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公开(公告)号：US4861646A
公开(公告)日：1989-08-29
申请号：US85950
申请日：1987-08-13
申请人： Eric A. Barringer , Sheldon I. Lieberman , Mark S. Schmidt , James D. Hodge , Richard Waack , Donald J. Kelley , Brian W. Saxton , William C. Gruber
发明人： Eric A. Barringer , Sheldon I. Lieberman , Mark S. Schmidt , James D. Hodge , Richard Waack , Donald J. Kelley , Brian W. Saxton , William C. Gruber
CPC分类号： C03C14/004 , H01L21/4807 , H01L23/15 , A61B90/20 , C03C2214/04 , C03C2214/08 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/092 , H05K3/4676 , Y10T428/24926 , Y10T428/252
摘要： Glass-ceramic packages for integrated circuits containing multi-layer, interconnected thick film wiring patterns are obtained by co-sintering a glass-ceramic composite and copper, silver, palladium, gold, based conductors at temperatures not exceeding about 1000.degree. C. The dielectric systems include composites of borosilicate glasses and crystalline fillers which are fabricated by either mixing glass frit and the filler or by a sol-gel coating process. The package is fabricated using a tape specifically designed for clean binder burnout in a reducing atmosphere at low temperatures and also for superior mechanical and thermal properties. Metallization, applied by the thick film screening technique, utilized herein has glass-ceramic bonding agents designed to promote adhesion yet maintain the desired electrical properties and post-processing characteristics.
摘要翻译： 通过在不超过约1000℃的温度下共烧烧玻璃 - 陶瓷复合材料和铜，银，钯，金基导体，获得含有多层互连厚膜布线图案的集成电路的玻璃陶瓷封装。 系统包括通过混合玻璃料和填料或通过溶胶 - 凝胶涂覆方法制造的硼硅酸盐玻璃和结晶填料的复合材料。 该包装使用专门设计用于在低温还原气氛中清洁粘合剂焚烧的带材以及优异的机械和热性能来制造。 通过本文使用的厚膜筛选技术应用的金属化具有玻璃 - 陶瓷粘合剂，其被设计用于促进粘合，同时保持所需的电性能和后处理特性。
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公开(公告)号：US4788046A
公开(公告)日：1988-11-29
申请号：US85078
申请日：1987-08-13
CPC分类号： C03C14/004 , H01L21/4807 , A61B90/20 , C03C2214/04 , C03C2214/08 , H05K1/0306 , H05K1/092 , H05K3/4676
摘要： This invention relates to glass-ceramic packages for integrated circuits containing multi-layer, interconnected thick film wiring patterns obtained by co-sintering a glass-ceramic composite and copper, silver, palladium or gold based conductors at temperatures not exceeding about 1000.degree. C. The dielectric systems disclosed herein contains composites of borosilicate glasses and crystalline fillers which are fabricated by either mixing glass frit and the filler or by a sol-gel coating process.
摘要翻译： 本发明涉及用于集成电路的玻璃 - 陶瓷封装，其包含通过在不超过约1000℃的温度下共烧烧玻璃 - 陶瓷复合物和铜，银，钯或金基导体而获得的多层互连厚膜布线图案。 本文公开的介电系统包含通过混合玻璃料和填料或通过溶胶 - 凝胶涂覆工艺制造的硼硅酸盐玻璃和结晶填料的复合物。
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公开(公告)号：US3998660A
公开(公告)日：1976-12-21
申请号：US584075
申请日：1975-06-05
申请人： Sheldon I. Lieberman
发明人： Sheldon I. Lieberman
CPC分类号： H01M6/14 , C01B17/4584
摘要： Thionyl chloride electrolyte having less than about 1 ppm water contamination is prepared by mixing dry thionyl chloride solvent with sulfuryl chloride electrolyte having less than about 1 ppm water contamination and then removing the sulfuryl chloride.
摘要翻译： 通过将干燥的亚硫酰氯溶剂与具有小于约1ppm水污染物的磺酰氯电解质混合，然后除去磺酰氯来制备具有小于约1ppm水污染物的亚硫酰氯电解质。
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公开(公告)号：US4894273A
公开(公告)日：1990-01-16
申请号：US207394
申请日：1988-06-16
CPC分类号： H05K1/092 , C22C32/0031 , H05K1/0306 , H05K3/40 , Y10S428/901 , Y10T428/24322 , Y10T428/24917 , Y10T428/24926
摘要： Bonding additives for refractory metallization compositions allow for circuit traces having good resistivities and adhesion values in excess of 6 kpsi, generally between about 10 and 20 kpsi. The inks are provided in formulations devoid of a glass component, and are suitable for co-sintering circuit traces and vias with 96% alumina substrates, and especially for 99% alumina substrates. Suitable bonding additives are the oxides of molybdenum, tungsten, niobium, manganese, yttrium, and titanium, or mixtures of such oxides.
摘要翻译： 用于难熔金属化组合物的粘合添加剂允许具有良好电阻率和粘附值超过6kpsi（通常在约10至20kpsi）之间的电路迹线。 油墨在没有玻璃组分的配方中提供，并且适用于与96％氧化铝底物，特别是99％氧化铝底物共烧结电路痕迹和通孔。 合适的粘合添加剂是钼，钨，铌，锰，钇和钛的氧化物，或这些氧化物的混合物。
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