公开(公告)号：US06986196B2

公开(公告)日：2006-01-17

申请号：US10241518

申请日：2002-09-12

申请人： Seiichi Terui

发明人： Seiichi Terui

IPC分类号： B23P19/00

CPC分类号： H05K13/0417 ,  Y10T29/49432 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

摘要： A method of supplying suction nozzles with electric components supplied from feeders each of which is operable to feed the electric components to its component-supply portion and which are arranged in a direction intersecting a direction of feeding of the components, the suction nozzles being held by nozzle holders supported by a movable member and arranged in the direction arrangement of the feeders, the movable member being movable to permit each suction nozzle to hold the component by suction, wherein a distance between axes of adjacent ones of the selected suction nozzles in the direction of arrangement of the feeders is adjusted, and/or a component-supply position of each feeder at which the component is located after each feeding action of the feeder is adjusted, so that the selected suction nozzles are aligned with the components at the component-supply positions, and the selected suction nozzles are operated to simultaneously hold the components located at the component-supply positions. Also disclosed is an electric-component mounting system operable to practice the method and mount the electric components on a circuit substrate.

公开(公告)号：US6012222A

公开(公告)日：2000-01-11

申请号：US40590

申请日：1998-03-18

申请人： Koichi Asai ,  Kunio Oe ,  Seiichi Terui

发明人： Koichi Asai ,  Kunio Oe ,  Seiichi Terui

IPC分类号： B23P21/00 ,  B25J15/06 ,  H05K13/04 ,  H05K3/30

CPC分类号： H05K13/0408 ,  Y10S29/044 ,  Y10T29/4913 ,  Y10T29/53052 ,  Y10T29/53178 ,  Y10T29/53191

摘要： A mounting head, a mounting apparatus, and a mounting method which are capable of contacting an electronic component with a substrate with a small contact load and mounting the component on the substrate, are provided. A suction device 120 is fit on a splined axis portion 118 of a support shaft 84 via a ball spline 126, is biased downward by a first spring 130, and is biased upward by a second spring 134. A suction nozzle 124 is attached to a nozzle holder 122 by engaging engagement ridges 172 of sheet springs 166 fixed to the suction nozzle 124 with engagement grooves 144 of the nozzle holder 122, respectively. Prior to the mounting of electronic components 178, a relationship between contact load and position of lift 28 is obtained, and a position to which the lift 28 is moved downward for mounting each electronic component 178 is pre-determined. Thus, each component 178 is contacted with a printed circuit board with an appropriate load. Each component 178 is contacted with the circuit board with a small load, by removing the self weight of the suction device 120 owing to the biasing action of the second spring 134 and reducing the frictional resistance produced between the suction device 120 and the axis member 84 owing to the provision of the ball spline 126.

摘要翻译： 提供了能够使电子部件与具有小的接触负载的基板接触并将部件安装在基板上的安装头，安装装置和安装方法。 抽吸装置120通过滚珠花键126装配在支撑轴84的花键轴部分118上，并被第一弹簧130向下偏压，并被第二弹簧134向上偏压。吸嘴124附接到 通过将固定到吸嘴124的片弹簧166的接合脊172分别与喷嘴保持器122的接合槽144分别接合而形成喷嘴保持器122。 在安装电子部件178之前，获得了接触载荷与升程28的位置之间的关系，并且预先确定升降机28向下移动以安装每个电子部件178的位置。 因此，每个部件178与具有适当负载的印刷电路板接触。 由于第二弹簧134的偏置动作，通过去除吸引装置120的自重而减小吸引装置120与轴构件84之间产生的摩擦阻力，使各构件178与电路板以小负载接触 由于提供球形花键126。

公开(公告)号：US08276264B2

公开(公告)日：2012-10-02

申请号：US12613129

申请日：2009-11-05

申请人： Kouji Shimizu ,  Seiichi Terui

发明人： Kouji Shimizu ,  Seiichi Terui

IPC分类号： H05K13/04

CPC分类号： H05K13/0069 ,  H05K13/0061 ,  H05K13/021 ,  H05K13/08 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53191

摘要： A component mounting apparatus includes two board transfer devices, a component supply unit, a component placing device, a setting unit, and a controller. Until production of the urgent boards is instructed, the two board transfer devices and the component placing device mount components on the regular boards in accordance with a first mounting program stored by the controller. When production of the urgent boards is instructed, a regular board is unloaded from the other board transfer device, which has been set by the setting unit to transfer urgent boards, the transfer way width of the other board transfer device is adjusted to the width of the urgent boards, and the other board transfer device and the component placing device are controlled so that component mountings on the urgent boards are performed on the other board transfer device in accordance with a second mounting program stored by the controller.

摘要翻译： 组件安装装置包括两个板传送装置，部件供应单元，部件放置装置，设置单元和控制器。 在按照由控制器存储的第一安装程序之前，指示紧急板的生产，两个板转移装置和部件放置装置安装部件在普通板上。 当指示紧急板的生产时，由设置单元设置的另一个板转移装置卸载普通板，以传送紧急板，另一个板转移装置的传送宽度被调整为 紧急板和其他板转移装置和部件放置装置被控制，使得紧急板上的部件安装件根据由控制器存储的第二安装程序在另一板转移装置上执行。

公开(公告)号：US20100050426A1

公开(公告)日：2010-03-04

申请号：US12613129

申请日：2009-11-05

申请人： Kouji SHIMIZU ,  Seiichi TERUI

发明人： Kouji SHIMIZU ,  Seiichi TERUI

IPC分类号： B23P19/00

CPC分类号： H05K13/0069 ,  H05K13/0061 ,  H05K13/021 ,  H05K13/08 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53191

摘要： Disclosed is a component mounting apparatus including two board transfer devices for respectively transferring circuit boards in respective directions parallel to each other and a component placing device provided with at least one component placing head for mounting the components on the boards positioned at predetermined mounting positions on the board transfer devices. Where two component placing heads are provided, they pick up components from two component supply devices and mount the picked-up components respectively on the boards loaded by the two board transfer devices. In this way, the component placing device mounts components simultaneously or alternately on two boards loaded respectively by the two board transfer devices. While one of the two board transfer devices is transferring a board thereon or while the one board transfer device is being adjusted to alter its transfer way width, one of the component placing heads for performing component mountings at the one board transfer device helps the other component placing head in performing component mountings at the other board transfer device. In a modified form, either one of the two transfer devices is used as bypass conveyor or return conveyor.

摘要翻译： 公开了一种部件安装装置，包括用于分别在相互平行的方向上传送电路板的电路板传送装置和设置有至少一个部件放置头的部件放置装置，用于将部件安装在位于 电路板传输设备。 在提供两个组件放置头的地方，它们从两个组件供应装置拾取组件，并将拾取组件分别安装在由两个板传送装置加载的板上。 以这种方式，组件放置装置将组件同时或交替地安装在分别由两个板传送装置加载的两个板上。 虽然两个电路板传送装置中的一个在其上传输电路板，或者当一个电路板传送装置被调整以改变其传送方式宽度时，用于在一个电路板传送装置执行部件安装的部件放置头之一有助于另一部件 将头部放置在另一个板传送装置上执行部件安装。 在改进形式中，两个传送装置中的任一个被用作旁路输送机或返回输送机。

公开(公告)号：US06971158B2

公开(公告)日：2005-12-06

申请号：US10306001

申请日：2002-11-29

申请人： Seiichi Terui

发明人： Seiichi Terui

IPC分类号： H05K13/04 ,  H05K13/00 ,  H05K13/02 ,  B23P19/00

CPC分类号： H05K13/0061 ,  Y10T29/49131 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53191

摘要： An electric-component mounting system including component-mounting devices arranged in an array and each having a component-holding head for holding an electric component, and a head-moving device to move the head, and a substrate-transferring device to move at least one substrate on which electric components are to be mounted, and wherein the substrate-transferring device stops each substrate at at least one stop position which corresponds to at least one of the component-mounting devices and at which operations of the component-mounting devices are concurrently performed on the at least one substrate. The substrate-transferring device includes a first transferring device to move each substrate along a path parallel to the array of the component-mounting devices and stop each substrate at least once during its movement along the path, and a second transferring device having a substrate-holding device to hold each substrate at each stop position and a holding-device moving device to reciprocate the substrate-holding device by a maximum distance smaller than a maximum distance of movement of each substrate by the first transferring device, so that each substrate is moved together with the substrate-holding device.

摘要翻译： 一种电气部件安装系统，包括以阵列布置的每个具有用于保持电气部件的部件保持头的部件安装装置和用于移动头部的头部移动装置，以及基板传送装置，至少移动 一个基板，其上安装电气部件，并且其中基板传送装置在与至少一个部件安装装置对应的至少一个停止位置停止每个基板，并且部件安装装置的哪个操作是 同时在至少一个基底上进行。 衬底转移装置包括：第一转移装置，用于沿着平行于部件安装装置的阵列的路径移动每个衬底，并且在其沿着路径的运动期间停止每个衬底至少一次;以及第二转移装置， 保持装置，用于将每个基板保持在每个停止位置;保持装置移动装置，使基板保持装置往复运动，该最大距离小于由第一转印装置的每个基板的最大移动距离，使得每个基板移动 与基板保持装置一起。

公开(公告)号：US5758410A

公开(公告)日：1998-06-02

申请号：US627993

申请日：1996-04-04

申请人： Koichi Asai ,  Kunio Oe ,  Seiichi Terui

发明人： Koichi Asai ,  Kunio Oe ,  Seiichi Terui

IPC分类号： B23P21/00 ,  B25J15/06 ,  H05K13/04 ,  H05K3/30 ,  H05K13/00

CPC分类号： H05K13/0408 ,  Y10S29/044 ,  Y10T29/4913 ,  Y10T29/53052 ,  Y10T29/53178 ,  Y10T29/53191

摘要： A mounting head, a mounting apparatus, and a mounting method which are capable of contacting an electronic component with a substrate with a small contact load and mounting the component on the substrate, are provided. A suction device 120 is fit on a splined axis portion 118 of a support shaft 84 via a ball spline 126, is biased downward by a first spring 130, and is biased upward by a second spring 134. A suction nozzle 124 is attached to a nozzle holder 122 by engaging engagement ridges 172 of sheet springs 166 fixed to the suction nozzle 124 with engagement grooves 144 of the nozzle holder 122, respectively. Prior to the mounting of electronic components 178, a relationship between contact load and position of lift 28 is obtained, and a position to which the lift 28 is moved downward for mounting each electronic component 178 is pre-determined. Thus, each component 178 is contacted with a printed circuit board with an appropriate load. Each component 178 is contacted with the circuit board with a small load, by removing the self weight of the suction device 120 owing to the biasing action of the second spring 134 and reducing the frictional resistance produced between the suction device 120 and the axis member 84 owing to the provision of the ball spline 126.

摘要翻译： 提供了能够使电子部件与具有小的接触负载的基板接触并将部件安装在基板上的安装头，安装装置和安装方法。 抽吸装置120通过滚珠花键126装配在支撑轴84的花键轴部分118上，并被第一弹簧130向下偏压，并被第二弹簧134向上偏压。吸嘴124附接到 通过将固定到吸嘴124的片弹簧166的接合脊172分别与喷嘴保持器122的接合槽144分别接合而形成喷嘴保持器122。 在安装电子部件178之前，获得了接触载荷与升程28的位置之间的关系，并且预先确定升降机28向下移动以安装每个电子部件178的位置。 因此，每个部件178与具有适当负载的印刷电路板接触。 通过由于第二弹簧134的偏置动作而去除吸引装置120的自重，并且减小了抽吸装置120与轴构件84之间产生的摩擦阻力，使每个部件178以小的载荷与电路板接触 由于提供球形花键126。

公开(公告)号：US20120227255A1

公开(公告)日：2012-09-13

申请号：US13477690

申请日：2012-05-22

申请人： Kouji Shimizu ,  Seiichi Terui

发明人： Kouji Shimizu ,  Seiichi Terui

IPC分类号： B23P19/00

CPC分类号： H05K13/0069 ,  H05K13/0061 ,  H05K13/085 ,  H05K13/0853 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53191

摘要： A component mounting apparatus includes two board transfer devices each for transferring boards, at least one component supply device for supplying plural kinds of components to be mounted on the boards, and a component placing device including at least one component placing head for picking up the supplied components to mount the picked-up components on the boards and at least one head moving mechanism for moving the at least one component placing head in at least two directions parallel to a surface of the board. The apparatus also includes a controller that operates one component placing head to mount components alternately on two boards transferred by the two board transfer devices to respective component mounting positions and operates two component placing heads to mount components in parallel on two boards transferred by the two boards transfer devices to the respective component mounting positions.

摘要翻译： 一种部件安装装置，包括用于传送板的两个板传送装置，用于提供要安装在板上的多种部件的至少一个部件供应装置，以及包括至少一个用于拾取所提供的部件的组件放置头的部件放置装置 用于将拾取部件安装在板上的部件和至少一个头部移动机构，用于在平行于板的表面的至少两个方向上移动至少一个部件放置头。 该装置还包括控制器，其操作一个组件放置头，以将组件交替地安装在由两个板传送装置传送到相应部件安装位置的两个板上，并且操作两个组件放置头，以将组件并联安装在由两个板传送的两个板上 将设备传送到相应的部件安装位置。

公开(公告)号：US07540367B2

公开(公告)日：2009-06-02

申请号：US10549288

申请日：2004-04-05

申请人： Seiichi Terui ,  Takehisa Ishikawa

发明人： Seiichi Terui ,  Takehisa Ishikawa

IPC分类号： B65G47/57 ,  B65G47/56

CPC分类号： H05K13/021

摘要： A tray component supply apparatus comprises a main body side replenishment tray holding section 50 provided at an upper part over a tray stocker 40 of an apparatus main body 30 and a tray discharge section 60 provided at a lower part under the tray stocker 40 of the apparatus main body 30. The tray stocker 40 is provided with a tray stocker side replenishment tray holding section 80 on a top plate 44 thereof and empty tray holding members 85 on a bottom plate 43 thereof.

摘要翻译： 托盘部件供给装置包括主体侧补充托盘保持部50，该主体侧补充托盘保持部50设置在设备主体30的托盘储存器40上方的上部，以及设置在该装置的托盘储存器40下方的托盘排出部60 托盘储存器40在其顶板44上设置有托盘存放器侧补充托盘保持部80，在其底板43上设置有空托盘保持部件85。

公开(公告)号：US20060169412A1

公开(公告)日：2006-08-03

申请号：US10549288

申请日：2004-04-05

申请人： Seiichi Terui ,  Takehisa Ishikawa

发明人： Seiichi Terui ,  Takehisa Ishikawa

IPC分类号： B29C65/00

CPC分类号： H05K13/021

摘要： A tray component supply apparatus comprises a main body side replenishment tray holding section 50 provided at an upper part over a tray stocker 40 of an apparatus main body 30 and a tray discharge section 60 provided at a lower part under the tray stocker 40 of the apparatus main body 30. The tray stocker 40 is provided with a tray stocker side replenishment tray holding section 80 on a top plate 44 thereof and empty tray holding members 85 on a bottom plate 43 thereof.

摘要翻译： 托盘部件供给装置包括主体侧补充托盘保持部50，该主体侧补充托盘保持部50设置在设备主体30的托盘储存器40上方的上部，以及设置在该装置的托盘储存器40下方的托盘排出部60 主体30。 托盘储存器40在其顶板44上设置有托盘储盘器侧补充托盘保持部80，在其底板43上设置有空托盘保持构件85。