公开(公告)号：US20110248408A1

公开(公告)日：2011-10-13

申请号：US13064437

申请日：2011-03-24

申请人： Seung Wook Park ,  Young Do Kweon ,  Jang Hyun Kim ,  Tae Seok Park ,  Su Jeong Suh ,  Jae Gwon Jang ,  Nam Jung Kim ,  Seung Kyu Lim ,  Kwang Keun Lee

发明人： Seung Wook Park ,  Young Do Kweon ,  Jang Hyun Kim ,  Tae Seok Park ,  Su Jeong Suh ,  Jae Gwon Jang ,  Nam Jung Kim ,  Seung Kyu Lim ,  Kwang Keun Lee

IPC分类号： H01L23/488 ,  H01L21/441

CPC分类号： H01L21/50 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19015 ,  H01L2924/19041 ,  Y10T436/170769 ,  H01L2224/13099

摘要： There are provided a package substrate and a method fabricating thereof. The package substrate includes: a wafer having a cavity formed in an upper surface thereof, the cavity including a chip mounting region; a first wiring layer and a second wiring layer formed to be spaced apart from the first wiring layer, which are formed to be extended in the cavity; a chip positioned in the chip mounting region to be connected to the first wiring layer and the second wiring layer; a through-hole penetrating through the wafer and a via filled in the through-hole; and at least one electronic device connected to the via. Accordingly, a package substrate capable of having a passive device having a predetermined capacity embedded therein, while reducing a pattern size and increasing a component mounting density, and a method fabricating thereof may be provided.

摘要翻译： 提供了封装基板及其制造方法。 封装基板包括：具有形成在其上表面中的空腔的晶片，所述空腔包括芯片安装区域; 形成为与所述第一布线层间隔开的第一布线层和第二布线层，所述第一布线层和第二布线层形成为在所述空腔中延伸; 位于所述芯片安装区域中以连接到所述第一布线层和所述第二布线层的芯片; 穿透晶片的通孔和填充在通孔中的通孔; 以及连接到通孔的至少一个电子设备。 因此，可以提供能够具有嵌入其中的预定容量的无源器件的封装基板，同时减少图案尺寸和增加部件安装密度，以及其制造方法。