摘要:
Glass-ceramic packages for integrated circuits containing multi-layer, interconnected thick film wiring patterns are obtained by co-sintering a glass-ceramic composite and copper, silver, palladium, gold, based conductors at temperatures not exceeding about 1000.degree. C. The dielectric systems include composites of borosilicate glasses and crystalline fillers which are fabricated by either mixing glass frit and the filler or by a sol-gel coating process. The package is fabricated using a tape specifically designed for clean binder burnout in a reducing atmosphere at low temperatures and also for superior mechanical and thermal properties. Metallization, applied by the thick film screening technique, utilized herein has glass-ceramic bonding agents designed to promote adhesion yet maintain the desired electrical properties and post-processing characteristics.
摘要:
This invention relates to glass-ceramic packages for integrated circuits containing multi-layer, interconnected thick film wiring patterns obtained by co-sintering a glass-ceramic composite and copper, silver, palladium or gold based conductors at temperatures not exceeding about 1000.degree. C. The dielectric systems disclosed herein contains composites of borosilicate glasses and crystalline fillers which are fabricated by either mixing glass frit and the filler or by a sol-gel coating process.
摘要:
Bonding additives for refractory metallization compositions allow for circuit traces having good resistivities and adhesion values in excess of 6 kpsi, generally between about 10 and 20 kpsi. The inks are provided in formulations devoid of a glass component, and are suitable for co-sintering circuit traces and vias with 96% alumina substrates, and especially for 99% alumina substrates. Suitable bonding additives are the oxides of molybdenum, tungsten, niobium, manganese, yttrium, and titanium, or mixtures of such oxides.
摘要:
A tungsten paste suitable for co-sintering with 98+% alumina substrate can be produced by adding selected compositions of glass to the paste. Circuit packages produced in accordance with the present invention exhibit superior thermal conductivity, low shrinkage variability, and smoother and more homogeneous surface finish. A preferred embodiment of the invention utilizes a substrate comprising narrow size range alumina powder, thus yielding lower sintering temperature and further improvements in shrinkage variability and surface finish.
摘要:
Metallization, applied by the thick film screening technique, utilized herein has glass-ceramic bonding agents designed to promote adhesion yet maintain the desired electrical properties and post-processing characteristics.
摘要:
A method, apparatus and assembly related to solid oxide fuel cell interconnects is disclosed. In its broadest embodiment, the invention contemplates a multi-layered ceramic interconnect having integrated flow fields and electrical connections. The method of making this interconnect includes judicious selection of materials, formation of appropriate apertures for the flow fields and electrical connectors, and the joining of the layers through a firing and/or sealing process.
摘要:
A welding flux binder is provided which comprises an alkali-alkaline earth silicate hydrolyzed and polymerized from tetraalkylorthosilicate, Si(OR).sub.4, wherein R is --CH.sub.3, --C.sub.2 H.sub.5, or --C.sub.3 H.sub.7, and alkali and alkaline earth salts. The reaction product of the tetraalkylorthosilicate and metal salts, M.sub.2 O.M'O.SiO.sub.2, where M is potassium, sodium or lithium, and M' is magnesium, calcium or barium, has several advantages as a welding flux binder. For example, it is not hygroscopic and can be prepared at low temperatures since the alkali ions lower the melting point for viscous sintering of the gel phase. Because of the low temperature processing, a wide variety of solid additives with low thermal stability, such as some metals, carbonates, and fluorides, can be incorporated into the flux. Other dopants may also be readily incorporated into the binder during the gel phase.
摘要翻译:提供一种焊剂粘合剂,其包含由四正烷基原硅酸酯Si(OR)4,其中R是-CH 3,-C 2 H 5或-C 3 H 7,以及碱金属和碱土金属盐水解和聚合的碱金属 - 碱土金属硅酸盐。 作为焊剂粘合剂,原硅酸四烷基酯和金属盐M2O.M'O.SiO2(M为钾,钠或锂,M'为镁,钙或钡)的反应产物具有几个优点。 例如,它不是吸湿性的并且可以在低温下制备,因为碱离子降低了凝胶相粘性烧结的熔点。 由于低温处理,可以将多种具有低热稳定性的固体添加剂,例如一些金属,碳酸盐和氟化物掺入助熔剂中。 其他掺杂剂也可以在凝胶相期间容易地结合到粘合剂中。
摘要:
Substrates consisting of at least 98% narrow size distribution ceramic particles are co-sinterable with metallized paste to which selected compositions of glass have been added. Substrates produced in accordance with the present invention exhibit superior thermal conductivity, low shrinkage variability, and smoother and more homogeneous surface finish.
摘要:
A ceramic element for a sootblower element is disclosed in which the element is manufactured by winding a ceramic fiber around a mandrel and subsequently densifying the composite using a sol-gel process. Separate elements are coupled together using a ceramic coupling member. Ceramic nozzle bodies are inserted into the elements. The sootblower tubes disclosed herein can withstand greater temperatures and more corrosive environments than currently used metallic lance tubes, thus enabling the sootblower element to be permanently installed within a boiler and eliminating the need for a retracting element type sootblower.
摘要:
A welding flux binder and welding flux comprising the reaction product of a hydrolyzed and polymerized organometallic compound selected from the group consisting of metal alkoxides including tetraalkylorthosilicate, tetraalkylorthotitanate, tetraalkylorthozirconate and trialkylaluminate, metal esters, and metal oxalates. The organometallic compound is hydrolyzed and then polymerized to form a gel glass phase. Alkali and alkaline earth salts are added to stabilize and reduce the viscosity of the gel. The resulting welding flux binder and flux are non-hygroscopic and have a high fired strength.