算机充电。

公开(公告)号：US5613033A

公开(公告)日：1997-03-18

申请号：US374275

申请日：1995-01-18

申请人： N. Deepak Swamy ,  Tom J. Kocis

发明人： N. Deepak Swamy ,  Tom J. Kocis

IPC分类号： H01L23/498 ,  H01L25/065 ,  H05K7/20 ,  H01R23/72 ,  H01R9/09 ,  H05K1/11 ,  H05K7/02

CPC分类号： H01L25/0657 ,  H01L23/49827 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48229 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312

摘要： An interconnect system is provided in which one or more laminated modules embodying electrical devices can be stacked in a three dimensional configuration upon a printed circuit board. One or more electrical devices is surface mounted to a recessed area at the upper surface of each laminated module, and each laminated module includes male pins and female sockets. The male pins can be releasibly engaged within sockets upon a printed circuit board. Additionally, the male pins of one laminated module can be engaged within female sockets of another laminated module in building-block fashion. Conductive paths are formed entirely through the laminated module between respective sockets and pins. The conductive paths are arranged in a less dense fashion than bond locations adjacent each electrical device. The bond locations are therefore offset from conductive paths to provide fan-out and redistribution features.

摘要翻译： 提供了一种互连系统，其中体现电气装置的一个或多个层叠模块可以以三维结构堆叠在印刷电路板上。 一个或多个电气设备被表面安装到每个层叠模块的上表面处的凹陷区域，并且每个层压模块包括阳销和阴插槽。 阳销可以可释放地接合在印刷电路板上的插座内。 此外，一个层叠模块的阳销可以以构成块的方式接合在另一层压模块的阴插座内。 导电路径完全通过层叠模块形成在相应的插座和销之间。 导电路径以比邻近每个电气设备的接合位置更不密集的方式布置。 因此，接合位置偏离导电路径以提供扇出和再分配特征。

公开(公告)号：US5420378A

公开(公告)日：1995-05-30

申请号：US274872

申请日：1994-07-14

申请人： H. Scott Estes ,  Michael Ohlinger ,  N. Deepak Swamy

发明人： H. Scott Estes ,  Michael Ohlinger ,  N. Deepak Swamy

IPC分类号： H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/42 ,  H05K9/00 ,  H05K1/18 ,  H05K7/04

CPC分类号： H05K9/0039 ,  H05K1/0215 ,  H05K1/115 ,  H05K3/3452 ,  H05K2201/09572 ,  H05K2201/0979 ,  H05K2201/099 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K3/325 ,  H05K3/429

摘要： To facilitate a grounding connection between a circuit board and a chassis upon which it is to be mounted, a spaced series of unlined mounting holes are formed through the substrate portion of the circuit board between its top and bottom sides, and spaced series of grounding vias are formed through the substrate and positioned in a circular arrays around each of the mounting holes. Annular layers of a metallic plating material are formed on the opposite sides of the circuit board substrate, around the top and bottom ends of the unlined mounting holes, with the plating material being extended along the interior side surfaces of the vias between associated top and bottom annular plating material layers. Using solder masks placed on the opposite sides of the circuit board substrate, circular arrays of solder pads are formed on the outer side surfaces of the annular plating layers, with each solder pad array being interdigitated with the vias in one of the circular arrays thereof, and being horizontally offset from the vias. The bottom side of the circuit board is secured against a side of the chassis by extending metal mounting screws through the unlined mounting holes of the circuit board and threading the screws into corresponding holes in the chassis to press the bottom side solder pads of the circuit board against the chassis.

摘要翻译： 为了便于电路板与要安装在其上的底盘之间的接地连接，在其顶侧和底侧之间通过电路板的基板部分形成间隔的一系列无内衬的安装孔，并且间隔开的一系列接地通孔 通过基板形成并围绕每个安装孔定位成圆形阵列。 在电路板基板的相对侧上，围绕无衬里的安装孔的顶端和底端形成金属电镀材料的环形层，电镀材料沿相连的顶部和底部之间的通孔的内侧表面延伸 环形电镀层。 使用放置在电路板基板的相对侧上的焊接掩模，在环形镀层的外侧表面上形成圆形阵列的焊盘，每个焊盘阵列与其中一个圆形阵列中的通孔相互交错， 并且与通孔水平地偏移。 通过将金属安装螺钉穿过电路板的无衬里安装孔，将电路板的底部固定在机箱的一侧，并将螺丝拧入机箱中相应的孔，以将电路板的底面焊盘 对着底盘。

公开(公告)号：US5571996A

公开(公告)日：1996-11-05

申请号：US375327

申请日：1995-01-17

申请人： N. Deepak Swamy ,  Victor K. Pecone ,  Darrell Slupek

发明人： N. Deepak Swamy ,  Victor K. Pecone ,  Darrell Slupek

IPC分类号： H05K1/02 ,  H05K7/14 ,  H05K1/18 ,  H05K1/14

CPC分类号： H05K1/0248 ,  H05K1/0228 ,  H05K7/1429 ,  H05K2201/044 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/09709 ,  H05K2201/09718

摘要： A circuit board is provided having a plurality of vias and uniformly spaced connector stubs arranged upon one or both outer surfaces of the control board. Sets of trace conductors are formed within the control board between the vias. The trace conductors are arranged in two planes within the control board, wherein trace conductors within one plane are laterally offset from trace conductors in the other plane. Laterally offset trace conductors allow close spacing of the trace conductor planes while maximizing the spacing between trace conductors and corresponding reference conductors also placed within the control board. Additionally, the trace conductors are serpentine-shaped when viewed from a perspective perpendicular to the planar surface of the control board. The serpentine shape, in conjunction with carefully controlled spacing between planes of trace conductors as well as between the trace conductor planes and reference conductors, provides high impedance trace conductors in a limited space area necessary to meet SCSI specifications.

摘要翻译： 设置有布置在控制板的一个或两个外表面上的多个通孔和均匀间隔的连接器短截线的电路板。 在通孔之间的控制板内形成导线组。 迹线导体布置在控制板内的两个平面中，其中一个平面内的迹线导体在另一个平面中横向偏离迹线导体。 横向偏移迹线导体允许迹线导体平面的紧密间隔，同时最大化迹线导体和也放置在控制板内的相应参考导体之间的间隔。 此外，当从垂直于控制板的平面表面的视角观察时，迹线导体是蛇形的。 蛇纹形状与跟踪导体的平面之间以及轨迹导体平面和参考导体之间的仔细控制的间距结合，在满足SCSI规范所需的有限空间区域内提供高阻抗迹线导体。

公开(公告)号：US5571608A

公开(公告)日：1996-11-05

申请号：US523567

申请日：1995-09-05

申请人： N. Deepak Swamy

发明人： N. Deepak Swamy

IPC分类号： H05K1/00 ,  H05K3/42 ,  H05K3/46 ,  B32B9/00

CPC分类号： H05K3/4641 ,  H05K1/0287 ,  H05K1/0298 ,  H05K2201/068 ,  H05K2201/09309 ,  H05K2201/09718 ,  H05K2201/09945 ,  H05K3/429 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/249994 ,  Y10T428/2804 ,  Y10T428/31765

摘要： An embedded core laminate including a conductive reference plane interposed between two insulation layers, and further interposed between two conductive layers. The assembly is laminated using standard temperature and pressure laminating procedures. Holes for interconnect vias are preferably drilled into the reference plane before laminating. The resulting embedded core laminate has three conductive layers with relatively uniform separation, insuring improved impedance control on each PCB (printed circuit board). Since uniform separation is maintained from one PCB to another, multiple PCBs connected together using embedded core laminates according to the present invention allows minimum cross-talk and characteristic impedance variations from one PCB to the next. The material comprising the conductive layers are preferably chosen with a CTE to match that of semiconductor die to protect solder joints of mounted components from thermal stress, improving reliability of SMT devices and allowing direct chip attach methods to be implemented. Balanced PCBs having five, seven and other odd numbers of conductive layers are available using an embedded core laminate material according to the present invention.

摘要翻译： 一种嵌入式芯层叠体，其包括介于两个绝缘层之间的导电参考平面，并且还插入在两个导电层之间。 使用标准温度和压力层压程序层压组件。 用于互连通孔的孔优选在层压之前钻入参考平面中。 所得到的嵌入式芯层压板具有三个具有相对均匀分离的导电层，确保了在每个PCB（印刷电路板）上改进的阻抗控制。 由于从一个PCB到另一个PCB保持均匀分离，所以使用根据本发明的嵌入式芯层压板连接在一起的多个PCB允许从一个PCB到下一个PCB的最小串扰和特征阻抗变化。 包括导电层的材料优选地被选择为具有与半导体管芯的CTE匹配的CTE以保护安装的部件的焊点免受热应力，提高SMT器件的可靠性并允许实现直接芯片附接方法。 使用根据本发明的嵌入式芯层压材料可获得具有五个，七个等奇数导电层的平衡PCB。

公开(公告)号：US5847951A

公开(公告)日：1998-12-08

申请号：US769644

申请日：1996-12-16

申请人： Alan E. Brown ,  N. Deepak Swamy

发明人： Alan E. Brown ,  N. Deepak Swamy

IPC分类号： H01L25/16 ,  H01L25/18 ,  H05K1/18

CPC分类号： H01L25/165 ,  H01L25/18 ,  H01L2224/05553 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L24/45 ,  H01L2924/01028 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011

摘要： An integrated circuit package comprising an integrated circuit device and a voltage converter circuit both embedded within the package. The voltage converter circuit is configured to convert a standard supply voltage to an operating voltage as required by the integrated circuit device. Also, discrete embedded capacitors may be included to capacitively couple power and ground connections of the integrated circuit device and thus reduce voltage variations during operation of the integrated circuit device. The integrated circuit may package include one or more layers. One or more discrete components or integrated circuits are mounted to one or more layers within the package. Internal conductors on one or more of the layers are configured to connect the components forming the voltage converter circuit. Internal conductors also form connections to the integrated circuit device. The integrated circuit device and voltage converter circuit may be coated with an encapsulant for added protection. The integrated circuit package with embedded voltage converter may be manufactured with processes similar to those used for traditional integrated circuit packages and printed circuit board assemblies.

摘要翻译： 一种集成电路封装，包括嵌入在封装内的集成电路器件和电压转换器电路。 电压转换器电路被配置为将标准电源电压转换为集成电路器件所要求的工作电压。 此外，可以包括离散嵌入式电容器以电容耦合集成电路器件的电源和接地连接，并因此减小集成电路器件工作期间的电压变化。 集成电路可以包装包括一个或多个层。 一个或多个分立组件或集成电路安装到封装内的一个或多个层。 一个或多个层上的内部导体被配置为连接形成电压转换器电路的部件。 内部导体也形成与集成电路器件的连接。 集成电路器件和电压转换器电路可以涂覆有用于增加保护的密封剂。 具有嵌入式电压转换器的集成电路封装可以用类似于传统集成电路封装和印刷电路板组件的工艺制造。

公开(公告)号：US5541368A

公开(公告)日：1996-07-30

申请号：US276221

申请日：1994-07-15

申请人： N. Deepak Swamy

发明人： N. Deepak Swamy

IPC分类号： H01L23/498 ,  H01L23/538 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/34 ,  H05K3/42 ,  H05K1/09 ,  H05K1/03

CPC分类号： H05K3/0094 ,  H01L23/49816 ,  H01L23/5384 ,  H05K3/3473 ,  H01L2924/0002 ,  H05K1/114 ,  H05K2203/0361 ,  H05K2203/043 ,  H05K2203/054 ,  H05K2203/0574 ,  H05K2203/1394 ,  H05K3/062 ,  H05K3/3452 ,  H05K3/426 ,  H05K3/427

摘要： To facilitate the reworking of a multi-tiered circuit board and a laminated multi chip module, a chip module apparatus having a substrate portion is provided. The chip module has first and second opposite sides with vias extending therethrough. Deposited on both sides of the module by conventional processes is a layer of copper. A first mask is applied to the copper layer to expose a copper, electrical circuit pattern. A second mask having holes therein that are offset from the vias is placed over the first mask by conventional processes. Formed on at least one of the chip module's side in the second mask's holes are a spaced series of an solder BGAs, which have melting point temperatures substantially greater than the phase transition temperature of the chip module's substrate portion. The BGA's are formed on the chip module by an electrochemical plating process.

摘要翻译： 为了便于多层电路板和叠层多芯片模块的返工，提供了具有基板部分的芯片模块装置。 芯片模块具有第一和第二相对侧，通孔延伸穿过其中。 通过常规方法沉积在模块的两侧是一层铜。 第一掩模被施加到铜层以暴露铜，电路图案。 通过常规工艺在第一掩模上放置具有从孔中偏移的孔的第二掩模。 在第二掩模孔中的芯片模块侧的至少一个上形成有间隔的一系列焊料BGA，其熔点温度基本上大于芯片模块的基板部分的相变温度。 BGA通过电化学电镀工艺在芯片模块上形成。