Fabrication method of bipolar transistor
    2.
    发明授权
    Fabrication method of bipolar transistor 失效
    双极晶体管的制造方法

    公开(公告)号:US4874712A

    公开(公告)日:1989-10-17

    申请号:US249401

    申请日:1988-09-26

    摘要: Present invention relates to the fabrication method of the bipolar transistor.With this method the emitter of high-concentrated n-type is contacted closely to the extrinsic base of high-concentrated p-type.This structure is obtained by making the emitter of the bipolar transistor be self- aligned by the side wall under-cut of the nitride layer using double layers of the low temperature oxide and the nitride layer.

    摘要翻译: 本发明涉及双极晶体管的制造方法。 采用这种方法,高浓度n型发射极与高浓度p型的外在基极紧密接触。 通过使用双层低温氧化物和氮化物层,通过使氮化物层的侧壁被切割来使双极晶体管的发射极自对准,从而获得这种结构。